Nanometer conductive silver paste and preparing method thereof

A nano-conductive and silver paste technology, which is applied in the manufacture of cables/conductors, conductive materials dispersed in non-conductive inorganic materials, circuits, etc., to achieve the effects of stable silver paste properties, high conductivity, and cost savings

Inactive Publication Date: 2014-12-24
NANO TOP ELECTRONICS TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0006] Although Teslin has been widely used in the printed electronics industry due to its unique and excellent material properties, there is currently no special screen printing silver paste designed for Teslin substrates. The material has the characteristics of high conductivity, high adhesion, high water resistance and corrosion resistance, and high hardness

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0031] A kind of nano conductive silver paste, its composition and the mass percent of each component are as follows:

[0032] Polymethylmethacrylate: 0.2%

[0033] Silicone oil: 0.06%

[0034] Hydroxypropyl Methyl Cellulose: 0.4%

[0035] Macrogol 40000: 0.01%

[0036] Adipate: 5%

[0037] Sodium hexametaphosphate and sodium pyrophosphate: 0.5%

[0038] Dimethicone: 0.5%

[0039] Ethanol: 10%

[0040] Ethylene glycol monomethyl ether: 10%

[0041] Silver powder: 73.9%

[0042] The preparation steps of described nano-silver paste are as follows:

[0043] a), according to a certain mass ratio, fully dissolve the thickener, dispersant, and leveling agent into the mixed solvent of ethanol and ethylene glycol monomethyl ether;

[0044] b), adding polymethyl methacrylate and silicone oil to the above mixed solvent to prepare a slurry solvent carrier;

[0045] c), add hydroxypropyl methylcellulose, polyethylene glycol 40000, add nano-silver powder after dispersing evenly, ...

Embodiment 2

[0048] A kind of nano conductive silver paste, its composition and the mass percent of each component are as follows:

[0049] Polyethylmethacrylate: 0.5%

[0050] Silicone oil: 0.03%

[0051] Sodium carboxymethylcellulose: 0.01%

[0052] Polyvinylpyrrolidone: 0.05%

[0053] Dibutyl phthalate: 0.01%

[0054] Sodium tripolyphosphate: 0.5%

[0055]Dimethicone: 0.5%

[0056] Diethylene glycol: 5%

[0057] MTBE: 5%

[0058] Nano silver powder: 88.4%

[0059] Its concrete preparation process sees embodiment 1

[0060] After testing, the viscosity is 18000mpa·s and the appearance is dark red. Printed on Teslin substrate with 200 mesh screen, sintered at 150°C for 3min, the line thickness is 4μm, and the conductivity is 2*10 7 Ω -1 m -1 , the hardness is 4H, and the adhesion is 5A.

Embodiment 3

[0062] A kind of nano conductive silver paste, its composition and the mass percent of each component are as follows:

[0063] Poly(2-hydroxyethyl acrylate): 1%

[0064] Silicone oil: 1%

[0065] Ethylcellulose: 2%

[0066] Polyethylene oxide: 2%

[0067] Polyester phthalate: 2%

[0068] Sodium tripolyphosphate: 1%

[0069] Polymethylphenylsiloxane: 1%

[0070] Terpineol: 10%

[0071] Methyl ether: 10%

[0072] 60nm nano silver powder: 70%

[0073] Its concrete preparation process sees embodiment 1

[0074] The viscosity is 23000mpa.s, and the appearance is yellow. Printed on Teslin substrate with 300 mesh screen, sintered at 150°C for 3min, the line thickness is 5μm, and the conductivity is 1.3*10 7 Ω -1 m -1 , the hardness is 4H, and the adhesion is 5A.

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Abstract

The invention relates to a nanometer conductive silver paste and a preparing method thereof. The nanometer conductive silver paste is characterized in that mass percentage content of the components are as follows: 20-90% of a silver powder, 0.01-5% of a high-molecular resin, 0.01-5% of an organic silicone oil, 0.01-10% of a thickening agent 1, 0.01-5% of a thickening agent 2, 0.01-5% of a plasticizer, 0.5-1% of a dispersant, 0.5-1% of a leveling agent, 5-20% of a solvent 1, and 5-20% of a solvent 2. The nanometer conductive silver paste of the invention has a remarkable low-temperature sintering property and saves energy. A formed circuit has advantages of high conductivity, high adhesiveness and high hardness. A selected Teslin substrate is degradable and environment-friendly. The nanometer conductive silver paste has wide application prospect in paste application fields of RFID electronic label, LED circuit board, touch screen circuit, etc.

Description

technical field [0001] The invention relates to a conductive paste, in particular to a nano-conductive silver paste suitable for screen printing on a Teslin substrate and a preparation method thereof, belonging to the field of electronic paste preparation. Background technique [0002] As the electronic information industry enters a stage of rapid development, the electronic paste and ultra-fine silver powder industry has also made great progress. Electronic paste integrates metallurgy, chemical industry and electronic technology, and is a high-tech electronic functional material. [0003] Because metallic silver has the highest electrical conductivity and excellent physical and chemical properties, silver conductive paste series products are the most widely used and the largest amount of precious metal paste in the electronics industry. The basic functional materials of device products are mainly used in the manufacture of thick film integrated circuits, capacitors, solar ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01B1/22H01B13/00
Inventor 聂宜文张兴业吴丽娟邱雄鹰宋延林
Owner NANO TOP ELECTRONICS TECH
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