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63results about How to "Increase the exit angle" patented technology

Head-worn display device

The embodiment of the present invention discloses a head-worn display device. The head-worn display device comprises an image source; an optical waveguide positioned in the light transmission direction of the image source; and an optical structure positioned in the outgoing light direction of the optical waveguide. The optical structure comprises a first state for changing the outgoing light direction of the optical waveguide and increasing the emergence angle of the outgoing light, and a second state for not changing the outgoing light direction of the optical waveguide. In this way, when the head-worn display device is applied to an enhanced real display, the optical structure is controlled to be in the second state. At this time, the light emitted onto the optical structure is transmitted through the optical structure, so that the transparency of the head-worn display device is improved. The high transparency requirement on the enhanced real display can be met. When the head-worn display device is applied to an enhanced virtual display, the optical structure is controlled to be in the first state. At this time, the light emitted onto the optical structure is refracted through the optical structure, so that the field-of-view of the head-worn display device is expanded. The large field-of-view requirement on the enhanced virtual display can be met.
Owner:LENOVO (BEIJING) LTD

Display device and backlight module

The invention discloses a display device and a backlight module. The display device comprises a light bar; a light-emitting assembly on the light bar comprises an annular curved light reflecting cover, a light-emitting diode and a lens, wherein the light-emitting diode and the lens are arranged in the light reflecting cover; light emitted by the light-emitting diode passes through the lens, emergent light at the center of the light is deflected towards a large-angle direction, so that the emergent light at each angle is relatively uniform; small-angle light passing through the lens can directly enter a light outgoing side through the opening of the light reflecting cover; and large-angle light passing through the lens can enter the light reflecting cover, and the light is reflected to theopening through the light reflecting cover so as to be emitted to the light outgoing side. Therefore, through the cooperation of the lens and the light reflecting cover, the emergent light of the light-emitting diode can be fully utilized, the light is collected to the greatest extent, and the energy utilization rate of the light is improved; the curvature of the lens and the light reflecting cover can be adjusted, so that the emergent angle of the light can be adjusted; and thus, the energy of an irradiation light spot on the surface of the light outgoing side is relatively uniform, and the light outgoing uniformity of the backlight module is improved.
Owner:HISENSE VISUAL TECH CO LTD

Ion beam deposition equipment for infrared metal film and film deposition method

The invention discloses ion beam deposition equipment for an infrared metal film and a film deposition method. The equipment comprises a wafer loading and unloading cavity and a sputtering cavity, wherein a first high-vacuum isolation valve is arranged between the wafer loading and unloading cavity and the sputtering cavity, the wafer loading and unloading cavity is provided with a vacuum sealingdoor, a pushing rod penetrates through the vacuum sealing door, a workpiece table is arranged at the end, on the inner side of the vacuum sealing door, of the pushing rod, a pushing mechanism used forpushing the pushing rod is arranged on the outer side of the vacuum sealing door, and the wafer loading and unloading cavity is connected with a first vacuumizing device. The film deposition method adopts the equipment to perform film deposition. According to the invention, the wafer loading and unloading cavity is arranged, so that the cavity opening and vacuumizing times of the sputtering cavity can be reduced, the vacuumizing time can be shortened, the productivity can be improved, the vacuum environment can be always kept in the sputtering cavity, the target burning times can be reduced,and the utilization rate of a target material can be improved. The ion beam deposition equipment has the advantages of high productivity, high target material utilization rate and the like, can be widely used for depositing infrared metal films, and has very high use values and application prospects.
Owner:48TH RES INST OF CHINA ELECTRONICS TECH GROUP CORP

Backlight module and display device

The invention provides a backlight module and a display device. The backlight module comprises a light-emitting element and a light guide plate; multiple light guide slot regions are arranged at one side, close to the light-emitting element, of a reflecting plane of the light guide plate, each light guide slot region comprises multiple light guide slots, and a positive projection of each light guide slot on the reflective plane is arc, and a bending direction of the arc is towards the light-emitting element; a light ray emitted towards an in-light surface of the light guide plate by the light-emitting element is reflected to an out-light surface of the light guide plate through the light guide slots. An angle of departure of the light ray of the light-emitting element after entering the light guide plate can be increased, a dark area and light mixing distance of the light-emitting element are reduced, thereby reducing lower black edge size of the backlight module, and then reducing thelower black edge size of the entire display device, and realizing lower narrow edge design of the display device; furthermore, the thickness of the light guide plate can be reduced on the basis of guaranteeing that all light rays enter the light guide plate, and the thinner and lighter design is realized.
Owner:VIVO MOBILE COMM CO LTD

