Aligning mark used for photolithography equipment aligning system and its use method
A technology for aligning marks and aligning systems, applied in the direction of microlithography exposure equipment, optics, photoplate making process of pattern surface, etc. The assembly and adjustment requirements are very high, so as to improve the alignment signal strength and the dynamic range of detection, reduce the alignment position error, and improve the energy utilization rate.
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[0039] The specific embodiments of the present invention will be further described below with reference to the accompanying drawings.
[0040] figure 1 The general layout and working principle structure diagram between the alignment system of the lithography apparatus used in the present invention and the lithography apparatus are shown. The composition of the lithography apparatus includes: an illumination system 1 for providing an exposure beam; a mask holder and a mask stage 3 for supporting a reticle 2, and the reticle 2 has a mask pattern and an alignment mark with a periodic structure RM; projection optical system 4 for projecting the mask pattern on the reticle 2 to the silicon wafer 6; a silicon wafer holder and a silicon wafer stage 7 for supporting the silicon wafer 6, and the silicon wafer stage 7 is engraved with fiducial marks FM reference plate 8, alignment marks with periodic optical structures on silicon wafer 6; off-axis alignment system 5 for mask and wafer ...
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