744 results about "Photosensitivity" patented technology

The invention provides anthracene methyl phenothiazine for a photosensitive resin composition, and relates to the field of photopolymerization. The invention further comprises a photosensitive resin composition containing the anthracene methyl phenothiazine, a photosensitive dry film containing the anthracene methyl phenothiazine and application of the photosensitive resin composition and the photosensitive dry film. The anthracene methyl phenothiazine disclosed by the invention has photosensitivity, can be used as a photosensitizer in the photosensitive resin composition, can improve the adhesive force of the photosensitive resin composition on various metal surfaces, and has the characteristic of low migration; the method can be widely applied to the photo-curing fields of dry films, paints, coatings, printing ink, forming materials and the like.

The invention provides triazole anthracene methyl formate for a photosensitive resin composition, and relates to the field of photopolymerization. The invention also comprises a photosensitive resin composition containing the triazole anthracene methyl formate, a photosensitive dry film containing the triazole anthracene methyl formate, and applications of the photosensitive resin composition and the photosensitive dry film. The triazole formic acid anthracene methyl ester disclosed by the invention has photosensitivity, can be used as a photosensitizer in the photosensitive resin composition, can improve the adhesive force of the photosensitive resin composition on various metal surfaces, and has the characteristic of low migration; the method can be widely applied to the photo-curing fields of dry films, paints, coatings, printing ink, forming materials and the like.

The invention provides anthracene methylthiosalicylic acid for a photosensitive resin composition, and relates to the field of photopolymerization. The invention also comprises a photosensitive resin composition containing the anthracene methylthio-salicylic acid, a photosensitive dry film containing the anthracene methylthio-salicylic acid, and applications of the photosensitive resin composition and the photosensitive dry film. The anthracene methyl thiosalicylic acid has photosensitivity and can be used as a photosensitizer in the photosensitive resin composition; the migration characteristic is low; the photosensitive resin composition has good solubility in conventional monomers, and the degree of freedom of formula design of the photosensitive resin composition is greatly improved; the developing agent also has very good solubility in alkali liquor, so that developing garbage can be greatly reduced, and the product yield is improved; the adhesive force of the photosensitive resin composition on various metal surfaces can be improved; the method can be widely applied to the photo-curing fields of dry films, paints, coatings, printing ink, forming materials and the like.

The invention relates to the technical field of biomedicine, discloses mutant photo-induced ion channel ChR-2 protein, and further discloses a nucleic acid construct, an expression vector, a cell, related application and a computer model. The light-sensitive channel ChR2 protein mutant obtained by the invention has stronger light current, and the light-sensitive capability of the light-sensitive channel ChR2 protein mutant is at least improved by 100 times; besides, the invention also obtains a nucleotide sequence for coding the light-sensitive channel ChR2 protein mutant, constructs a recombinant expression vector, and obtains the light-sensitive channel ChR2 protein with higher expression quantity and stronger light sensitivity, and the light-sensitive channel ChR2 protein is very suitable for expression in cells of mammals (especially human); according to the invention, the rhodopsin in different channels is systematically studied by modifying the position G224 in the helix 6 of seven transmembrane helix motifs, which proves that the mutation of the position G224 in the helix 6 in WT ChR2 accelerates the photosensitivity of the channels, and the considered position is homologous in the helix 6 of the rhodopsin in different channels.

The invention relates to a back-illuminated image sensor and a preparation method thereof, and relates to the technical field of integrated circuits, in which a plurality of photodiode structures are distributed at intervals along a first direction parallel to a back surface and penetrate through a P-type epitaxial layer along a second direction close to a substrate; the bottom photosensitive part comprises a first horizontal part extending along a first direction and a first longitudinal protruding part extending to the back surface of the substrate; the middle photosensitive part comprises a second horizontal part extending in the first direction and a second longitudinal protruding part extending to the top face of the first horizontal part. The second longitudinal protruding part is located on the side, away from the first longitudinal protruding part, of the first horizontal part in the first direction. The top photosensitive part comprises a third horizontal part extending in the first direction and a third longitudinal protruding part extending to the top face of the second horizontal part. The electron concentration of a photosensitive area can be increased at least, and the photosensitive performance and the integration density of the BSI image sensor are improved.

