Method for improving problem of light spots of high-power light-emitting diode (LED)

A high-power, LED chip technology, applied in the direction of electrical components, electric solid devices, circuits, etc., can solve the problems of dust pollution, difficult preparation, complex process, etc., and achieve the effect of increasing the output rate, small influence, and high light output rate

Active Publication Date: 2013-02-27
厦门多彩光电子科技有限公司
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Problems solved by technology

And SiO 2 The refractive index is about 1.55, after its refraction and then through Al 2 o 3 The metallic surface of the powder (metallic spherical particles) is reflective, allowing the light to diffuse, thus requir

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  • Method for improving problem of light spots of high-power light-emitting diode (LED)
  • Method for improving problem of light spots of high-power light-emitting diode (LED)
  • Method for improving problem of light spots of high-power light-emitting diode (LED)

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Embodiment Construction

[0020] The present invention will be further described in conjunction with the accompanying drawings and specific embodiments.

[0021] A method for improving the light spot of a high-power LED of the present invention is realized by uniformly spreading transparent particles with a polyhedral structure in the silicone layer and / or the fluorescent glue layer in the existing LED packaging structure. The transparent particles account for 2%-10% by weight of the filler. Then the filling glue accounts for 90%-98% by weight. Specifically, the transparent particles are PMMA transparent particles in the shape of concave lenses, SiO in the shape of 3 to 8 faces 2 Mixed particles of transparent particles and PC transparent particles in the shape of a polyhedron larger than 8 sides; the SiO 2 The transparent particles account for 0.6%-3.7% by weight of the filler, the PC transparent particles account for 0.2%-2.3% by weight of the filler, and the PMMA transparent particles account for 1...

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Abstract

The invention relates to a light-emitting diode (LED), in particular to an LED packaging structure capable of improving the problem of light spots of a high-power LED. The invention relates to a method for improving the problem of light spots of the high-power LED. Transparent particles with polyhedral structures are distributed in filling glue of the LED packaging structure uniformly and are 2 to 10 percent in weight ratio of the filling glue. The transparent particles are mixed particles of polymethyl methacrylate (PMMA) transparent particles shaped like concave lenses, SiO2 transparent particles shaped like objects with three to eight-faces, and poly carbonate (PC) transparent particles shaped like objects with more than eight faces, wherein the SiO2 transparent particles are 0.6 to 3.7 percent in weight ratio of the filling glue; the PC transparent particles are 0.2 to 2.3 percent in weight ratio of the filling glue; and the PMMA transparent particles are 1.2 to 6.3 percent in weight ratio of the filling glue. The method is used for improving the problem of light spots of the high-power LED.

Description

technical field [0001] The present invention relates to an LED (Light-Emitting Diode, light-emitting diode), in particular to an LED package structure for improving the light spot of a high-power LED. Background technique [0002] The method of using phosphor conversion to realize white light from LED is the most researched and hottest method at present. In the process of realizing white light from LEDs, the packaging structure and process technology of fluorescent materials (phosphor powder) covering LEDs are the key cores of white light LEDs. [0003] For example, for power white LEDs used in the lighting field, the spatial distribution uniformity of its color temperature and chromaticity is an important indicator of product performance. The color temperature difference that human eyes can distinguish is 50-100K. At present, the chromaticity uniformity of ordinary LED devices is still not ideal, and even the angular color temperature difference of a single LED can be as l...

Claims

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Application Information

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IPC IPC(8): H01L33/58
CPCH01L2224/48091H01L2224/48247H01L2924/00014
Inventor 苏水源
Owner 厦门多彩光电子科技有限公司
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