129 results about "Semiconductor industry" patented technology

The invention relates to the technical field of monitoring and detection, and discloses an intelligent early warning method and system for gaseous pollutants in the semiconductor industry, and the method comprises the steps: analyzing the molecular weight of the gaseous pollutants according to the mass-to-charge ratio in an original mass spectrum signal, and analyzing the pollutant type and concentration space-time distribution matrix of the gaseous pollutants according to the molecular weight; carrying out pollution source analysis on the gaseous pollutants according to the pollutant types and the concentration space-time distribution matrix; analyzing the concentration contribution rate of the target pollution source by using the pollutant component characteristics, and analyzing the multi-stage dynamic early warning condition of the gaseous pollutants according to the concentration contribution rate and the concentration spatial-temporal distribution matrix; when the pollutant concentration data in the concentration space-time distribution matrix exceeds a multi-stage dynamic early warning condition, triggering a graded early warning signal of gaseous pollutants in the semiconductor industrial environment; and adaptively executing a control strategy corresponding to the gaseous pollutants in the semiconductor industrial environment based on the graded early warning signal. According to the invention, the accuracy of intelligent early warning of gaseous pollutants in the semiconductor industry can be improved.

The invention discloses a photosensitive polyimide, a negative photoresist and an application of the photosensitive polyimide in preparation of a film, the structure of the photosensitive polyimide is shown in the specification, X is a tetravalent organic group and is a residue X of a polyimide polymerization monomer tetracarboxylic dianhydride; y is a divalent organic group and is a residue Y of a polyimide polymerization monomer diamine; r1 and R2 are monovalent organic groups and are residues of primary alcohol forming side chain ester bonds of side chain polyamic acid ester; side chains R1 and R2 at least contain tertiary amine structures, and at least one of the side chains R1 and R2 containing the tertiary amine structures can form ammonium salt with phosphate containing an allyl structure; and n is an integer from 2 to 150. The invention provides a photosensitive polyimide which can be developed by adopting an alkaline aqueous solution, can be cured at low temperature and can form a negative pattern, a preparation method of a photoresist composition of the photosensitive polyimide, and a photoetching curing film, which can be applied to display industry or semiconductor industry as an insulating layer, a passivation layer or an interlayer dielectric layer and the like.

The invention discloses a semiconductor industry wastewater treatment system and a configuration method, the semiconductor industry wastewater treatment system comprises an ultrafiltration device, a reverse osmosis device and a gas-liquid separation device between the ultrafiltration device and the reverse osmosis device, the system uses a tangential inflow assembly to cooperate with a flow guide assembly in a rotational flow area to force fluid to rotate and descend, and microbubbles in ultrafiltration effluent are separated through centrifugal force; releasing the protective gas by using the scavenging assembly to replace the separated gas and reduce the dissolved oxygen; liquid surface bubbles are physically prevented from entering the downstream through an anti-vortex component with the top closed and the side wall provided with holes in the liquid outlet assembly. According to the semiconductor industry wastewater treatment system, the problems of high-pressure pump cavitation, reverse osmosis membrane air resistance and oxidation pollution blockage caused by microbubbles and high dissolved oxygen are effectively solved, the stability of the system is remarkably improved, and the service life of equipment is prolonged.

1. Name of the product in this design: Welding apparatus. 2. Application of this design: for welding airtight pressure vessels in the semiconductor industry. 3. The key design feature of this product is its shape. 4. The image or photograph that best illustrates the design's key points: 3D view 1.

This invention discloses an isotope abundance detection method and system based on the centroid method of emission spectroscopy, belonging to the fields of analytical chemistry and spectroscopic analysis technology. This method measures the centroid position of the atomic spectral lines or molecular spectral bands of the target element, utilizing the quantitative relationship between the centroid position and isotope abundance to achieve rapid, accurate, and low-cost detection of isotope abundance. This invention is the first to systematically establish a complete theoretical framework for the use of the centroid method of emission spectroscopy for isotope abundance detection, revealing the strict linearity conditions between the centroid and abundance, as well as the sources of error. This method is applicable to various excitation sources such as microwave plasma, inductively coupled plasma, and laser-induced breakdown plasma, covering both atomic and molecular spectroscopy detection modes, significantly reducing the resolution requirements of the spectrometer and exhibiting good noise interference resistance. This invention can be widely applied in fields such as nuclear engineering, semiconductor industry, environmental science, geochemistry, and medicine.

