This invention provides a high-adhesion-strength
copper paste, its preparation method, and its applications. By weight, the high-adhesion-strength
copper paste comprises 80-92 parts of micro /
nano copper powder and 8-20 parts of an organic carrier, which includes a mixed
epoxy resin, a mixed curing agent, a
diluent, a filler, and a
coupling agent. This invention combines dual-reactive-site
epoxy resin, multi-reactive-site
epoxy resin, and
silicone-modified epoxy resin, and further utilizes mixed curing agents with different activities to achieve enhanced and toughened effects. This results in
copper paste products with excellent adhesion and
aging resistance, enabling uniform dispersion of copper particles in the paste. Even after freezing and standing, it maintains stable performance without phase separation during long-term storage. The significant improvement in
adhesion strength (i.e.,
shear strength) during curing further enhances the reliability and durability of the product, making it suitable for most
printed electronics fields. It can replace existing silver pastes to reduce costs and increase efficiency in industry production.