1113 results about "Photosensitivity" patented technology

The invention provides a photosensitive resin composition, a color filter and a manufacturing method thereof, and a liquid crystal display device. The photosensitive resin composition includes a colorant (A) including a triphenylmethane colorant (A-1), an alkali-soluble resin (B), a compound (C) having an ethylenically unsaturated group, a photoinitiator (D), and a solvent (E), in which in an electron spin resonance spectrogram of the photosensitive resin composition, a g value corresponding to a characteristic peak with the maximum intensity is 1.8000-2.0400.

The invention relates to a backside illuminated image sensor preparation method and a backside illuminated image sensor, and relates to the technical field of integrated circuits, and the method comprises the steps: providing a substrate, forming a third semiconductor layer covering a first semiconductor layer and a second semiconductor layer, the third semiconductor layer comprising an embedded part penetrating through the second semiconductor layer; forming a plurality of isolation parts penetrating through the third semiconductor layer, wherein the plurality of isolation parts are located right above the plurality of first semiconductor layers; forming a plurality of target semiconductor columns arranged at intervals along the first direction in the third semiconductor layer; target doping ions are injected into the remaining third semiconductor layer, so that the target semiconductor columns, the second semiconductor layer and the third semiconductor layer jointly form a plurality of photodiodes. The electron concentration of the photosensitive area is at least increased, and the photosensitive performance of the BSI image sensor is improved.

The invention provides anthracene methyl phenothiazine for a photosensitive resin composition, and relates to the field of photopolymerization. The invention further comprises a photosensitive resin composition containing the anthracene methyl phenothiazine, a photosensitive dry film containing the anthracene methyl phenothiazine and application of the photosensitive resin composition and the photosensitive dry film. The anthracene methyl phenothiazine disclosed by the invention has photosensitivity, can be used as a photosensitizer in the photosensitive resin composition, can improve the adhesive force of the photosensitive resin composition on various metal surfaces, and has the characteristic of low migration; the method can be widely applied to the photo-curing fields of dry films, paints, coatings, printing ink, forming materials and the like.

The invention provides triazole anthracene methyl formate for a photosensitive resin composition, and relates to the field of photopolymerization. The invention also comprises a photosensitive resin composition containing the triazole anthracene methyl formate, a photosensitive dry film containing the triazole anthracene methyl formate, and applications of the photosensitive resin composition and the photosensitive dry film. The triazole formic acid anthracene methyl ester disclosed by the invention has photosensitivity, can be used as a photosensitizer in the photosensitive resin composition, can improve the adhesive force of the photosensitive resin composition on various metal surfaces, and has the characteristic of low migration; the method can be widely applied to the photo-curing fields of dry films, paints, coatings, printing ink, forming materials and the like.

The invention provides anthracene methylthiosalicylic acid for a photosensitive resin composition, and relates to the field of photopolymerization. The invention also comprises a photosensitive resin composition containing the anthracene methylthio-salicylic acid, a photosensitive dry film containing the anthracene methylthio-salicylic acid, and applications of the photosensitive resin composition and the photosensitive dry film. The anthracene methyl thiosalicylic acid has photosensitivity and can be used as a photosensitizer in the photosensitive resin composition; the migration characteristic is low; the photosensitive resin composition has good solubility in conventional monomers, and the degree of freedom of formula design of the photosensitive resin composition is greatly improved; the developing agent also has very good solubility in alkali liquor, so that developing garbage can be greatly reduced, and the product yield is improved; the adhesive force of the photosensitive resin composition on various metal surfaces can be improved; the method can be widely applied to the photo-curing fields of dry films, paints, coatings, printing ink, forming materials and the like.