The invention relates to a backside illuminated image sensor preparation method and a backside illuminated image sensor, and relates to the technical field of integrated circuits, and the method comprises the steps: providing a substrate which comprises a plurality of trench isolation parts distributed at intervals in a first direction; self-aligning the plurality of trench isolation parts to form a first type bottom semiconductor layer comprising a plurality of first target patterns which are distributed at intervals along the first direction, the first target patterns comprising a first type second semiconductor part, a first semiconductor part and a second semiconductor part which are sequentially distributed along the first direction; forming a second type photosensitive lamination layer on the surface, deviating from the substrate, of the bottom semiconductor layer; self-aligning the first semiconductor part, and forming a plurality of first type semiconductor columns which penetrate through the photosensitive lamination layer along a second direction and extend to the first semiconductor part; and forming a first type top semiconductor layer by adopting the same preparation process as the bottom semiconductor layer. The electron concentration of a photosensitive area can be increased at least, and the photosensitive performance of the BSI image sensor is improved.

The invention relates to a backside illuminated image sensor preparation method and a backside illuminated image sensor, and relates to the technical field of integrated circuits, and the method comprises the steps: providing a substrate comprising a first top surface; forming a first semiconductor layer on the first top surface of the substrate, wherein the first semiconductor layer internally comprises a plurality of first photosensitive parts which are distributed at intervals in the first direction, and the top surfaces of the first photosensitive parts are not lower than the top surface of the first semiconductor layer; forming a second semiconductor layer covering the first semiconductor layer, wherein the second semiconductor layer internally comprises a plurality of second photosensitive parts which are distributed at intervals along the first direction, penetrate through the second semiconductor layer along a second direction close to the substrate and extend to the top surfaces of the plurality of first photosensitive parts; and forming a third semiconductor layer covering the second semiconductor layer, wherein the third semiconductor layer internally comprises a plurality of third photosensitive parts which are distributed at intervals along the first direction, penetrate through the second semiconductor layer along the second direction and extend into the plurality of second photosensitive parts. The electron concentration of a photosensitive area can be increased at least, and the photosensitive performance of the BSI image sensor is improved.

The present invention provides an organic electric element including a metal patterning layer formed on the outside of a metal electrode and an electronic device thereof, and by forming a patterning auxiliary photosensitive layer made of a material with excellent photosensitivity under the metal patterning layer, it is possible to easily measure the thickness of the metal patterning layer.

The invention provides a sleep adjusting method and device, electronic equipment and a storage medium, the method comprises: acquiring physiological perception data, scheduling information and illumination information of a user, the scheduling information comprising night shift arrangement information and rest day arrangement information, and the illumination information comprising individual photosensitive difference information and illumination exposure history; determining initial peak time of melatonin secretion according to a preset melatonin secretion rule and night shift arrangement information; phase change information is determined based on a preset melatonin secretion rule, the individual photosensitive difference information and the illumination exposure history, and predicted peak time is determined according to the phase change information and the initial peak time; determining a wake-up strategy according to the physiological perception data, the rest day arrangement information and the predicted peak time, wherein the wake-up strategy comprises actual wake-up time and target control start time of at least one preset wake-up cooperation function; the sleep effect can be naturally and mildly optimized, and the sleepiness feeling after waking up is reduced.

The invention provides ferrocenyl carboxylic acid anthracene methyl ester for photosensitive resin, and relates to the field of photopolymerization. The invention also comprises a photosensitive resin composition containing the ferrocenyl carboxylic acid anthracene methyl ester, a photosensitive dry film containing the ferrocenyl carboxylic acid anthracene methyl ester, and applications of the photosensitive resin composition and the photosensitive dry film. The ferrocenyl carboxylic acid anthracene methyl ester disclosed by the invention has the characteristics of photosensitivity and low migration, can improve the adhesive force of a photosensitive resin composition on various metal surfaces, and can be widely applied to the photocuring fields of dry films, paints, coatings, printing inks, molding materials and the like.

The invention relates to a backside illuminated image sensor preparation method and a backside illuminated image sensor, and relates to the technical field of integrated circuits, and the method comprises the steps: providing a substrate, and forming a first semiconductor layer and a first initial photosensitive lamination which are alternately arranged along a first direction parallel to the back surface and are opposite in conduction type on the back surface of the substrate; in the process of forming second semiconductor layers and second photosensitive layers which are alternately arranged in the first direction and are opposite in conduction type, etching the first initial photosensitive lamination layer to obtain a first photosensitive lamination layer; the second semiconductor layer is located on the top surface of the first semiconductor layer; the second photosensitive layer covers the top surface of the first photosensitive lamination layer; and forming third semiconductor layers and third photosensitive layers which are alternately arranged along the first direction and have opposite conduction types. The electron concentration of a photosensitive area can be increased at least, and the photosensitive performance of the BSI image sensor is improved.