The invention relates to a silicon carbide crystal growth crucible suitable for a resistance method, and belongs to the technical field of semiconductor material preparation. The crucible comprises a side wall, a bottom, an upper cover and an inner cavity defined by the side wall and the bottom. The side walls comprise the upper side wall and the lower side wall, and the inner cavity is correspondingly divided into an upper cavity and a lower cavity. The upper cavity is an equal-diameter cylinder, and the lower cavity is in a frustum shape which is gradually expanded from top to bottom. The structure can obviously optimize the thermal field distribution of a raw material area, increase the axial temperature gradient to strengthen the conveying power, reduce the radial temperature gradient, effectively inhibit parasitic crystallization on the surface of powder, and improve the raw material utilization rate and the gas-phase conveying stability. Through active geometric design, a thermal field, a flow field and a material field are cooperatively regulated and controlled, key equipment support is provided for growth of high-quality and large-size silicon carbide single crystals, and the method has important engineering value for promoting industrial development of wide bandgap semiconductors.

A production system, production method and application of general-purpose high-purity chemicals are disclosed. The production system includes a raw material tank, and an adsorption system, a crystallizer, a first light-impurity removal tower, a first heavy-impurity removal tower, a second light-impurity removal tower, a motorized tower, a second heavy-impurity removal tower, a vapor permeation device, a membrane separation system and a filling system connected with the raw material tank in sequence. The high-purity chemicals produced by the above system have high purity and excellent quality. Compared with the prior art, the system and method designed by the present disclosure have more pertinence, integrity, progressiveness, energy-saving, precision, high safety coefficient and great industrial promotion value. And the products produced are of excellent quality, which can meet the standards applied to the manufacturing of integrated circuit electronic components and meet the high-end needs of the semiconductor industry market.

This invention discloses a high-purity 316L stainless steel for semiconductor manufacturing equipment and its production method. It belongs to the field of iron and steel metallurgy technology. This invention employs a process route of molten iron pretreatment + converter roughing + VOD vacuum refining + LF refining + ingot casting + vacuum consumable archive refining (VAR) single vacuum process. Through source impurity control, deep decarburization and deoxidation, precise temperature control, optimized solidification, and single vacuum refining, ultra-low oxygen, hydrogen, and sulfur content and trace inclusions in the steel are achieved. The prepared stainless steel fully meets the stringent requirements of semiconductor equipment. This invention features a simple process flow, low manufacturing cost, and high industrialization feasibility, enabling domestic substitution and enhancing the self-reliance and controllability of the semiconductor industry chain.

The invention relates to a dynamic scheduling method for autonomous navigation type cross-regional transfer of a chemical stock solution, and belongs to the technical field of semiconductor industry and FAB factory material transfer. The method comprises the following steps: acquiring an acid barrel cross-region transfer request, and analyzing acid barrel characteristic parameters and target region information in the request; constructing a transportation task model for the acid barrel, wherein the transportation task model outputs a safety priority for scheduling and sorting and a dynamic comprehensive constraint set for path planning; distributing the task to a scheduling queue according to the security priority; based on the security priority and the dynamic comprehensive constraint set, matching an autonomous navigation carrying AGV for the task; planning an initial transfer path for the matched AGV; and in the task execution process of the AGV, the state of the acid barrel and the operation environment of the AGV are monitored in real time, and a path is dynamically adjusted or a safety emergency mechanism is triggered based on the dynamic comprehensive constraint set until the acid barrel safely reaches the target area. And efficient, safe and intelligent management of the acid barrel in the cross-region transfer process is realized.