The invention relates to the field of polyimide materials, in particular to a positive photosensitive polyimide photoresist, a polyimide film and application of the positive photosensitive polyimide photoresist and the polyimide film. The positive photosensitive polyimide photoresist with excellent performance can be prepared by taking novel water-soluble polyamic acid ester with good dielectric property, low water absorption, heat resistance and the like as film-forming resin and combining the film-forming resin with the quinonediazide compound photosensitive component, the silane coupling agent and the organic solvent; the main film-forming component polyamic acid ester is a corresponding water-soluble polyimide precursor synthesized by using a series of simple and easily available polymeric monomers, and the realization of the water solubility is not limited to specific groups such as hydroxyl, carboxyl and the like in molecules. The photoresist has the advantages of high light sensitivity, high resolution, good thermal stability and chemical resistance, good heat and humidity resistance, good adhesion to various substrates and the like, an alkaline aqueous solution can be used as a developing solution, the loss of a film in a non-exposure area in the developing process is low due to low water absorption of the alkaline aqueous solution, and the developing time is short.

The invention relates to the technical field of biomedicine, discloses mutant photo-induced ion channel ChR-2 protein, and further discloses a nucleic acid construct, an expression vector, a cell, related application and a computer model. The light-sensitive channel ChR2 protein mutant obtained by the invention has stronger light current, and the light-sensitive capability of the light-sensitive channel ChR2 protein mutant is at least improved by 100 times; besides, the invention also obtains a nucleotide sequence for coding the light-sensitive channel ChR2 protein mutant, constructs a recombinant expression vector, and obtains the light-sensitive channel ChR2 protein with higher expression quantity and stronger light sensitivity, and the light-sensitive channel ChR2 protein is very suitable for expression in cells of mammals (especially human); according to the invention, the rhodopsin in different channels is systematically studied by modifying the position G224 in the helix 6 of seven transmembrane helix motifs, which proves that the mutation of the position G224 in the helix 6 in WT ChR2 accelerates the photosensitivity of the channels, and the considered position is homologous in the helix 6 of the rhodopsin in different channels.

The invention relates to a back-illuminated image sensor and a preparation method thereof, and relates to the technical field of integrated circuits, in which a plurality of photodiode structures are distributed at intervals along a first direction parallel to a back surface and penetrate through a P-type epitaxial layer along a second direction close to a substrate; the bottom photosensitive part comprises a first horizontal part extending along a first direction and a first longitudinal protruding part extending to the back surface of the substrate; the middle photosensitive part comprises a second horizontal part extending in the first direction and a second longitudinal protruding part extending to the top face of the first horizontal part. The second longitudinal protruding part is located on the side, away from the first longitudinal protruding part, of the first horizontal part in the first direction. The top photosensitive part comprises a third horizontal part extending in the first direction and a third longitudinal protruding part extending to the top face of the second horizontal part. The electron concentration of a photosensitive area can be increased at least, and the photosensitive performance and the integration density of the BSI image sensor are improved.

The invention relates to a backside illuminated image sensor preparation method and a backside illuminated image sensor, and relates to the technical field of integrated circuits, and the method comprises the steps: providing a substrate which comprises a plurality of trench isolation parts distributed at intervals in a first direction; self-aligning the plurality of trench isolation parts to form a first type bottom semiconductor layer comprising a plurality of first target patterns which are distributed at intervals along the first direction, the first target patterns comprising a first type second semiconductor part, a first semiconductor part and a second semiconductor part which are sequentially distributed along the first direction; forming a second type photosensitive lamination layer on the surface, deviating from the substrate, of the bottom semiconductor layer; self-aligning the first semiconductor part, and forming a plurality of first type semiconductor columns which penetrate through the photosensitive lamination layer along a second direction and extend to the first semiconductor part; and forming a first type top semiconductor layer by adopting the same preparation process as the bottom semiconductor layer. The electron concentration of a photosensitive area can be increased at least, and the photosensitive performance of the BSI image sensor is improved.

