The utility model relates to the technical field of
semiconductor luminescence, and discloses a sensor device, which comprises a substrate, an optical
chip, a light-transmitting glue layer, a high-reflection glue layer and a fence part. The optical chips are arranged on the substrate, and the number of the optical chips is at least two. The light-transmitting glue layer at least covers a part of the upper surface of the optical
chip. The side face of the light-transmitting glue layer is provided with a reflecting face used for reflecting edge large-angle light. And the high-reflection glue layer tightly covers the reflecting surface, or tightly covers the reflecting surface and the side surface of the optical
chip, or tightly covers the reflecting surface, the side surface of the optical chip and a part of the upper surface. The
enclosure part is arranged on the base plate. And the
enclosure part covers the high-reflection glue layer. The side, away from the substrate, of the
enclosure part extends to the position above the reflecting surface. According to the utility model, the reflecting surface and the high-reflection
adhesive layer are arranged, so that edge wide-angle light can be fully utilized, the
light energy utilization rate is improved, and the detection accuracy of a sensor device is further improved. Meanwhile, the high-reflection glue layer can enable the connection between the optical chip and the substrate to be firmer, and the reliability of the whole sensor device is improved.