Systems and methods for implementing digital vapor phase patterning using variable data digital lithographic printing techniques

Abstract

A system and method are provided for implementing a unique scheme by which to execute digital vapor phase patterning on metals, semiconductor substrates and other surfaces using a proposed variable data digital lithographic image forming architecture or technique. For certain substrate printing and manufacturing applications, including some printed electronics applications, the disclosed schemes implement techniques to digitally pattern metal layers with bulk material properties in a manner that is aligned with underlying layers on the fly. The disclosed digital printing process may pattern a release oil on a substrate in support of a metal deposition process. Changeable patterning is implemented with an ability to modify the alignment of the patterns on-the-fly. The release layer on a drum is laser patterned in order that the patterned release layer is transferred to the substrate, or the patterning of the release layer is accomplished directly on the substrate.

Description

BACKGROUND[0001]1. Field of Disclosed Subject Matter[0002]This disclosure relates to systems and methods that provide unique techniques by which to implement digital vapor phase patterning on metals, semiconductor substrates and other surfaces using a proposed variable data digital lithographic image forming architecture.[0003]2. Related Art[0004]For a decade or so, it has been well known in certain fields, including in the manufacture of semiconductor devices, to deposit and patterned thin layers to a number of beneficial results, including the patterning of certain semiconductor devices. Variations in the deposition and patterning steps define the function of the manufactured device and a density of individually patterned elements on the substrate.[0005]A common patterning method for the deposited layers involves an optical patterning, and using related processes. In a photolithographic process, for example, a substrate coated with a photosensitive resist layer deposited thereon i...

AI Technical Summary

Benefits of technology

The patent describes an imaging member that includes a thin layer of reimageable surface over a structural mounting layer. This member has good printing or marking performance, durability, and can be easily manufactured. The patent also discusses a metal patterning process that eliminates the need for resist removal and post- process cleaning.

Problems solved by technology

As shown in the above example of a conventional patterning process, such as a patterning technique for semiconductor substrates, metals or other layered products, require a complex and complicated number of steps to accomplish the patterning of the layer of material.

While inkjet provides an avenue by which to accomplish this in certain restricted scenarios, the inkjet process suffers from an inability to accurately and positively jet, for example, metals onto a substrate surface.

A problem with the VAST Process, however, is that on-the-fly alignment of multiple layers, where multiple layer deposition is preferred or required, is difficult.

The components tend to drift over time making, for example, flexible electronics circuit alignments in a roll-to-roll process difficult.

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