A method and device for implementing high-dynamic range imaging, and an image processing system are provided. The device includes: an image sensor, a pixel array in the image sensor including a plurality of pixel units; and a column processing unit, including a gain control unit and an analog-to-digital conversion unit; where each pixel unit includes two photoelectric conversion units with different photosensitivity; and the gain control unit is configured to determine a brightness range of an image based on a signal voltage output by each pixel unit, and select the photoelectric conversion unit for signal conversion in each pixel unit, a charge-to-voltage conversion gain of each pixel unit and a voltage gain of the column processing unit based on the brightness range. With the method, device and system, the signal voltage allows to be read out only once, thereby shortening row readout time and increasing a frame rate.

The invention provides a wafer film tearing process based on ultraviolet viscosity control. The wafer film tearing process based on ultraviolet viscosity control comprises the steps that a, a wafer is selected and prepared, the surface of the wafer is coated with a layer of photosensitive viscous material suitable for ultraviolet irradiation, and the photosensitive material is a thin film layer with high photosensitivity and good photoreaction control capacity; and the ultraviolet light source is accurately adjusted to ensure that the intensity of the ultraviolet light is uniformly distributed in a relatively large range. According to the wafer film tearing process based on ultraviolet viscosity control, by optimizing ultraviolet irradiation conditions, the problem of limited ultraviolet penetrating power is solved, it is ensured that ultraviolet can effectively penetrate through a thick film layer, and uniform photosensitive material reaction is achieved. By means of the improvement, it can be ensured that the film layer separation effect in the film tearing process is more uniform, the film tearing effect difference caused by uneven ultraviolet light penetration in a traditional method is avoided, and the consistency and reliability of the technology are improved.

The invention relates to a backside illuminated image sensor preparation method and a backside illuminated image sensor, and relates to the technical field of integrated circuits, and the method comprises the steps: providing a substrate comprising a first top surface; forming a first semiconductor layer on the first top surface of the substrate, wherein the first semiconductor layer internally comprises a plurality of first photosensitive parts which are distributed at intervals in the first direction, and the top surfaces of the first photosensitive parts are not lower than the top surface of the first semiconductor layer; forming a second semiconductor layer covering the first semiconductor layer, wherein the second semiconductor layer internally comprises a plurality of second photosensitive parts which are distributed at intervals along the first direction, penetrate through the second semiconductor layer along a second direction close to the substrate and extend to the top surfaces of the plurality of first photosensitive parts; and forming a third semiconductor layer covering the second semiconductor layer, wherein the third semiconductor layer internally comprises a plurality of third photosensitive parts which are distributed at intervals along the first direction, penetrate through the second semiconductor layer along the second direction and extend into the plurality of second photosensitive parts. The electron concentration of a photosensitive area can be increased at least, and the photosensitive performance of the BSI image sensor is improved.

An array substrate and a display panel are provided. The array substrate includes a substrate, an active layer, a first insulating layer, and a first opening. The active layer is disposed on a side of the substrate and includes a first active portion and a second active portion. The first insulating layer is disposed on a side of the active layer away from the substrate and covers the active layer. The first opening is formed on the first active portion. The first opening exposes the first insulating layer. An integration of a pixel driving element and a photosensitive element on the array substrate is realized, and a photosensitive performance of the photosensitive element is improved.

The present invention provides an organic electric element including a metal patterning layer formed on the outside of a metal electrode and an electronic device thereof, and by forming a patterning auxiliary photosensitive layer made of a material with excellent photosensitivity under the metal patterning layer, it is possible to easily measure the thickness of the metal patterning layer.

The invention provides a sleep adjusting method and device, electronic equipment and a storage medium, the method comprises: acquiring physiological perception data, scheduling information and illumination information of a user, the scheduling information comprising night shift arrangement information and rest day arrangement information, and the illumination information comprising individual photosensitive difference information and illumination exposure history; determining initial peak time of melatonin secretion according to a preset melatonin secretion rule and night shift arrangement information; phase change information is determined based on a preset melatonin secretion rule, the individual photosensitive difference information and the illumination exposure history, and predicted peak time is determined according to the phase change information and the initial peak time; determining a wake-up strategy according to the physiological perception data, the rest day arrangement information and the predicted peak time, wherein the wake-up strategy comprises actual wake-up time and target control start time of at least one preset wake-up cooperation function; the sleep effect can be naturally and mildly optimized, and the sleepiness feeling after waking up is reduced.

