Cu-Ga alloy target for Cu-In-Ga-Se film solar battery and preparing process thereof
A technology for solar cells and copper-gallium alloys is applied in the field of copper-gallium alloy targets to achieve the effects of good stability, cost reduction and oxidation prevention.
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Embodiment 1
[0016] According to the proportion of elemental gallium and elemental copper atomic percentages of 25% and 75% respectively, firstly cut the pure copper Φ10 bar into 10mm small pieces, place it at the bottom of the melting crucible, then heat and melt the elemental gallium and pour it into the crucible . Melting is carried out in a vacuum below 10 Pa, and the temperature is first raised to 800 °C at 10 °C / min, and then kept for 90 min. In vacuum, the central opening at the bottom of the crucible is directly opened, so that the alloy is quickly rushed into the combined target mold. The bottom of the mold is cooled by kerosene circulation to make it quenched and formed at a speed of 60°C / min. After the alloy target is cooled to room temperature, the target and the mold are taken out, and the mold is disassembled to obtain a copper-gallium alloy target with a homogeneous composition and fine grains of 25% and 75% gallium and copper respectively.
Embodiment 2
[0018] According to the ratio of elemental gallium and elemental copper atomic percentages of 35% and 65% respectively, firstly cut the pure copper Φ10 bar into 10mm segments, place them at the bottom of the crucible, heat and melt the elemental gallium, and then pour it into the crucible. Melting was carried out under the protection of argon at 1 standard atmospheric pressure, and the temperature was first raised to 850°C at 20°C / min, and then kept at a temperature of 70min. Under the protection of argon, the central opening at the bottom of the crucible is directly opened, so that the alloy is quickly rushed into the combined target mold. The bottom of the mold is cooled by water circulation to make it quenched and formed at a speed of 70°C / min. After the alloy target is cooled to room temperature, the target and the mold are taken out, and the mold is disassembled to obtain a copper-gallium alloy target with a homogeneous composition and fine grains with gallium and copper ...
Embodiment 3
[0020] According to the ratio of elemental gallium and elemental copper atomic percentages of 40% and 60% respectively, the pure copper Φ10 bar is first cut into 10mm segments, placed at the bottom of the crucible, and the gallium element is heated and melted and then poured into the crucible for mixing. Melting was carried out under the protection of nitrogen at 3 standard atmospheric pressures, and the temperature was first raised to 900°C at 30°C / min, and then kept at a temperature of 60min. Under the protection of nitrogen, the central opening at the bottom of the crucible is directly opened, so that the alloy is quickly rushed into the combined target mold. The bottom of the mold is cooled by water circulation to make it quenched and formed at a speed of 80°C / min. After the alloy target is cooled to room temperature, the target and the mold are taken out, and the mold is disassembled to obtain a copper-gallium alloy target with 40% and 60% atomic percentages of gallium an...
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