This application discloses a light-sensing control method and device for a display screen, as well as a display device. The method is applied to a terminal device with a foldable display screen. After a navigation application is opened, the device enters HUD mode in response to the folded state of the display screen. The navigation instructions displayed in the second display area of ​​the foldable screen are reflected by the windshield. Simultaneously, the current ambient color temperature and brightness parameters of the external environment in front of the windshield are collected. The display color of the navigation instructions is adjusted according to the current ambient color temperature parameter to avoid the navigation instructions being unclear due to overlap with the ambient light color. The display brightness and / or display size of the navigation instructions are adjusted according to the current ambient brightness parameter to further maintain clear display of the navigation instructions based on changes in ambient light brightness, thus presenting a better display effect.

The invention provides anthracene diaminophosphate for a photosensitive resin composition, and relates to the field of photopolymerization. The invention also comprises a photosensitive resin composition containing the anthracene diphosphoramidate, a photosensitive dry film containing the anthracene diphosphoramidate, and applications of the photosensitive resin composition and the photosensitive dry film. The anthracene diaminophosphate provided by the invention has photosensitivity, can be used as a photosensitizer in the photosensitive resin composition, can improve the adhesive force of the photosensitive resin composition on various metal surfaces, and has the characteristic of low migration; the method can be widely applied to the photo-curing fields of dry films, paints, coatings, printing ink, forming materials and the like.

The invention provides a reverse printing ink system based on a positive photosensitive mechanism and application thereof. The printing ink system comprises three types of products, namely black matte printing ink, high-reflectivity white printing ink and green printing ink, the production process of the ink system comprises the following steps: 1) synthesizing the film-forming resin; (2) sharing the film-forming resin with a pigment system, a dispersion medium and a functional additive; and 3) applying the reverse ink system to PCB manufacturing. According to the method, the characteristic of'dissolution in an exposure area 'is realized through positive light sensing, and the problems of scanning splicing printing, color difference and insufficient reflectivity in a traditional solder mask process are solved by matching with a special developing solution and a DI exposure light spot shaping technology; compared with the prior art, the reverse printing ink system has the advantages that the yellowing index, the resolution ratio, the heat resistance and the like are remarkably improved, and the reverse printing ink system is suitable for manufacturing a high-end mini LED / micro LED PCB (Printed Circuit Board).

The invention discloses an ancient building repairing auxiliary system based on a color quantization technology, and relates to the technical field of ancient building special decoration. The acquisition module is used for acquiring a dust light transmission attenuation coefficient determined according to the dust concentration and a target attenuation coefficient, determining a reference brightness ratio of the current brightness to the dust-free standard brightness by a standard reference plate and a preset temperature and humidity compensation factor, and calculating an environment illumination value; according to the identified average reflectivity of the material, 1 minus the mirror reflection ratio and the surface roughness, endowing different weight values, and then adding to determine a material optical value of the material; dividing the product of the environment illumination value, the material optical value and a preset material photosensitivity correction factor by 100 to obtain a comprehensive illumination value; driving an execution unit to execute different strategies according to the comprehensive illumination value; therefore, the problem that some tiny flaws cannot be accurately positioned during repair defect detection due to different on-site environments after the ancient building is preliminarily repaired can be solved, and the method is simple, effective and easy to use.

To provide a photosensitive composition having good storage stability and capable of forming a film which hardly causes development stains and outgassing and is excellent in solvent resistance after a low-temperature curing process.SOLUTION: The photosensitive composition for a color filter contains an alkali-soluble resin (A), a polymerizable compound (B), and a photopolymerization initiator (C). The photopolymerization initiator (C) contains a photopolymerization initiator multimer (C1) bonded via a linking group. The linking group contains an alkyleneoxy group.SELECTED DRAWING: Figure 1

There are provided a photosensitive resin composition including a resin which is a polyimide having a polymerizable group and a weight-average molecular weight of 5,000 or more and less than 30,000, a polymerizable compound, and a photopolymerization initiator; a cured substance obtained by curing the resin composition; a laminate including the cured substance; a manufacturing method for the cured substance; a manufacturing method for a laminate; a manufacturing method for a semiconductor device, including the manufacturing method for the cured substance; and a semiconductor device including the cured substance.