To provide a new photosensitive resin composition having superior adhesion to a Si wafer.SOLUTION: A photosensitive resin composition in one form of the present disclosure comprises a polyhydroxyurea compound having a structural unit represented by formula (1), a photoacid generator, and a crosslinking agent.SELECTED DRAWING: None

The invention provides a photosensitive resin composition, a photosensitive dry film and application thereof. The photosensitive resin composition comprises alkali-soluble resin, a photopolymerization monomer, a photoinitiator and a photosensitizer, the photosensitive resin composition provided by the invention has excellent photosensitive characteristics, can provide excellent resolution and adhesive force, and is uniformly cured during exposure, a formed anti-corrosion pattern port is rectangular, the side wall is flat, an electroplating solution is not easily polluted in an electroplating process, the yield of a product can be remarkably improved, and the service life of the electroplating solution is prolonged.

To provide a photosensitive composition capable of further improving diffraction characteristics.The present technology provides a photosensitive composition including: at least a compound represented by the following general formula (1); a binder resin; and a photoinitiator.In the general formula (1), X1 represents an oxygen atom, a nitrogen atom, a phosphorus atom, a caron atom, or a silicon atom.Y1 and Y2 each represent a benzene ring or a naphthalene ring, and both Y1 and Y2 do not represent benzene rings.R1 to R3 each represent a hydrogen or a substituent group represented by *—Z1(R4)d (* represents a bonding site).Z1 represents a single bond, a saturated hydrocarbon group having a valence of 2 or higher, or an unsaturated hydrocarbon group having a valence of 2 or higher, and the saturated hydrocarbon group or the unsaturated hydrocarbon group may have an ether bond and / or a thioether bond.R4 represents a hydrogen or a polymerizable substituent group.

The present invention relates to a photosensitive resin composition and a dry film resist laminate thereof, belonging to the technical field of printed circuit boards. A photosensitive resin composition includes an alkali-soluble resin, a photopolymerizable monomer, and a photoinitiator. The alkali-soluble resin at least includes a segment formed by a vinyl carbonate I monomer, and the vinyl carbonate I is a vinyl carbonate with a benzene ring. The present invention uses vinyl carbonate I containing a benzene ring structure to prepare the photosensitive resin composition. In addition to having excellent resolution and adhesion, since the segment formed by the vinyl carbonate I monomer will decompose to form a structure with hydroxyl groups and CO2, it can interact with the stripping solution during the stripping process, which is beneficial to the peeling of the cured resist pattern. At the same time, the released gas will accelerate the stripping process, making it have a faster stripping speed, thereby improving the production efficiency.

The invention provides ferrocenyl carboxylic acid anthracene methyl ester for photosensitive resin, and relates to the field of photopolymerization. The invention also comprises a photosensitive resin composition containing the ferrocenyl carboxylic acid anthracene methyl ester, a photosensitive dry film containing the ferrocenyl carboxylic acid anthracene methyl ester, and applications of the photosensitive resin composition and the photosensitive dry film. The ferrocenyl carboxylic acid anthracene methyl ester disclosed by the invention has the characteristics of photosensitivity and low migration, can improve the adhesive force of a photosensitive resin composition on various metal surfaces, and can be widely applied to the photocuring fields of dry films, paints, coatings, printing inks, molding materials and the like.