LED integrated packaging structure and packaging method thereof

The invention provides an LED integrated packaging structure, which comprises a substrate, a packaging adhesive groove formed in the upper surface of the substrate, and a microstructure layer arranged on the packaging adhesive groove, wherein a die boding groove array comprising a plurality of die bonding grooves are formed in the packaging adhesive groove, the bottom part of each die bonding groove is provided with an LED chip, a circuit board is further arranged in the packaging adhesive groove, an opening corresponding to the die boding groove array is formed in the circuit board, the LED chips are connected with the circuit board by means of lead wires, and the packaging adhesive groove is further filled with a packaging adhesive layer used for packaging the LED chips, the lead wires and the circuit board. According to the LED integrated packaging structure and a packaging method thereof provided by the invention, the microstructure layer covers the a fluorescent adhesive layer of the integrated packaging structure, and refractive indexes of a protective layer, the fluorescent layer and the microstructure layer are in a descending order, therefore the light emitting efficiency of the integral LED integrated packaging structure can be improved and the emergent angle thereof can be increased by adopting the design.
Owner:SUZHOU INST OF NANO TECH & NANO BIONICS CHINESE ACEDEMY OF SCI

Array substrate, array substrate manufacturing method and display panel

ActiveCN111864112ASolve the problem that the angle is difficult to encapsulateImprove the level ofSolid-state devicesSemiconductor/solid-state device manufacturingLight guideEngineering
The embodiment of the invention provides an array substrate, an array substrate manufacturing method and a display panel. The array substrate comprises a pixel definition layer, a light-emitting layerand a transparent light guide layer. The pixel definition layer is provided with a first face and a second face which are oppositely arranged, a plurality of grooves are formed in the first face, andthe angle formed by the extension lines of the side face and the bottom face of the groove ranges from 0 degree to 50 degrees. The light-emitting layer is arranged on the bottom surface of the groove. The transparent light guide layer is filled in the groove and is positioned at the side, far away from the bottom surface of the groove, of the light-emitting layer. The groove is filled with the transparent light guide layer, and after light of the light-emitting layer is refracted by the transparent light guide layer, the emergence angle of the light can be increased. In addition, after the groove is filled with the transparent light guide layer, the problem that the bottom of the groove has an angle and is difficult to package can be solved. After the transparent light guide layer is filled, the leveling performance of material during ink-jet printing can be improved, and a thinning effect is brought to ink-jet printing.
Owner:WUHAN CHINA STAR OPTOELECTRONICS SEMICON DISPLAY TECH CO LTD

Reference and measurement integrated difunctional photoelectric detector and detection system

The invention relates to a reference and measurement integrated bifunctional photoelectric detector and a detection system. The reference and measurement integrated bifunctional photoelectric detectorcomprises a reference photoelectric detector, a measurement photoelectric detector and a light splitting optical fiber collimator, the reference photoelectric detector is internally provided with a reference gas chamber, and the reference gas chamber is filled with detected gas; the light splitting optical fiber collimator comprises a light incident connector, a parallel light emitting head, a reflected light emitting head and an optical fiber assembly. The parallel light emitting head is connected with the light incident connector and the reflected light emitting head through the optical fiber assembly. The reference photoelectric detector is connected with the parallel light emitting head through a light path, and the measurement photoelectric detector is connected with the reflected light emitting head through a light path. According to the invention, the photoelectric detector with a reference function, the photoelectric detector with a measurement function and the optical splitter with a light splitting function are integrated, so that the volume and the weight of the whole detection system are greatly reduced, the stability and the reliability of gas detection sensitivity are improved, and the cost is greatly reduced.
Owner:席金波

Optical imaging lens and imaging equipment

The invention discloses an optical imaging lens and imaging equipment, wherein the optical imaging lens sequentially comprises a first group with a negative focal power,a diaphragm, a second group with a positive focal power, a third group with a positive focal powerand a light filter from an object side to an imaging surface along an optical axis; the first group comprises a first lens with negative focal power and a second lens with positive focal power, the object side surface of the first lens is convex surface,the image side surface of the first lens is concave surface, and the image side surface of the second lens is convex surface; the second group comprises a third lens with positive focal power, a fourth lens with positive focal power, a fifth lens with positive focal power, and a sixth lens with negative focal power, the object side surface and the image side surface of the fourth lens are convex surfaces, the object side surface of the fifth lens is convex surface, and the image side surface of the sixth lens is concave surface; the fifth lens and the sixth lens form a bonding body; the third group comprises a seventh lens with positive focal power, and the object side surface and the image side surface of the seventh lens are convex surfaces. The optical imaging lens at least has the advantages of high pixel and small distortion, and has a temperature compensation effect.
Owner:合肥联创光学有限公司
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