The present application provides a photosensitive resin composition, dry film resist, photosensitive dry film and application thereof. The photosensitive resin composition comprises 45-60 parts of alkali-soluble resin, 35-50 parts of photopolymerization monomer, 2.5-5 parts of photoinitiator and 0.1-0.8 parts of sensitizer; the sensitizer is a compound shown in the general formula, R1 represents methylene or carbonyl, n represents 0 or 1; R2 represents phenyl, and any hydrogen atom on R2 is optionally substituted by methoxy, C1-C 10 alkyl, phenyl, benzyl or phenoxy. The sensitizer of the present application can make the product have better photosensitivity and resolution. Moreover, based on the above specific weight parts of alkali-soluble resin, photopolymerization monomer, photoinitiator and sensitizer, the comprehensive performance of the product of the present application is better.

A photosensitive coloring resin composition with high residual film yield is provided. The photosensitive coloring resin composition of the present invention is characterized in that it contains (A) a colorant, (B) a dispersant, (C) an alkali-soluble resin and (D) a photopolymerization initiator, wherein the aforementioned (A) colorant comprises an organic pigment (A-1) and the aforementioned (C) alkali-soluble resin comprises a resin (C1) having a structural unit having the following general formula (1).

The invention relates to the technical field of photosensitive coatings, and particularly discloses high-flexibility photosensitive solder resist ink and a preparation method thereof. The high-flexibility photosensitive solder resist ink provided by the invention comprises a main agent and a curing agent, the main agent comprises a growth straight chain carboxyl-containing resin solution; the growth straight-chain carboxyl-containing resin solution is prepared by carrying out ring-opening reaction on epoxy resin, introducing beta-(acryloyloxy) acid and then carrying out esterification reaction with acid anhydride; the curing agent comprises thermosetting resin and a toughening agent; the thermosetting resin comprises biphenyl epoxy resin, and the flexibilizer is aliphatic epoxy resin. The composite effect of the straight-chain carboxyl-containing resin solution, the specific thermosetting resin and the flexibilizer is improved, the flexibility of a liquid photosensitive solder resist ink curing film can be obviously improved, and meanwhile, the liquid photosensitive solder resist ink has good chemical gold resistance and soldering resistance and is particularly suitable for a flexible circuit board.

The application provides a polyhydroxy phenolic compound, a preparation method thereof, a diazonium naphthoquinone sulfonate, a preparation method thereof and a photoresist composition. The polyhydroxy phenolic compound has the following structure shown in formula (I). The diazonium naphthoquinone sulfonate prepared by using the polyhydroxy phenolic compound provided by the application as an intermediate is applied to the photoresist composition as a photosensitive agent, and the obtained photoresist not only has clear resolution and high photosensitivity, but also has excellent thermal stability and etching resistance, and has a wide application prospect in the field of semiconductors.

A photosensitive colored resin composition comprises a colorant (A), an alkali-soluble resin (B), a photopolymerizable compound (C), a photoinitiator (D) and a solvent (E). The iodine value range of the photosensitive colored resin composition is 0.5 g / 100g to 15g / 100g, and the colorant (A) comprises a triphenylmethane colorant (A-1). The invention also provides a manufacturing method of a color filter using the photosensitive colored resin composition to form a pixel layer, a color filter manufactured by the manufacturing method, and a liquid crystal display comprising the color filter. According to the invention, the coloring agent (A) comprising the triphenylmethane coloring agent (A-1) is adopted, and the iodine value of the photosensitive colored resin composition is controlled to be 0.5 g / 100g to 15g / 100g, so that the size of foreign matters in a pixel layer formed by the photosensitive colored resin composition after a multi-stage thermal process can be reduced.

The invention relates to a backside illuminated image sensor preparation method and a backside illuminated image sensor, and relates to the technical field of integrated circuits, and the method comprises the steps: providing a substrate, forming a first semiconductor layer on the back surface of the substrate, and enabling the first semiconductor layer to internally comprise a plurality of bottom photosensitive laminated layers which are arranged at intervals, the bottom photosensitive laminated layer comprises a first sub-photosensitive layer, a second sub-photosensitive layer and a third sub-photosensitive layer which are sequentially laminated in the direction away from the substrate; forming a second semiconductor layer covering the plurality of bottom photosensitive laminated layers, the second semiconductor layer including a plurality of bridging portions arranged at intervals, the plurality of bridging portions penetrating the second semiconductor layer and the third sub-photosensitive layers and extending into the plurality of second sub-photosensitive layers; and forming a third semiconductor layer covering the plurality of bridging parts, the third semiconductor layer comprising a plurality of photosensitive cover layers arranged at intervals, and the plurality of photosensitive cover layers being embedded in the third semiconductor layer and covering and contacting the plurality of bridging parts. The electron concentration of a photosensitive area can be increased at least, and the photosensitive performance of the BSI image sensor is improved.