The invention relates to a backside illuminated image sensor preparation method and a backside illuminated image sensor, and relates to the technical field of integrated circuits, and the method comprises the steps: providing a substrate, and forming a first semiconductor layer and a first initial photosensitive lamination which are alternately arranged along a first direction parallel to the back surface and are opposite in conduction type on the back surface of the substrate; in the process of forming second semiconductor layers and second photosensitive layers which are alternately arranged in the first direction and are opposite in conduction type, etching the first initial photosensitive lamination layer to obtain a first photosensitive lamination layer; the second semiconductor layer is located on the top surface of the first semiconductor layer; the second photosensitive layer covers the top surface of the first photosensitive lamination layer; and forming third semiconductor layers and third photosensitive layers which are alternately arranged along the first direction and have opposite conduction types. The electron concentration of a photosensitive area can be increased at least, and the photosensitive performance of the BSI image sensor is improved.

An aspect of the present disclosure relates to a photosensitive resin composition containing (A) an acid-modified vinyl group-containing resin, (B) a thermosetting resin, (C) a photopolymerization initiator, (D) a photopolymerizable compound, and (E) an elastomer, in which (B) the thermosetting resin includes a bisphenol type epoxy compound having an average molecular weight of 360 or less and (E) the elastomer includes an acrylic elastomer.

The invention relates to the field of photosensitive polyimide materials, in particular to a negative photosensitive polyimide photoresist, a polyimide film and application of the negative photosensitive polyimide photoresist and the polyimide film. Compared with the prior art, the water-soluble polyamide acid ester is used as a main raw material, the water-soluble polyamide acid ester is synthesized by using a series of simple and easily available polymeric monomers, the selection of the synthesized monomers is relatively flexible and is not limited to monomers of water-soluble groups such as hydroxyl and carboxyl in molecules, the preparation process is simple, the cost is relatively low, and the current environmental protection requirements are met. The synthesized polyamic acid ester is excellent in water solubility, the polyamic acid ester is combined with a photoinitiator, a cross-linking agent and an organic solvent, and a flame retardant, an inorganic filler, a flatting agent and the like can be selectively added or not added according to needs, so that a negative photoresist with excellent performance is prepared, and the negative photoresist has the advantages of good alkali solubility, high transparency and the like after being prepared into a negative photoetching developing film. The invention has the advantages of high light sensitivity, high resolution, good thermal stability and chemical resistance, good heat and humidity resistance, good adhesion to various base materials and the like, and an inorganic alkali solution can be used as a developing solution.

This application discloses a light-sensing control method and device for a display screen, as well as a display device. The method is applied to a terminal device with a foldable display screen. After a navigation application is opened, the device enters HUD mode in response to the folded state of the display screen. The navigation instructions displayed in the second display area of ​​the foldable screen are reflected by the windshield. Simultaneously, the current ambient color temperature and brightness parameters of the external environment in front of the windshield are collected. The display color of the navigation instructions is adjusted according to the current ambient color temperature parameter to avoid the navigation instructions being unclear due to overlap with the ambient light color. The display brightness and / or display size of the navigation instructions are adjusted according to the current ambient brightness parameter to further maintain clear display of the navigation instructions based on changes in ambient light brightness, thus presenting a better display effect.

The invention provides anthracene diaminophosphate for a photosensitive resin composition, and relates to the field of photopolymerization. The invention also comprises a photosensitive resin composition containing the anthracene diphosphoramidate, a photosensitive dry film containing the anthracene diphosphoramidate, and applications of the photosensitive resin composition and the photosensitive dry film. The anthracene diaminophosphate provided by the invention has photosensitivity, can be used as a photosensitizer in the photosensitive resin composition, can improve the adhesive force of the photosensitive resin composition on various metal surfaces, and has the characteristic of low migration; the method can be widely applied to the photo-curing fields of dry films, paints, coatings, printing ink, forming materials and the like.

The invention belongs to the technical field of photocuring, and particularly relates to an acridine-anthracene compound and a photosensitizer or photoinitiator containing the acridine-anthracene compound. Specifically, the structure of the compound disclosed by the invention is shown as a formula (I), and compared with the existing commercial sensitizer, the compound disclosed by the invention has the advantages of higher curing hardness, no frosting phenomenon and excellent solubility and photosensitive activity, and can be applied to the field of photocuring as a sensitizer or a photoinitiator.

