The application provides a high-robustness
photoresist for physiological electrodes, a manufacturing method and an in-situ manufacturing method of physiological electrodes, and can prepare two
layers of photoresists with an
undercut structure by stacking two
layers of photoresists on each other, wherein the two
layers of photoresists only differ in the concentration of photosensitizers, the concentration difference is adjusted according to the required
undercut profile, and the
mass percentage components include 3-10% film-forming resin, 90-97% deionized water, 0.1-1%
diazo photosensitizer and 0.1-1% surfactant. The surface of a flexible substrate is cleaned by using an
ion beam
etching technology; a
photoresist with low
photosensitizer content is spin-coated to obtain a defect-free low-interface-adhesion transferable
photoresist film; the photoresist with high
photosensitizer content is transferred to the flexible substrate loaded with the photoresist with low photosensitizer content; the flexible substrate loaded with the two layers of photoresists is attached to a hard master
mask plate, and is exposed, so that the pattern of the hard master
mask plate is transferred to the photoresists, a two-layer stacked photoresist pattern with an
undercut structure is formed, high-fidelity replication of the photoetching
mask plate structure is realized, and subsequent peeling is facilitated.