The invention relates to a cyanide-free silver plating solution additive which comprises the following components by ratio: 0.1-10g/ l of brightener, 5-10g/ l of leveling agent, 100-600g/ l of complexing agent and the balance of plasma water, wherein the brightener is one or mixture of more in nitrogen-containing compound, triazole, benzotriazole, 2-hydroxypyridine, pyridine, 22 dipyridyl, 1, 10-phenanthroline, triethylene tetramine and diethylene triamine according to any ratio; the leveling agent is one or mixture of more in aromatic hydrocarbon compounds, naphthalene, 1-methylnaphthalene, 1, 4-naphthoquinone and 1-naphthol according to any ratio; the complexing agent is one or mixture of more in disodium ethylenediamine tetraacetate, niacin, aminosulfonic acid and potassium pyrophosphate according to any ratio. The cyanide-free silver plating solution additive has the beneficial effects that the plating solution is stable, low in toxicity and good in dispersing ability; the obtained plating layer is bright and fine as well as good in binding force; the technology adopts the environment-friendly organic additive which does not contain heavy metal and sulfide; the plating layer is good in corrosion resistance. Furthermore, the cyanide-free silver plating solution additive can be directly used for parts such as brass, copper, chemical nickel and the like, preplating is not needed, and the binding force is also guaranteed.