129 results about "Photosensitivity" patented technology

The present application provides a photosensitive resin composition, dry film resist, photosensitive dry film and application thereof. The photosensitive resin composition comprises 45-60 parts of alkali-soluble resin, 35-50 parts of photopolymerization monomer, 2.5-5 parts of photoinitiator and 0.1-0.8 parts of sensitizer; the sensitizer is a compound shown in the general formula, R1 represents methylene or carbonyl, n represents 0 or 1; R2 represents phenyl, and any hydrogen atom on R2 is optionally substituted by methoxy, C1-C 10 alkyl, phenyl, benzyl or phenoxy. The sensitizer of the present application can make the product have better photosensitivity and resolution. Moreover, based on the above specific weight parts of alkali-soluble resin, photopolymerization monomer, photoinitiator and sensitizer, the comprehensive performance of the product of the present application is better.

The application provides a polyhydroxy phenolic compound, a preparation method thereof, a diazonium naphthoquinone sulfonate, a preparation method thereof and a photoresist composition. The polyhydroxy phenolic compound has the following structure shown in formula (I). The diazonium naphthoquinone sulfonate prepared by using the polyhydroxy phenolic compound provided by the application as an intermediate is applied to the photoresist composition as a photosensitive agent, and the obtained photoresist not only has clear resolution and high photosensitivity, but also has excellent thermal stability and etching resistance, and has a wide application prospect in the field of semiconductors.

This invention belongs to the field of semiconductor packaging, and provides a photosensitive resin, its preparation method, and a photosensitive resin composition. The photosensitive resin is formed by an electrophilic substitution reaction of a phenolic prepolymer and an electrophilic reagent. The phenolic prepolymer is formed by a polycondensation reaction of monomer I (structure shown in Formula 1) and monomer II (structure shown in Formula 2), wherein m and n independently represent 1 or 2, and Ar is an aryl group with 6 to 18 carbon atoms. When this resin is applied to a photosensitive resin composition, the cured material formed by the composition possesses good etching resistance, mechanical properties, and high thermal stability.

This invention provides a photosensitive conductive resin composition and its application. The photosensitive conductive resin composition comprises, by weight, the following components: 20-60 parts of a photosensitive polymer, 10-20 parts of an epoxy resin, 5-20 parts of an acrylate monomer, 0.5-5 parts of a photoinitiator, 20-60 parts of a conductive carbon filler, and 1-10 parts of an additive; the volume resistivity of the conductive carbon filler is ≤0.5 Ω·m. Through the screening and synergistic compounding of specific components, the photosensitive conductive film prepared from this resin composition exhibits excellent conductivity and peel strength, high photosensitivity resolution, and excellent developability, thus meeting the application requirements of photosensitive conductive films.

A manufacturing method of a liquid ejecting head, in which a ejection port forming member that forms an ejection port for ejecting a liquid and a flow path of the liquid that communicates with the ejection port are formed on a substrate, the manufacturing method includes: forming a mold for the flow path of the liquid on the substrate; applying a photosensitive resin composition for forming the ejection port forming member on the substrate on which the mold has been formed so as to form a cationically polymerizable resin layer; and performing exposure and development on the cationically polymerizable resin layer so as to form the ejection port forming member, wherein the photosensitive resin composition includes at least one epoxy resin selected from an alicyclic epoxy resin and a glycidyl epoxy resin and a cationic photopolymerization initiator having a specific structure and a molar absorption coefficient.

This invention discloses a coumarin-linked conjugated porous polymer, its preparation method, and its applications. The preparation method includes: subjecting a homogeneous mixture containing o-hydroxybenzaldehyde monomer, phenylacetonitrile monomer, solvent, and catalyst to a Knauven-Gail condensation reaction to obtain the coumarin-linked conjugated porous polymer. The coumarin used in this invention to prepare the coumarin-linked conjugated porous polymer is a highly planar molecule. Its full conjugation extends the absorption wavelength to the visible light region and enhances π-electron excitation, thus exhibiting strong photosensitivity. The resulting series of coumarin-linked highly conjugated nanoarray conjugated porous polymers possess high porosity and a fully conjugated structure, making them highly efficient for applications in photocatalysis, fluorescence sensing, and optoelectronic devices.