The invention relates to a cleaning agent used after SiC substrate grinding and a preparation method thereof, and relates to the field of semiconductor cleaning agents, and the cleaning agent is prepared from the following raw materials by mass: 4-8% of an anionic surfactant, 2-6% of a nonionic surfactant, 2-6% of a cleaning auxiliary agent, 8-12% of sodium hydroxide, 2-4% of a bio-based modified antistatic agent, and the balance of water. The preparation method comprises the following steps: heating water, adding sodium hydroxide, stirring, adding the cleaning aid, stirring, adding the premixed anionic surfactant and nonionic surfactant, stirring, adding the bio-based modified antistatic agent, stirring, cooling, and filtering to obtain the cleaning agent for grinding the SiC substrate. The cleaning agent has a good cleaning effect, can effectively remove impurities after grinding, and meets the requirement of the semiconductor industry for high-quality cleaning of SiC wafers.

The invention relates to the technical field of shaft sleeve type part carrying in the semiconductor industry, in particular to a shaft sleeve type workpiece double-clamping feeding and discharging device and a working method of the shaft sleeve type workpiece double-clamping feeding and discharging device. The support is an L-shaped plate integrally formed by a horizontal plate and a vertical plate, the clamping jaw mechanism is installed on the vertical plate and used for clamping a workpiece sleeve and a workpiece shaft of the shaft sleeve type workpiece at the same time, and the horizontal plate is matched with a robot arm to complete feeding and discharging. The air cylinder is used for pushing the large clamping jaw and the small clamping jaw to conduct clamping at the same time, it is guaranteed that shaft sleeves are concentric, and secondary assembly is not needed; the clamping jaw mechanism is driven by the robot arm to move, two parts of the shaft sleeve are carried at the same time, automatic feeding and discharging are completed, the labor intensity of workers is relieved, and efficiency is improved. By means of the shaft sleeve type workpiece double-clamping feeding and discharging device, automatic integration of simultaneous carrying of two kinds of shaft sleeve parts can be completed, the labor intensity of workers is relieved, the efficiency is improved, and the quality is stabilized.

The invention discloses a composite robot-based ultrasonic dust removal device for the semiconductor industry, which comprises an AGV trolley, a mounting frame is arranged on the AGV trolley, a bottom frame is arranged at the bottom of the mounting frame, and the bottom frame is connected with the AGV trolley; a mechanical arm is arranged at the top of the mounting frame; an ultrasonic dust removal device is arranged at the free tail end, away from the mounting frame, of the mechanical arm; the ultrasonic dust removal device comprises a dust removal head, a dust removal head bottom plate is arranged at the bottom of a dust removal head cavity, and the dust removal head and the dust removal head bottom plate are integrally formed; an air inlet barrel is arranged at the top of the dust removal head cavity, a positive pressure cavity is formed in the dust removal head cavity, the peripheral side walls of the positive pressure cavity are vertically arranged on a dust removal head bottom plate in the dust removal head cavity, a separation distance is formed between a top plate of the positive pressure cavity and the top end of the dust removal head cavity, and the air inlet barrel is in through connection with the positive pressure cavity. The horizontal plane and the vertical door of the carrier are cleaned, the wider dust removal requirement is met, and the application range is greatly widened.

The utility model provides an energy -conserving type's semiconductor industry oven system, including AI intelligence main control center and heat source assembly, waste gas treatment jar, heat exchanger, loading and unloading conveying component, a plurality of semiconductor industry oven control connection, semiconductor industry oven is equipped with oven high temperature gas air inlet, oven normal temperature gas air inlet and oven high temperature waste gas exhaust, heat source assembly and oven high temperature gas air inlet intercommunication, heat exchanger is equipped with exchanger high temperature waste gas air inlet, exchanger normal temperature air air inlet, exchanger normal temperature waste gas exhaust and exchanger high temperature air outlet, oven high temperature waste gas exhaust and exchanger high temperature waste gas air inlet intercommunication, exchanger high temperature air outlet and oven high temperature gas air inlet intercommunication, exchanger normal temperature waste gas exhaust and waste gas treatment jar intercommunication. The utility model has the advantages of being capable of purifying and treating high temperature waste gas and recycling heat energy in high temperature waste gas, improving production efficiency and reducing energy consumption.

