Thermally enhanced thin semiconductor package

Abstract

A semiconductor die package is disclosed. The semiconductor die package includes a semiconductor die comprising an input at a first top semiconductor die surface and an output at a second bottom semiconductor die surface. A leadframe having a first leadframe surface and a second leadframe surface opposite the first leadframe surface is in the semiconductor die package and is coupled to the first top semiconductor die surface. A clip having a first clip surface and a second clip surface is coupled to the second bottom semiconductor die surface. A molding material having exterior molding material surfaces covers at least a portion of the leadframe, the clip, and the semiconductor die. The first leadframe surface and the first clip surface are exposed by the molding material, and the first leadframe surface, the first clip surface, and the exterior molding material surfaces of the molding material form exterior surfaces of the semiconductor die package.

Description

CROSS-REFERENCES TO RELATED APPLICATIONS[0001]Not ApplicableBACKGROUND[0002]Semiconductor die packages are known in the semiconductor industry, but could be improved. For example, electronic devices such as wireless phones and the like are becoming smaller and smaller. It is desirable to make thinner semiconductor die packages so that they can be incorporated into such electronic devices. It would also be desirable to improve upon the heat dissipation properties of conventional semiconductor die packages.[0003]Another technical challenge that exists is in the formation of such semiconductor die packages. A clip and a leadframe may sandwich a semiconductor die in an exemplary semiconductor die package. If the clip and the leadframe are not properly aligned with each other and the semiconductor die, then the manufactured semiconductor die package could be defective and rework may be needed.[0004]Embodiments of the invention address these and other problems, individually and collective...

AI Technical Summary

Benefits of technology

[0064]Embodiments of the invention have a number of advantages. Embodiments of the invention may have some, none or all of the following advantages. First, by exposing portions of the leadframe and clip through the molding material, the packages are quite thin and can be used in thin devices such as wireless phones, PDAs, etc. Second, since larger surfaces of the clip and the leadframe are exposed, heat can easily dissipate from a semiconductor die within a semiconductor die package according to an embodiment of the invention. Third, bigger die sizes can be mounted using the same standard footprint. Fourth, as noted above, a clip can be properly aligned with a die and a leadframe using a hook, thereby reducing potential alignment errors during manufacturing. Fifth, no deflash process and plating processes are needed if a pre-plated frame is used. Sixth, embodiments of the invention are flexible and can use both copper stud bumping and electroless NiAu bumps as well. Such bumps may be present on the previously described dies. Seventh, embodiments of the invention are robust and can be used in applications such as automotive applications. Eighth, there is no need to use a film assisted mold process since both sides of the package can be in metal-to-metal contact with the surfaces of a mold cavity.

Problems solved by technology

Another technical challenge that exists is in the formation of such semiconductor die packages.

If the clip and the leadframe are not properly aligned with each other and the semiconductor die, then the manufactured semiconductor die package could be defective and rework may be needed.

Images