Electroplating solution for copper plating and preparation method thereof

An electroplating solution and copper plating technology, applied in the field of copper plating, can solve the problems of low hardness, expansion and foaming of the copper plating layer, weak adhesion, etc.

Inactive Publication Date: 2015-11-11
ANHUI JIANGWEI PRECISION IND
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0003] The electroplating solution for copper plating is a very important part of the copper plating process. At present, the main components of the commonly used electroplating solution for copper plating are copper sulfate, potassium tartrate and formaldehyde. The composition of this type of copper plating solution is relatively simple. The copper plating layer obtained by electroplating with electroplating solution will have swelling and blistering, weak adhesion and low hardness

Method used

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preparation example Construction

[0014] The invention provides a preparation method of an electroplating solution for copper plating, the preparation method comprising:

[0015] (1) Mix copper salt, quinone compound, catechol, potassium sulfate, malic acid, 2,2'-bipyridyl, complexing agent, reducing agent, stabilizer and water to prepare mixture M1;

[0016] (2) adding alkali to the mixed solution M1 to adjust the pH value to 11-13 to prepare the mixture M2;

[0017] (3) post-processing the mixture M2 to obtain an electroplating solution for copper plating;

[0018] Wherein, the quinone compound is one or more of 1,2-anthylquinone, 1,4-anthylquinone and anthraquinone.

[0019] In the present invention, the specific type of copper salt can be selected in a wide range. In order to dissolve in water quickly, preferably, the copper salt is one or more of copper chloride, copper sulfate pentahydrate and copper nitrate .

[0020] Likewise, the kind of complexing agent also has diversity, in order to make complex...

Embodiment 1

[0030] (1) At 25°C, add copper chloride, 1,2-diaminoquinone, catechol, potassium sulfate, malic acid, 2,2'-bipyridine, diaminoethane tetraacetate, glyoxal, Sodium sulfite and water (weight ratio: 100:35:15:7:12:6:13:14:4:220) were mixed to prepare mixture M1;

[0031] (2) Add lithium hydroxide to the mixed solution M1, adjust the pH value to 12, and prepare the mixture M2;

[0032] (3) Concentrate the mixture M2 under 1 Pa until the water content is 30% to prepare the electroplating solution A1 for copper plating.

Embodiment 2

[0034] (1) At 25°C, add copper sulfate pentahydrate, 1,4-tetraquinone, catechol, potassium sulfate, malic acid, 2,2'-bipyridine, cyclohexanediaminetetraacetic acid, trimer Formaldehyde, polyoxyethylene sorbitan monostearate and water (weight ratio 100:30:12:5:10:4:11:10:2:150) were mixed to prepare mixture M1;

[0035] (2) Add sodium hydroxide to the mixed solution M1, adjust the pH value to 11, and prepare the mixture M2;

[0036] (3) Concentrate the mixture M2 under 0.5 Pa until the water content is 25% to prepare the electroplating solution A2 for copper plating.

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PUM

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Abstract

The invention discloses an electroplating solution for copper plating and a preparation method thereof. The method comprises the steps that (1) copper salt, a quinonyl compound, catechol, potassium sulfate, malic acid, 2,2'-dipyridyl, complexing agents, reducing agents, stabilizer and water are mixed, and a mixture M1 is obtained; (2) alkaline is added to the mixture M1, the pH value is adjusted to 11-13, and a mixture M2 is obtained; and (3) the mixture M2 is post-processed, and the electroplating solution for copper plating is obtained. The quinonyl compound is one or several of 1,2-naphthoquinone, 1,4-naphthoquinone and anthraquinone. The electroplating solution for copper plating prepared through the method is stable in performance, and a copper-plated layer obtained through electroplating with the electroplating solution for copper plating is high in adhesive force, large in hardness and not prone to expanding and blistering.

Description

technical field [0001] The invention relates to the field of copper plating, in particular to an electroplating solution for copper plating and a preparation method thereof. Background technique [0002] In industrial production, some metals such as iron, aluminum, etc. will be corroded slowly and lose their original functions during long-term storage. Therefore, people often use electroplating to plate copper on the surface of these metals, which can not only prevent these The metal is corroded, and it can also improve the conductivity of the metal and reduce friction with other parts. [0003] The electroplating solution for copper plating is a very important part of the copper plating process. The main components of the commonly used electroplating solution for copper plating are copper sulfate, potassium tartrate and formaldehyde. The composition of this type of copper plating solution is relatively simple. The copper plating layer obtained by electroplating with electr...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C25D3/38
Inventor 沈福建高亮刘勇童翔
Owner ANHUI JIANGWEI PRECISION IND
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