1. Name of the product in this design: Exhaust gas processor (semiconductor). 2. Application of this design: Waste gas treatment in the semiconductor industry. 3. The key design feature of this product is its shape. 4. The image or photograph that best illustrates the design's key points: a 3D model.

The utility model discloses a device for assisting in balancing weight leveling of a support, which relates to the technical field of testing equipment in the semiconductor industry and comprises a bottom plate, a driver, a PLC (programmable logic controller), a motor, a power detector, a tri-color lamp, a speed reducer and a torsion limiter, the motor is arranged on one side of the bottom plate, the speed reducer is arranged on the upper side of the motor, the driver is arranged on one side of the speed reducer, and the PLC is arranged on the other side of the speed reducer. A PLC is arranged on the lower side of the motor, a tricolor lamp and a power detector are arranged at one end of the bottom plate, a torsion limiter is arranged on the other side of the bottom plate, the motor is connected with a driver and a speed reducer, the speed reducer is connected with the torsion limiter, the torsion limiter is connected with a power shaft of the auxiliary support, and the PLC is connected with the power detector and the tricolor lamp. Through cooperative work of the PLC, the power detector and the three-color lamp, an operator can quickly determine the weight adjusting direction of the weight box according to the colors presented by the three-color lamp in real time, the debugging time of a single support is greatly saved, the production and assembly speed is remarkably increased, and then the overall production efficiency is improved.

A method for manufacturing an equiaxed crystal target material, comprising the following steps: a metal bar is made into a forged base material by a radial forging process; the forged base material is made into a first plate material by a rolling process and a plate forging process, the rolling process is rolling along the axial direction of the forged base material; a second plate material is obtained by reciprocating an equal channel angular extrusion process on the first plate material with an equal channel angular extrusion die, the cumulative average equivalent strain of the second plate material is greater than 10, wherein the feeding direction of the first plate material into each equal channel angular extrusion die is the same as the rolling direction of the forged base material; and an annealing and recrystallization heat treatment process is performed on the second plate material to obtain an equiaxed crystal target material. Through the above steps, an equiaxed crystal target material with a grain size of not greater than 20 μm can be obtained for use in the semiconductor industry.

1. Name of the designed product: fixed welding device (flange). 2. Use of the designed product: used for fixing and welding of flanges in the semiconductor industry. 3. Design points of the designed product: in shape. 4. Picture or photo best showing the design points: perspective view 1.

The invention relates to a vacuum manipulator, in particular to an independent double-arm vacuum direct-drive mechanical arm. Comprising a big arm, a right arm and a left arm, an arm connector is arranged in the middle of the big arm, the left arm and the right arm are arranged at the two ends of the big arm respectively, and the left arm and the right arm move independently. The big arm comprises a big arm shell, a right big arm belt transmission mechanism and a left big arm belt transmission mechanism, wherein the right big arm belt transmission mechanism and the left big arm belt transmission mechanism are arranged in the big arm shell. The arm connector comprises an outer shaft, a middle shaft and an inner shaft which are coaxially installed and independently rotate, and the outer shaft is connected with the large arm shell and drives the large arm shell to rotate. The middle shaft is connected with the right arm through a right large arm belt transmission mechanism and drives the right arm to stretch out and draw back; the inner shaft is connected with the left arm through a left large arm belt transmission mechanism and drives the left arm to stretch out and draw back. Through the design that the left arm and the right arm share the same large arm, the large-spacing arm layout capable of meeting the requirements of the semiconductor industry is formed, the large-spacing arm layout is matched with external large-spacing parallel stations, and the wafer carrying efficiency is effectively improved.

The application relates to the technical field of alumina ceramics, and discloses a black alumina porous ceramic material for a vacuum suction cup and a preparation method of the black alumina porous ceramic material, which selects the types and the proportion of a colorant, the types and the amount of a pore-forming agent, prepares the black alumina porous ceramic with excellent performance of traditional ceramic materials, and provides a more reliable solution for the production of high-precision semiconductor components, and has important significance for promoting the sustainable development of the semiconductor industry in China.