A method for forming an insulating film having through holes, the method comprising the steps of: coating a photosensitive resin composition onto a substrate and drying it to form a photosensitive layer; and exposing and developing the photosensitive layer to form an insulating film having through holes, the insulating film having a thickness of 15 μm or more, wherein the photosensitive resin composition contains maleimide resin, (meth)acrylic acid monomers and a photopolymerization initiator, the maleimide resin being a reactant of tetracarboxylic acid dianhydride (a1), amine (a2) and maleic anhydride (a3), the amine (a2) comprising dimer diamine, and the (meth)acrylic acid monomer comprising a difunctional (meth)acrylic acid monomer.

This invention relates to a phosphate-containing chiral diastereomeric oxime ester compound, its preparation method, and its applications, belonging to the field of organic synthesis technology. This invention introduces a chiral center at a specific location in the molecular structure of the oxime ester compound to form a mixture of diastereomeric stereoisomers. The introduction of the chiral center interferes with intermolecular chiral recognition, thereby effectively suppressing the π-π stacking effect and crystal growth between the aromatic ring cores. Furthermore, the introduction of the phosphate ester structure into the product effectively improves its solubility in propylene glycol methyl ether acetate or cyclohexanone solvents. The photocurable ink prepared using the diastereomeric oxime ester compound of this invention exhibits excellent storage stability and better photosensitivity.

This invention provides a method for manufacturing a screen mask and an exposure apparatus capable of achieving high-precision printing. One aspect of the screen mask manufacturing method includes: an exposure process in which light is irradiated onto a photosensitive material mask film with a predetermined exposure pattern to form predetermined pattern openings in the mask film, the mask film being formed in a grid portion having a transmittance portion for a coating material to pass through; and correction of the exposure pattern based on information from the transmittance portion.

The application discloses a photoelectric sensor and a forming method thereof. The forming method comprises the following steps: providing a substrate, which has a light receiving surface and comprises a light-sensitive pixel area, wherein the light-sensitive pixel area comprises a plurality of pixel unit areas; forming a plurality of light-trapping grooves in the substrate of the pixel unit areas on the light receiving surface side; forming an isolation groove in the substrate of adjacent pixel unit areas; taking any one of the light-trapping grooves and the isolation groove as a first groove and the other as a second groove; forming a sacrificial layer for filling the second groove; forming a first target structure for filling the first groove and exposing the top of the sacrificial layer; removing the sacrificial layer after forming the first target structure; forming a second target structure for filling the second groove after removing the sacrificial layer; when the light-trapping groove is taken as the first groove, the first target structure is a light-transmitting layer, and the second target structure is a light-blocking structure; when the isolation groove is taken as the first groove, the first target structure is a light-blocking structure, and the second target structure is a light-transmitting layer. The application is beneficial to improving the light-sensing performance of the photoelectric sensor.

The application discloses a photosensitive resin composition and a preparation method thereof, and particularly relates to the technical field of electronic chemicals. In view of the fact that traditional photosensitive resin is difficult to balance the bending performance and heat resistance, the composition is composed of photosensitive resin, photoinitiator, filler, flame retardant and additive. The core lies in that rigid-flexible synergistic design is performed on polyimide and polyurethane acrylate, and the interface adhesion is enhanced in combination with epoxy resin. In the preparation, a process flow of high-temperature dissolution, medium-temperature mixing, fineness control and segmented curing is adopted. The test shows that the adhesion of the prepared resin composition reaches 5B level, the flame retardant level is V-0, the heat distortion temperature is as high as 185 DEG C, and the bending resistance times are more than 10,000 times. The application realizes synchronous improvement of mechanical flexibility and heat stability without sacrificing photosensitivity, has obvious progressiveness, and is particularly suitable for the fields of flexible electronics and high-end packaging.

The invention discloses a negative photosensitive resin composition. The negative photosensitive resin composition comprises the following components: polyimide precursor resin, a triptycenyl cross-linking agent, a photoinitiator, a coupling agent and a solvent. A cured film obtained by carrying out low-temperature heat treatment on the negative photosensitive resin composition at 200 DEG C has excellent mechanical properties, thermal stability and chemical resistance and remarkably reduced dielectric constant.

A device may be configured to decode video data based on information included in a photosensitive content information message. In one example, a photosensitive content information message includes syntax elements indicating information regarding photosensitive content characteristics. In one example, a syntax element specifies whether photosensitive content in pictures in a persistence scope of the photosensitive content information message exceed photosensitivity content guidelines specified by a standard. In one example, a syntax element specifies whether photosensitive content in pictures in the persistence scope of the photosensitive content information message exceed a particular photosensitivity content guideline specified by the standard.

