248results about How to "Reduce alignment errors" patented technology

A minimally-invasive surgical system includes a slave surgical instrument having a slave surgical instrument tip and a master grip. The slave surgical instrument tip has an alignment in a common frame of reference and the master grip, which is coupled to the slave surgical instrument, has an alignment in the common frame of reference. An alignment error, in the common frame of reference, is a difference in alignment between the alignment of the slave surgical instrument tip and the alignment of the master grip. A ratcheting system (i) coupled to the master grip to receive the alignment of the master grip and (ii) coupled to the slave surgical instrument, to control motion of the slave by continuously reducing the alignment error, as the master grip moves, without autonomous motion of the slave surgical instrument tip and without autonomous motion of the master grip.

A coolant tube and electrode are adapted to mate with each other to align the tube relative to the electrode during operation of the torch. Improved alignment ensures an adequate flow of coolant along an interior surface of the electrode. In one aspect, an elongated body of the coolant tube has a surface adapted to mate with the electrode. In another aspect, an elongated body of the electrode has a surface adapted to mate with the coolant tube. The surfaces of the tube and electrode may, for example, be flanges, tapered surfaces, contours, or steps.

The invention relates to a method for correcting at least one error on wafers processed by at least one photolithographic mask, the method comprises: (a) measuring the at least one error on a wafer at a wafer processing site, and (b) modifying the at least one photolithographic mask by introducing at least one arrangement of local persistent modifications in the at least one photolithographic mask.

A method of determining positioning error between lithographically produced integrated circuit patterns on at least two different lithographic levels of a semiconductor wafer comprising. The method includes exposing, developing and etching one or more lithographic levels to create one or more groups of marks comprising a target at one or more wafer locations. The method then includes exposing and developing a subsequent group of marks within the target on a subsequent lithographic level. The method then comprises measuring the position of the marks on each level with respect to a common reference point, and using the measured positions of the groups of marks to determine the relative positioning error between one or more pairs of the developed and etched lithographic levels on which the marks are located.

Reducing alignment errors between a read element and corresponding write elements permits narrower data tracks and, hence, greater data density on magnetic tape. A method for manufacturing a thin film tape head having multiple write elements and at least one read element corresponding to each write element is provided. Excess material is trimmed from each write element to align the write element with corresponding read elements. The excess material may be track trimmed using a focused ion beam.

The invention relates to a reflection-type TFT (Thin Film Transistor) LCD (liquid crystal display) and a making method thereof. A light absorption layer is arranged below a reflection surface, rays can enter the light absorption layer below the reflection surface through a light absorption gap and can be absorbed by the light absorption layer without irradiating the upper surface of a driving part to cause the failure of the driving part. Accordingly, the light absorption layer can substitute a black light-shielding layer in the prior art, and a black border region is formed between two adjacent pixels. The pixel electrodes or the reflection layer is extremely thin, and the pattern making thereof has extremely high accuracy so that the pattern of the black border region also has extremely high accuracy. Moreover, the black border region and the pixel electrodes are formed on the same substrate, the problem of pattern pasting contraposition errors among different substrates is inessential, and contraposition errors of different film layers of the same substrate are generally very small so that the black border region can be designed very narrow to acquire a larger pixel reflection display area and an effective reflection area ratio.

A semiconductor die package is disclosed. The semiconductor die package includes a semiconductor die comprising an input at a first top semiconductor die surface and an output at a second bottom semiconductor die surface. A leadframe having a first leadframe surface and a second leadframe surface opposite the first leadframe surface is in the semiconductor die package and is coupled to the first top semiconductor die surface. A clip having a first clip surface and a second clip surface is coupled to the second bottom semiconductor die surface. A molding material having exterior molding material surfaces covers at least a portion of the leadframe, the clip, and the semiconductor die. The first leadframe surface and the first clip surface are exposed by the molding material, and the first leadframe surface, the first clip surface, and the exterior molding material surfaces of the molding material form exterior surfaces of the semiconductor die package.

The invention provides an aligning system and an aligning method for a lithography equipment, which adopts two or more groups of amplitude-type reference grating and aligning marks of different periods; each branch grating of the reference grating and the aligning marks consist of bar-shaped structures with equidifferent arrangement widths so as to lead the scanning intensity signal peak to be sharper and improve the reliability of the aligning system; during the aligning process, only (plus and minus) 1 stage of diffracted beam with aligned marks is used; after the small period grating coherent image and corresponding reference gratings in the aligned marks are scanned, the obtained scanning signal intensity peak is used as coarse capture; based on coarse capture, the precise capture information is obtained by the phase information of the large period grating coherent images in the aligned marks; furthermore, the phase information obtained by scanning the large period grating coherent image and the corresponding reference grating in the aligned marks is used for precise alignment; and the alignment position error caused by asymmetric deformation of the alignment marks is reduced, the complexity of the optical system is reduced and the utilization ratio of the optical energy is improved.