The invention relates to the technical field of semiconductor manufacturing, and discloses a cooling method and a cooling cavity structure for a SiC substrate PECVD (Plasma Enhanced Chemical Vapor Deposition) process, and the method aims at the characteristics that the SiC substrate is high in heat conductivity and sensitive in thermal stress, and the surface carbon residue affects the heat conduction uniformity. Rapid, uniform and low-stress cooling of the SiC wafer is realized through four core stages of process preparation, accurate wafer transfer and placement, stepped double-loop dynamic temperature control cooling and cooling verification unloading. According to the method, a center and edge independent double-loop temperature control strategy is adopted, a stepped segmented cooling and constant-temperature staying design is combined, and a temperature measurement wafer monitoring structure without metal contact is matched, so that the in-plane temperature difference of the SiC wafer can be controlled within + / -2 DEG C, the film stress concentration and lattice defect risks are remarkably reduced, the device yield and long-term reliability are improved, and the manufacturing cost is reduced. And the method can be adapted to the production of SiC wafers with different specifications, and provides key process support for the autonomy of the SiC semiconductor industry.

The utility model discloses a split type cutting wheel adopting a carbon fiber main body, which comprises at least two cutting wheel combination bodies, a complete circular cutting wheel is formed after the combination bodies are combined, and the cutting wheel comprises the carbon fiber main body and a coating layer coated on the outer surface of the carbon fiber main body. The carbon fiber main body is connected with the coating layer through an adhesive; the two ends of the carbon fiber main body are longer than the coating layer on the outer surface of the carbon fiber main body, the longer parts serve as connecting parts, and a plurality of connecting holes are formed in the connecting parts. The utility model has the advantages of light weight, high strength, good wear resistance, high cutting precision, low noise, adaptability to different working temperatures, simplicity in processing and manufacturing, convenience in transportation and the like, and is suitable for raw material cutting equipment in the photovoltaic semiconductor industry.

The invention discloses a photosensitive resin composition which contains (a) alkali-soluble resin, (b) a photosensitizer, (c) an adhesion promoter, (d) a cone angle regulator and (e) an organic solvent. The photosensitive resin composition provided by the invention has the characteristics of high resolution and controllable taper angle of the cross section of a photoetching pattern, and is suitable for the fields of a pixel definition layer, an insulating layer and a planarization layer of a display panel, or a packaging rewiring layer, an inter-element insulating layer, a stress buffer layer and the like in the semiconductor industry.

1. The name of the design product: resistance testing device. 2. The use of the design product: for testing insulation resistance in semiconductor industry. 3. The design points of the design product: in shape. 4. The picture or photo that best shows the design points: perspective view 1.

The utility model discloses a part processing tool for a tail gas treatment device in the semiconductor industry, which is characterized by comprising a working bottom plate, a driving motor is arranged on the working bottom plate, a screw rod is arranged at the output end of the driving motor, a movable seat is sleeved on the outer side of the screw rod, an auxiliary driving platform is arranged on the movable seat, and the auxiliary driving platform is arranged on the working bottom plate. A rotating platform is arranged on the auxiliary driving platform, a workpiece positioning seat and a workpiece adjusting seat are arranged on the rotating platform, and a rotating clamp is arranged on one side of the workpiece adjusting seat. The workpiece positioning base and the workpiece adjusting base can be matched with workpieces of different sizes and lengths, meanwhile, the whole device moves integrally instead of moving independently, therefore, the workpieces cannot be damaged, and the application range is wide.

The invention relates to a construction method of a wet electronic chemical quality control system based on Visio. According to the method, visual modeling is carried out on the wet electronic chemical quality control process by using Visio software, the method comprises the links of project approval of a product, formula development, process development, PPAP verification, mass production and the like, and all the link steps are defined. Visualization, standardization and efficient management of the wet electronic chemical quality control process can be achieved, the quality control efficiency and accuracy are improved, quality problem tracing and analysis are facilitated, a visual decision basis is provided for enterprise managers, the quality management level of wet electronic chemicals can be improved, and the economic benefit of enterprises is improved. And the requirements of the semiconductor industry on high-quality wet electronic chemicals are met.