The invention provides a reverse printing ink system based on a positive photosensitive mechanism and application thereof. The printing ink system comprises three types of products, namely black matte printing ink, high-reflectivity white printing ink and green printing ink, the production process of the ink system comprises the following steps: 1) synthesizing the film-forming resin; (2) sharing the film-forming resin with a pigment system, a dispersion medium and a functional additive; and 3) applying the reverse ink system to PCB manufacturing. According to the method, the characteristic of'dissolution in an exposure area 'is realized through positive light sensing, and the problems of scanning splicing printing, color difference and insufficient reflectivity in a traditional solder mask process are solved by matching with a special developing solution and a DI exposure light spot shaping technology; compared with the prior art, the reverse printing ink system has the advantages that the yellowing index, the resolution ratio, the heat resistance and the like are remarkably improved, and the reverse printing ink system is suitable for manufacturing a high-end mini LED / micro LED PCB (Printed Circuit Board).

The invention relates to an SR-B1 targeted polypeptide compound and application thereof in preparation of antitumor drugs, and belongs to the technical field of biological drug manufacturing. In order to solve the problems that the existing PDT photosensitizer is insufficient in targeting property and the treatment effect is limited due to the action of intracellular cholesterol, the invention provides an SR-B1 targeting polypeptide compound which is composed of an SR-B1 targeting polypeptide and an AS1411 aptamer. The SR-B1 targeting polypeptide comprises an SR-B1 targeting peptide fragment, a self-assembly peptide fragment, a response enzyme digestion peptide fragment and a photosensitizer TCPP which are connected in sequence. The invention constructs a polypeptide targeting system based on a dual self-assembly strategy, which not only can target SR-B1, inhibit a cholesterol-mediated tumor for a long time to promote a signal channel and interfere the ROS steady state, but also can target TCPP to a cell nucleus, improve the photosensitivity of PDT, and further improve the killing effect on tumor cells by improving the yield of ROS to cause the damage to the cell nucleus.

The invention discloses an ancient building repairing auxiliary system based on a color quantization technology, and relates to the technical field of ancient building special decoration. The acquisition module is used for acquiring a dust light transmission attenuation coefficient determined according to the dust concentration and a target attenuation coefficient, determining a reference brightness ratio of the current brightness to the dust-free standard brightness by a standard reference plate and a preset temperature and humidity compensation factor, and calculating an environment illumination value; according to the identified average reflectivity of the material, 1 minus the mirror reflection ratio and the surface roughness, endowing different weight values, and then adding to determine a material optical value of the material; dividing the product of the environment illumination value, the material optical value and a preset material photosensitivity correction factor by 100 to obtain a comprehensive illumination value; driving an execution unit to execute different strategies according to the comprehensive illumination value; therefore, the problem that some tiny flaws cannot be accurately positioned during repair defect detection due to different on-site environments after the ancient building is preliminarily repaired can be solved, and the method is simple, effective and easy to use.

The disclosure regards a computer implemented method for estimating the reactivity of dissolved organic matter in a liquid comprising the steps of obtaining a first fluorescence measurement from the liquid, wherein the first fluorescence measurement comprises a first emission wavelength and a first excitation wavelength, obtaining a second fluorescence measurement from the liquid, wherein the second fluorescence measurement comprises a second emission wavelength and a second excitation wavelength, determining a sample photosensitivity index based on the first fluorescence measurement, the second fluorescence measurement and a conversion factor specific to said liquid, and estimating the reactivity of dissolved organic matter in the liquid based on the sample photosensitivity index, wherein the conversion factor is a correlation between a series of base photosensitivity indexes and a series of fluorescence measurement ratios, obtained from a liquid of a same type as the liquid. The present disclosure further relates to a computer implemented method for calibrating a fluorescence setup in relation to a liquid, and to an optical measurement system for estimating the reactivity of dissolved organic matter in a liquid.