This invention relates to the field of photosensitivity correction technology, and provides a method and system for photosensitivity correction based on dynamic temperature difference compensation. The method includes: in an experimental environment, weighted summation of temperature difference compensation coefficient, distance compensation coefficient, and wavelength compensation coefficient to obtain a comprehensive compensation coefficient; calculating the product of the photosensitivity acquisition value and the comprehensive compensation coefficient to obtain the compensated target photosensitivity value, and performing photoelectric conversion error correction and signal amplification noise filtering to obtain the corrected photosensitivity value; calculating the deviation from the standard photometer data; adjusting the weights according to the deviation using a gradient descent method until the deviation reaches the target, forming a weight lookup table for different temperature values, measurement distances, and illumination wavelengths; in practical applications, determining the weights based on the weight lookup table, and weighted summation of the temperature difference compensation coefficient, distance compensation coefficient, and wavelength compensation coefficient to obtain the comprehensive compensation coefficient, which is used to compensate and correct the photosensitivity acquisition value. The compensation accuracy is significantly improved.

This invention discloses a near-infrared cyclic metallic iridium (III) photosensitizer and its synthesis method. The BDP-Ir prepared by the method of this invention can be used at low doses (IC50). 50 =68nM) at low power (10mW·cm) ‑2 It exhibits high photosensitivity under 808nm excitation, successfully solving the problem of sacrificing both excitation wavelength and photosensitivity efficiency; at the same time, its synergistic biomimetic artificial nano-hybrid delivery system can effectively enhance the tumor targeting and immune escape ability of photosensitizers.

This invention discloses a chemiluminescence gas sensor based on polyoxometalates (POMs), and relates to its fabrication method and application. The sensor is suitable for detecting ammonia at room temperature. The gas sensor includes an adapter base and a sensing element, wherein the sensing element consists of interdigitated electrodes and a sensitive material loaded on the electrode surface. This sensitive material is a composite material of POMs and SnO2. POMs, as excellent electron acceptors, possess good redox properties, thermal stability, and photosensitivity. When combined with SnO2, they can effectively suppress electron-hole recombination, thereby significantly improving the gas-sensing performance of the semiconductor material. Compared with existing technologies, the sensor provided by this invention exhibits high response characteristics to ammonia at room temperature, while also demonstrating excellent selectivity and repeatability.

A photosensitive resin composition comprising (A) a polyimide precursor, (B) a polymerizable monomer not containing a cyclic skeleton, (C) a photopolymerization initiator, and (D) a compound containing an anthracene structure, the content of a polymerizable monomer containing a cyclic skeleton being less than or equal to 20% by mass relative to the total amount of the (A) polyimide precursor.

This invention provides a negative photosensitive composition and a patterning method utilizing a polyimide-based precursor and an oxime ester-based compound. The composition, which leaves no residue after development, accurately displays patterns with an error within 0.5 μm. Compositions exhibiting residue were identified, with a maximum error of 5 μm and severe residue. Therefore, oxime ester-based initiators can effectively reduce residue and improve pattern accuracy.

The application discloses a kind of high transparent rare earth nanoparticles / cage polysilsesquioxane composite photoresist and its preparation method and application, the photoresist includes the composite matrix consisting of cage polysilsesquioxane, multifunctional acrylate and photoinitiator, and the rare earth nanoparticles modified by bifunctional ligand.The bifunctional ligand anchors nanoparticles by first functional group, and forms chemical bonding with matrix by second functional group, realizes the atomic level uniform dispersion of nanoparticle.The photoresist has very high optical transparency, high-efficiency up-conversion luminescence performance and very high ultraviolet photosensitivity.Its preparation process is simple, without high-temperature expensive equipment, can be adapted to a variety of photo-curing technology realizes the integration precision forming of complex three-dimensional structure luminescence device, has wide application prospect in integrated photonics device field.

The application provides a photosensitive resin composition, a resist ink, a resist laminated body and application thereof. The photosensitive resin composition comprises, in parts by weight, 50-70 parts of an alkali-soluble resin, 30-50 parts of a photopolymerizable monomer and 0.1-4.0 parts of a photoinitiator; wherein the photopolymerizable monomer comprises an allyl compound and a mercapto compound, and the mass content of the mercapto compound in the photopolymerizable monomer is 7wt%-22wt%. The application introduces the allyl compound and the mercapto compound into the photosensitive resin composition, the alkyl group in the allyl compound can add polymerize with the mercapto group in the mercapto compound, which helps to make the prepared photosensitive resin have relatively uniform crosslinking after exposure, and obtain a photosensitive resin with low polymerization shrinkage stress, which shows good adhesion in the bonding process of a copper substrate.