A negative-type photosensitive resin composition, including: (A) a polymer compound including a polyimide precursor structure; (C) a photopolymerization initiator; (D) an organic compound represented by the following general formula (1); and (E) a solvent. This can provide: a photosensitive resin composition that allows an imide ring-closing reaction at low temperature, that has excellent stability of the composition, that uses a polyimide precursor that enables fine patterning, and that can impart resistance against chemicals after curing. In addition, an object of the present invention is to provide: a patterning process using the above photosensitive resin composition; an interlayer insulating film including a cured coating formed by curing the photosensitive resin composition; and a semiconductor device.

This invention belongs to the field of semiconductor packaging, and provides a photosensitive resin, its preparation method, and a photosensitive resin composition. The photosensitive resin is formed by an electrophilic substitution reaction of a phenolic prepolymer and an electrophilic reagent. The phenolic prepolymer is formed by a polycondensation reaction of monomer I (structure shown in Formula 1) and monomer II (structure shown in Formula 2), wherein m and n independently represent 1 or 2, and Ar is an aryl group with 6 to 18 carbon atoms. When this resin is applied to a photosensitive resin composition, the cured material formed by the composition possesses good etching resistance, mechanical properties, and high thermal stability.

This invention provides a photosensitive conductive resin composition and its application. The photosensitive conductive resin composition comprises, by weight, the following components: 20-60 parts of a photosensitive polymer, 10-20 parts of an epoxy resin, 5-20 parts of an acrylate monomer, 0.5-5 parts of a photoinitiator, 20-60 parts of a conductive carbon filler, and 1-10 parts of an additive; the volume resistivity of the conductive carbon filler is ≤0.5 Ω·m. Through the screening and synergistic compounding of specific components, the photosensitive conductive film prepared from this resin composition exhibits excellent conductivity and peel strength, high photosensitivity resolution, and excellent developability, thus meeting the application requirements of photosensitive conductive films.

The invention provides a negative type thick film photosensitive resin composition and a manufacturing method of an electroplating forming body. The negative type thick film photosensitive resin composition comprises alkali soluble resin (A) with a specific structure, a compound (B) with an ethylene unsaturated group, a photoinitiator (C) and a solvent (D), and the negative type thick film photosensitive resin composition has specific viscosity. Therefore, the storage stability of the negative type thick film photosensitive resin composition and the pattern perpendicularity of an electroplating forming body prepared from the negative type thick film photosensitive resin composition can be improved.

Provided are a transfer film and the like which have higher sensitivity than conventional transfer films and which can form a high-resolution resin pattern when forming a resin pattern on a substrate by exposure using a direct drawing method. The present invention provides a transfer film provided with a temporary support and a photosensitive resin layer disposed on the temporary support, the photosensitive resin layer containing an alkali-soluble resin, a polymerizable compound, a photopolymerization initiator, and a compound represented by formula (1), and an application thereof.

The present application provides a photosensitive resin composition, a hardened film, a substrate with a hardened film, and a manufacturing method of a substrate with a hardened film, which can form a resin film pattern having excellent development adhesion, linearity, and resistance to solvents and alkalis, even when a substrate with low heat resistance is used. The photosensitive resin composition of the present application is a photosensitive resin composition for forming a hardened film on a substrate with a heat resistance temperature of 111°C or less, and comprises: (A) an alkali-soluble resin containing an unsaturated group, (B) a photopolymerizable monomer having two or more ethylenic unsaturated bonds, (C) an epoxy compound having two or more 3,1-epoxycyclohexyl groups, (D) a photopolymerization initiator, and (E) a solvent. The content of the (C) component is 5 to 17 mass% relative to the total mass of the solid components.

The present application provides a display panel and a display device. A light-shielding layer of the display panel comprises a first light-shielding portion, a second light-shielding portion and a third light-shielding portion, wherein the first light-shielding portion can perform light shielding on a first active portion of a driving transistor, the second light-shielding portion can perform light shielding on a third active portion of a compensation transistor, and the third light-shielding portion can perform light shielding on a fourth active portion of a first initialization transistor, thereby improving the photosensitivity and electrical properties of the compensation transistor and the first initialization transistor.