1318 results about "Boron containing" patented technology

A method of forming a boride layer for integrated circuit fabrication is disclosed. In one embodiment, the boride layer is formed by chemisorbing monolayers of a boron-containing compound and one refractory metal compound onto a substrate. In an alternate embodiment, the boride layer has a composite structure. The composite boride layer structure comprises two or more refractory metals. The composite boride layer is formed by sequentially chemisorbing monolayers of a boron compound and two or more refractory metal compounds on a substrate.

A method for dry etching and chamber cleaning high dielectric constant materials is disclosed herein. In one aspect of the present invention, there is provided a process for cleaning a substance comprising a dielectric constant greater than the dielectric constant of silicon dioxide from at least a portion of a surface of a reactor comprising: introducing a first gas mixture comprising a boron-containing reactive agent into the reactor wherein the first gas mixture reacts with the substance contained therein to provide a volatile product and a boron-containing by-product; introducing a second gas mixture comprising a fluorine-containing reactive agent into the reactor wherein the second gas mixture reacts with the boron-containing by-product contained therein to form the volatile product; and removing the volatile product from the reactor.

This invention provides, among other things, novel compounds useful for treating bacterial infections, pharmaceutical compositions containing such compounds, as well as combinations of these compounds with at least one additional therapeutically effective agent.

Compounds and methods of treating anti-inflammatory conditions are disclosed.

Improved methods for depositing low resistivity tungsten films are provided. The methods involve depositing a tungsten nucleation layer on a substrate and then depositing a tungsten bulk layer over the tungsten nucleation layer to form the tungsten film. The methods provide precise control of the nucleation layer thickness and improved step coverage. According to various embodiments, the methods involve controlling thickness and / or improving step coverage by exposing the substrate to pulse nucleation layer (PNL) cycles at low temperature. Also in some embodiments, the methods may improve resistivity by using a high temperature PNL cycle of a boron-containing species and a tungsten-containing precursor to finish forming the tungsten nucleation layer.

This invention relates to, among other items, 6-substituted benzoxaborole compounds and their use for treating bacterial infections.

Boron containing phosphor compositions having the formulas (1) M3Ln2(BO3)4 doped with at least one activator selected from the group of Eu2+, Mn2+, Pb2+, Ce3+, Eu3+, Tb3+, and Bi3+ where M is at least one of Mg, Ca, Sr, Ba, or Zn, and Ln is at least one of Sc, Y, La, Gd, or Lu; (2) M2−xM′x(Al, Ga)2−y(Si, Ge)yB2O7−zNz:Eu2+, Mn2+, Pb2+ where M′ is one or more of alkali metals Na and / or K, M″ is one or more of alkaline earth Mg, Ca, Sr, Ba or Zn, 0≦x≦2, 0≦y≦2, 0≦z≦4; and z=x+y; (3) M′2−x+y′M″x−y′(Al, Ga)2−y(Si, Ge)yB2O7−z−y′NzXy:Eu2+, Mn2+, Pb2+, where M′ is one or more of alkali metals Na and / or K, M″ is one or more of alkaline earth metals Mg, Ca, Sr, Ba and / or Zn, 0≦x≦2, 0≦y≦2, 0≦z≦4; z=x+y, X═F and / or Cl, and 0≦y′≦2; (4) M′2−xM″xAl2−y+y′Siy−y′B2O7−z−y′NzXy:Eu2+, Mn2+, Pb2+, where M′ and M″ are defined above, 0≦x≦2, 0≦y≦2, 0≦z≦4; z=x+y, X═F and / or Cl, and 0≦y′≦2; (5) M′2−x+x′M″x−x″Al2−y+y′Siy−y′B2O7−z−x′−y′NzX(x′+y′):Eu2+, Mn2+, Pb2+, where M′ and M″ are defined above, 0≦x≦2, 0≦y≦2, 0≦z≦4; z=x+y, X═F and / or Cl, and 0≦y′≦2; (6) MAl2B2O7:Eu2+, Mn2+, Pb2+; where M═Mg, Ca, Sr, Ba or Zn; (7) MAl2−xSixB2O7−xNx:Eu2+, Mn2+, Pb2+, where M═Mg, Ca, Sr, Ba and / or Zn, and 0≦x≦2; and (8) MAl2B2−xSixO7−xNx:Eu2+, Mn2+, Pb2+, where M═Mg, Ca, Sr, Ba and / or Zn, and 0≦x≦2. Also disclosed are light emitting devices including a light source and at least one of the above phosphor compositions.

This invention relates to compounds useful for treating fungal infections, more specifically topical treatment of onychomycosis and / or cutaneous fungal infections. This invention is directed to compounds that are active against fungi and have properties that allow the compound, when placed in contact with a patient, to reach the particular part of the skin, nail, hair, claw or hoof infected by the fungus. In particular the present compounds have physiochemical properties that facilitate penetration of the nail plate.

Methods of treating anti-inflammatory conditions through the use of boron-containing small molecules are disclosed.