Aligning system, mark, method for lithographic device and lithographic device thereof

Abstract

The present invention discloses an alignment system, an alignment mark and an alignment method for photoetching devices, as well as a photoetching device. By detecting light intensity changes of +-1 grade diffraction light of a first grating, a second grating and a third grating of the alignment mark on an image plane, wherein the +-1 grade diffraction light is modulated via a reference grating after coherent imaging, the center position of the alignment mark is acquired through the phase information of transmitted light signals, wherein the rough position information of the alignment mark is acquired through the alignment signals of the first grating and the second grating of the alignment mark; the exact position information of the alignment mark is acquired through the alignment signals of the third grating of the alignment mark. The alignment system reduces alignment position error caused by the asymmetrical deformation of the alignment mark, effectively solves the problems of signal crosstalk, improves the energy utilization ratio of a light source, and is beneficial to improve the intensity of alignment signals and the dynamic range of detection.

Description

technical field [0001] The present invention relates to photolithography devices in the field of integrated circuit or other micro-device manufacturing, in particular to an alignment system, alignment marks, an alignment method and a photolithography device. Background technique [0002] The photolithography apparatus in the prior art is mainly used in the manufacture of integrated circuits (ICs) or other micro devices. With a photolithographic apparatus, multilayer masks with different mask patterns are sequentially imaged in precise alignment on a photoresist-coated wafer, such as a semiconductor wafer or an LCD panel. Lithography devices are generally divided into two categories, one is a stepping lithography device, the mask pattern is exposed and imaged on one exposure area of ​​the wafer, and then the wafer moves relative to the mask to move the next exposure area to the mask pattern and under the projection objective, the mask pattern is again exposed on another expo...

AI Technical Summary

Problems solved by technology

[0008] The object of the present invention is to provide an alignment system, an alignment mark, an alignment method and a lithography device for a lithography device, which can reduce the alignment position error caused by the asymmetric deformation of the alignment mark and solve the problem of signal crosstalk , improve the energy utilization rate of the light source, improve the alignment signal strength and the dynamic range of detection

Images