The present application is suitable for the field of flexible
printed circuit board testing, and provides a test method and device for improving FPC test yield from process and technology. The method comprises: measuring the size parameters of the flexible board in advance, determining the positioning size and tolerance of the first needle mold; placing the flexible board on the first needle mold, and positioning in X and Y directions; taking the contact surface of the first needle mold and the second needle mold as the size chain
reference surface in the Z-axis direction, so that the relative distance between the tip of the long probe and the
test point of the flexible board forms a
closed loop; the bottom surface of the first needle mold is in contact with the top surface of the second needle mold, and at the same time the long probe touches the
test point of the flexible board; the circuit is turned on, and the test is completed. The positioning of the product is carried out on the flexible board shape and B2B shape, the test yield is improved from the production process, the
processing reference is changed from the
processing technology, the size chain is shortened, the tolerance of the
closed loop is reduced, and the test yield is improved.