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2 results about "Printed electronics" patented technology

Printed electronics is a set of printing methods used to create electrical devices on various substrates. Printing typically uses common printing equipment suitable for defining patterns on material, such as screen printing, flexography, gravure, offset lithography, and inkjet. By electronic industry standards, these are low cost processes. Electrically functional electronic or optical inks are deposited on the substrate, creating active or passive devices, such as thin film transistors; capacitors; coils; resistors. Printed electronics is expected to facilitate widespread, very low-cost, low-performance electronics for applications such as flexible displays, smart labels, decorative and animated posters, and active clothing that do not require high performance.

Aircraft cabin component and method for manufacturing an aircraft cabin component

ActiveCN112166071Benhance chemical affinityenhanced interactionFuselage framesNacelleFlight vehicle
An aircraft cabin component for use in an aircraft cabin of an aircraft includes a component having at least one parameterized surface. A flexible OLED display assembly is adhered to the at least one parameterized surface of the component and closely conforms to the curvature of the at least one parameterized surface. The flexible OLED display assembly includes a printed electronics layer and an array of OLEDs deposited on the printed electronics layer.
Owner:AIRBUS OPERATIONS GMBH

High adhesive strength copper paste, its preparation method and application

PendingCN122337727AMicro nanoSilver paste
This invention provides a high-adhesion-strength copper paste, its preparation method, and its applications. By weight, the high-adhesion-strength copper paste comprises 80-92 parts of micro / nano copper powder and 8-20 parts of an organic carrier, which includes a mixed epoxy resin, a mixed curing agent, a diluent, a filler, and a coupling agent. This invention combines dual-reactive-site epoxy resin, multi-reactive-site epoxy resin, and silicone-modified epoxy resin, and further utilizes mixed curing agents with different activities to achieve enhanced and toughened effects. This results in copper paste products with excellent adhesion and aging resistance, enabling uniform dispersion of copper particles in the paste. Even after freezing and standing, it maintains stable performance without phase separation during long-term storage. The significant improvement in adhesion strength (i.e., shear strength) during curing further enhances the reliability and durability of the product, making it suitable for most printed electronics fields. It can replace existing silver pastes to reduce costs and increase efficiency in industry production.
Owner:ENOVATE3D (HANGZHOU) TECH DEV CO LTD