The present invention discloses an alignment system, an alignment mark and an alignment method for photoetching devices, as well as a photoetching device. By detecting light intensity changes of +-1 grade diffraction light of a first grating, a second grating and a third grating of the alignment mark on an image plane, wherein the +-1 grade diffraction light is modulated via a reference grating after coherent imaging, the center position of the alignment mark is acquired through the phase information of transmitted light signals, wherein the rough position information of the alignment mark is acquired through the alignment signals of the first grating and the second grating of the alignment mark; the exact position information of the alignment mark is acquired through the alignment signals of the third grating of the alignment mark. The alignment system reduces alignment position error caused by the asymmetrical deformation of the alignment mark, effectively solves the problems of signal crosstalk, improves the energy utilization ratio of a light source, and is beneficial to improve the intensity of alignment signals and the dynamic range of detection.

The invention discloses an aligning correction device and method for space navigation detector ground calibration. Accuracy aligning of an X radiation source and a detector can be achieved through the device, and the parallel aligning error is less than 0.02 degree and the central aligning error is less than 1mm. The device comprises a front-vehicle optical measuring platform and a rear-vehicle optical measuring platform. A detector is fixedly installed on the front-vehicle optical measuring platform. An X radiation source is fixedly installed on the rear-vehicle optical measuring platform. The front-vehicle and rear-vehicle optical measuring platforms are located at front and rear ends of a vacuum beam line channel respectively. Firstly, parallelism aligning is carried out, the posture of the front-vehicle or rear-vehicle optical measuring platform is adjusted, and thus an image of a laser light spot is located at an imaging center of a parallelism measuring CCD camera; then height and horizontal displacement aligning is carried out, the posture of the front-vehicle or rear-vehicle optical measuring platform is adjusted, thus the image of the laser light spot is located at the imaging center of the displacement measuring CCD camera, and finally aligning of the X radiation source and the detector is achieved.

Integrated circuit device comprising a conductive layer and a poly-crystalline silicon layer, wherein the integrated circuit device further comprises an intermediate counter-stress layer. This intermediate counter-stress layer is arranged between the poly-crystalline silicon layer and the conductive layer, and enables stress-reduced crystallization of the poly-crystalline silicon layer. Further, the intermediate counter-stress layer is amorphous at and below a poly-silicon crystallization temperature.

The invention discloses a self-reference interference alignment system for photoetching equipment. The system comprises a laser light source module, an optical module, a signal acquisition module and a processing module, wherein the laser light source module is used for providing illumination beams; the optical module is used for marking the illumination beams to form a diffraction optical signal; the signal acquisition module is used for processing the optical signal to acquire a light intensity signal; the processing module is used for processing the light intensity signal to acquire an alignment position by combining position data of a workpiece table; the optical module comprises a first optical channel and a second optical channel; an optical signal in the second optical channel is processed to be used for eliminating optical noises in the first optical channel.

A device for measuring the draft of a vessel including a tube of a known length having a lower end adapted to be immersed in water a fixed distance from a main deck or other reference point on the vessel, and a pressure sensor directly mounted at the lower end of the tube to measure the pressure head of the water at the lower end of the tube. The pressure at the lower end of the tube is used to determine the distance between a fixed reference point (draft line) on the side of the vessel and the actual surface of the water. This depth is then used to calculate the depth of the hull beneath the surface of the water or the draft of the vessel.

A plasma display panel (PDP) with alignment structure. A first alignment pattern is disposed on a rear substrate and formed by a rib structure. A second alignment pattern is disposed on a front substrate disposed opposite, over the rear substrate and corresponds to a space defined by the first alignment pattern. The first and second alignment patterns are disposed outside of the display area of the plasma display panel.

The invention discloses a quick clamping and alignment method and a fixture for milling arc segments of a stationary blade grid and belongs to the technical field of machining of steam turbines. According to the quick clamping and alignment method and the fixture for milling the arc segments of the stationary blade grid, the principle that three points form a plane is utilized, and quick clamping and alignment of the arc segments of the stationary blade grid are achieved through three-point locating and three-point auxiliary supporting; in the application process, adjustment is convenient, operation is easy, the application range is large, the defects that the arc segments of the stationary blade grid have many specifications, the locating accuracy of arc surfaces of the arc segments of the stationary blade grid in the actual machining process is hard to guarantee due to the structure of the arc segments, and a conventional clamping and alignment device is low in universality are overcome, and the alignment efficiency and accuracy are improved; meanwhile, in the method, a modular design thought is adopted for the corresponding clamping and alignment fixture, so that the universality of the device is greatly improved, and operation is convenient, fast and flexible.

A protective device including a substrate, a conductive section and a bridge element is provided. The conductive section is supported by the substrate, wherein the conductive section comprises a metal element electrically connected between first and second electrodes. The metal element serves as a sacrificial structure having a melting point lower than that of the first and second electrodes. The bridge element spans across the metal element in a direction across direction of current flow in the metal element, wherein the bridge element facilitates breaking of the metal element upon melting.