1. The name of the design product: double-sided grinder. 2. The use of the design product: a double-sided grinder applied to the semiconductor industry. 3. The design points of the design product: in shape. 4. The picture or photo that best indicates the design points: perspective view.

The invention discloses a multi-productization high-purity helium purification method which comprises the following steps: S1, cooling helium feed gas containing neon gas and high-boiling-point gas to a first temperature interval, and adsorbing and removing liquefied high-boiling-point gas through a first adsorption tank to obtain helium mixed gas without the high-boiling-point gas; s2, the helium mixed gas with the high-boiling-point gas removed is cooled to a second temperature interval, neon is solidified and separated in the freezing tank, and unliquefied helium containing a trace amount of neon is output; s3, unliquefied helium containing trace neon is introduced into a second adsorption tank to adsorb residual neon, and a high-purity helium product is obtained; and S4, the solidified neon gas in the freezing tank is heated and gasified, and the recycled pure neon gas is output. According to the invention, a purification method of low-temperature freezing and multi-stage adsorption is adopted, so that the obtained product gas meets the requirement of ultra-pure helium and can also meet the use requirement of helium in the semiconductor industry, the working stages of the adsorption tank and the freezing tank can be automatically switched, and automatic control and continuous production are realized.

The application discloses a kind of semiconductor industrial wastewater treatment equipment, and is connected with wastewater input pipeline, including evaporation device, filtering device and organic separation membrane system, the evaporation device is connected with wastewater input pipeline, the filtering device is connected with evaporation device by pipeline circulation;The organic separation membrane system is connected with evaporation device by pipeline circulation;The outlet of the organic separation membrane system is provided with terminal collection device;It also includes concentrated liquid collection device, and the concentrated liquid collection device collects the evaporator concentrated liquid of evaporation device and the filter concentrated liquid of filtering device produced.The application is treated to semiconductor industrial wastewater by the combination of evaporation device, filtering device and organic separation membrane system, the whole treatment process does not need to add any chemical agent, can maintain macroscopic dynamic balance to whole wastewater treatment equipment, can improve processing efficiency while improving processing effect.

The invention relates to the technical field of electronic industrial wastewater, and discloses a grinding wastewater reuse treatment system, which comprises a wastewater collection module, a disc type filtration module, a ceramic membrane filtration module, an RO treatment module, a produced water reuse module and an automatic control module. The water quality and water quantity homogenization adjustment is performed on the grinding wastewater through the wastewater collection module; suspended solids are mechanically intercepted through a disc type filtering module by adopting a filtering disc with a groove; the ceramic membrane filtration module is used for performing cross-flow filtration to separate colloid and pollutants; residual particles are reduced through a security filter of the RO treatment module; and finally, the produced water is stored and conveyed to a pure water system by the produced water recycling module, so that wastewater recycling is realized. And the automatic control module realizes full-automatic chain operation through the PLC unit and the instrument monitoring unit. According to the invention, the wastewater recycling rate and the system reliability are improved, and the requirements and operation and maintenance of the semiconductor industry on water resource recycling are met.

The utility model relates to the technical field of welding tools, and provides a welding tool for standard products in the semiconductor industry, which comprises a first tool and a second tool arranged above the first tool. According to the utility model, the second tool is moved to the upper surface of the first tool, so that the locking screw is right above the screw hole, the shaft rod of the second product main body passes through the central hole of the first product main body and is inserted into the second tool, so that the connecting reed is in contact with the first product main body, and then the locking screw is rotated by a tool, so that the second tool is fastened; then the connecting reed is connected with the first product main body and the second product main body in a welding mode, at the moment, the axis of the first product main body, the axis of the connecting reed and the axis of the second product main body are located on the same horizontal line, the first product main body, the connecting reed and the second product main body can be axially positioned, and therefore the situation that the first product main body, the connecting reed and the second product main body are not flush in the axial direction is avoided; and therefore, the welding quality of product parts is ensured.