This invention belongs to the field of biosensor detection technology, specifically disclosing a carbon dot probe for detecting parathyroid hormone, its preparation method, and its application. The carbon dot probe provided by this invention comprises carbon dots and monoclonal antibodies 1 and 2 covalently coupled to the carbon dot surface. Monoclonal antibodies 1 and 2 specifically recognize the N-terminal and C-terminal epitopes of the parathyroid hormone molecule, respectively. The carbon dots possess aggregation-induced emission (AIE) properties and photosensitivity. This invention's carbon dot probe can achieve a highly sensitive, highly specific, rapid, and dual-mode visual detection method for parathyroid hormone by detecting the dual signal changes of aggregation-induced emission fluorescence enhancement and photocatalytic TMB color development induced by PTH-induced specific aggregation. This invention also provides carbon dots with aggregation-induced emission properties and photosensitivity, as well as a method for preparing the carbon dot probe for detecting parathyroid hormone.

The photosensitive resin composition according to the present application contains: a binder polymer, a photopolymerizable compound, and a photopolymerization initiator, the binder polymer having: a structural unit (a1) derived from a polymerizable monomer having a carboxyl group, a structural unit (a2) derived from styrene or a styrene derivative, a structural unit (a3) derived from an alkyl (meth)acrylate having an alkyl group having 1 to 3 carbon atoms, and a structural unit (a4) derived from an alkyl (meth)acrylate having an alkyl group having 4 to 12 carbon atoms.

This invention provides a process and equipment for the synergistic recovery of metals from waste lithium-ion batteries through mechanical activation and photolysis extraction, relating to the field of metal material recycling technology. The process includes the following steps: Step S1, mixing ternary cathode material and lithium iron phosphate cathode material, washing and drying to remove surface dirt and residual electrolyte, obtaining a mixed cathode material; Step S2, homogenizing the mixed cathode material and ball milling to obtain a pretreated cathode material. This scheme ultimately achieves the destruction of the cathode material's crystal structure through mechanical force, increasing reactivity and metal leaching rate, reducing the amount of chemical reagents used, and utilizing the photosensitivity of ferric oxalate complexes to achieve efficient separation and recovery of iron under light conditions, avoiding the use of additional precipitants, reducing secondary pollution, and featuring advantages such as simple operation, low energy consumption, and no secondary pollution. It effectively achieves efficient separation and purification of multiple metal elements in waste lithium-ion batteries, realizing high-value recovery of valuable metals.

The application is suitable for the terminal technical field, and provides a shooting method, an electronic device, a storage medium and a chip system. The method comprises the following steps: in the case that a shooting instruction is received and a to-be-shot scene in a shooting preview frame is a target scene, shooting at least one group of images; the target scene comprises a fireworks scene; each group of images comprises multiple images with the same exposure time and different exposure amounts which are shot at the same time; an image with a smaller exposure amount in each group of images is shot by a camera with better photosensitive performance, and an image with a larger exposure amount is shot by a camera with poorer photosensitive performance; the shooting time of different groups of images is different; performing first processing on each group of images, so that the field of view, size and resolution of all images in each group of images are all the same; inputting multiple to-be-fused image groups with adjacent shooting time into a trained image denoising fusion model for processing to obtain a fused image, so that the overall quality of a shot fireworks image can be improved.

The application discloses a kind of system-in-package substrate and its processing method, comprising: the intermediate plate formed with ultra-thick copper micro pitch circuit pattern is prepared, the relative length difference between multiple SET plate board edge area B of the intermediate plate and the reentrant lead connected with circuit pattern is not more than 15% respectively made out;Thermally reformed characteristic photosensitive insulating resin film and first ink dry film are stacked on the intermediate plate to fill the micro gap between circuit pattern;Part of the composite insulating film is removed to expose circuit pattern and reentrant lead;Make out solder mask layer and electroplated gold layer, control height difference between electroplated gold layer and solder mask layer ≤5 μm.The processing method is simple, easy to implement, and the system-in-package substrate obtained meets the technical requirements of high-density integrated packaging, ultra-high heat dissipation, resin-filled circuit pattern, ink thickness on copper surface ultra-thin, height difference between soldering surface and solder mask layer ≤5 μm, etc.;Promote the development of system-in-package technology.

A photosensitive resin composition comprising a polyimide precursor having a polymerizable unsaturated bond, and a solvent, the solvent comprising N,N'-dimethylpropanamide.