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97results about How to "Improve deposition uniformity" patented technology

Diamond wire saw production method of surface modified diamond

InactiveCN101812710AAchieve electroplating depositionEasy to operateElectrophoretic coatingsElectrophoresisDiamond wire saw
The invention relates to a diamond wire saw production method of a surface modified diamond, which comprises the following steps: 1. removing surface grease and surface metal oxides on the surface of the diamond; 2. placing diamond micropowder into a cationic surfactant solution, applying positive potential and forming a layer of positive charge film on the surface of the diamond under the electrophoretic action by action of a cationic surfactant; and 3. carrying out composite electroplating of a diamond wire saw. In the invention, conductive processing is carried out on the diamond, so that diamond grains can orderly move in a plating solution under the action of an electric field to realize the electroplating deposition on the surface of a metal wire without the influence of the size of the diamond grains; the surfactant is adsorbed on the surface of the diamond, so that a plating layer and the diamond present an infiltrative type interface, and a Ni plating layer has strong holding capability on the diamond; and the diamond micropowder has high utilization ratio. The invention has simple process method and convenient operation, the diamond grains have rapid deposition speed, good deposition uniformity and high deposition density on the metal wire, an electroplating layer has high holding force on the diamond grains, and the diamond micropowder has high utilization ratio. The invention can realize industrialized production and provides a method for efficiently and rapidly producing the diamond wire saw.
Owner:CHANGSHA DIAT NEW MATERIAL SCI & TECH

Chemical vapor deposition method of Si-B-C-N amorphous ceramic

The invention relates to a chemical vapor deposition method of a Si-B-C-N amorphous ceramic. The chemical vapor deposition method comprises the following steps of: suspending a substrate material on a matching sample bracket of a vacuum furnace, putting samples in a centre of an isothermal region in the furnace and preparing even Si-B-C-N amorphous ceramic on the surface / interior of the substrate material by using a CVD (Chemical Vapor Deposition) / CVI (Chemical Vapor Infiltration) method. The Si-B-C-N amorphous ceramic prepared by the chemical vapor deposition method can be applied to an interface, a matrix and a coating of a continuous fiber-reinforced ceramic matrix composite, has the advantages of excellent properties such as good high-temperature stability, good anti-oxidation property, strong creep resisting capability, low density, low coefficient of thermal expansion and low heat conductivity coefficient and the like, can replace materials such as SiC and Si3N4, further improves the using temperatures and prolongs the service lives of thermal structure ceramics and ceramic matrix composites and has a great application potentiality in the isothermal and long-life field of aircraft engines and industrial gas turbines; and meanwhile, the Si-B-C-N amorphous ceramic also has electrical properties similar to the semiconductors and interesting optical properties and is widely used in the fields of high-temperature invisibility, semiconductors, photoelectricity, communication and control.
Owner:NORTHWESTERN POLYTECHNICAL UNIV

Diamond wire saw and rapid production method thereof

The invention discloses a diamond wire saw and a rapid production method thereof. The surfaces of diamond grits are respectively coated with a nickel layer by chemical plating, the nickel layers are fixed on a copper-plated piano wire substrate pre-plated with a nickel layer through electroplating, and then the nickel layers are thickened, so that the diamond grits are solidified more firmly. The rapid production method of the diamond wire saw comprises the following steps of: 1, removing greases and oxides on the surfaces of diamond grits, and carrying out sensitization, activation and chemical nickel plating on the diamond grits; 2, removing greases and oxides on the surface of a metal substrate, and pre-plating nickel layers as buffer layers; and 3, carrying out composite electroplating, thickened electroplating and heat treatment on the diamond wire saw. According to the invention, diamond grits are subjected to chemical nickel plating to achieve an effect of electric conduction, so that the diamond grits carry out sequential movement under the action of an electric field, and chemical consolidation is realized; and in addition, intense agitation is introduced in an electroplating process, so that high-current/density electroplating is realized, and a highly efficient and rapid method is provided for the industrial production of diamond wire saws.
Owner:江西核工业兴中科技有限公司

Method for automatically adjusting flow rate of sprinkler of profiling variable spraying system of spraying machine

The invention belongs to the field of agricultural plant protection machinery, in particular to a method for automatically adjusting the flow rate of a sprinkler of a profiling variable spraying system of a spraying machine. The invention aims to provide a method for automatically adjusting the flow rate of the sprinkler of the profiling variable spraying system of the spraying machine. PWM control signals are adopted to adjust the flow rate of the sprinkler and the air flow of a fan which is used for assisting transportation of sprayed droplets, the flow rate of the sprinkler and the air flowof the fan are set according to the type of a tree crown, and a spray bar can be adjusted according to the growth trend of the crown so as to achieve profiling spraying, so that the utilization rateof pesticide is improved effectively, the uniformity of deposition of a chemical liquid on a canopy is improved, and environmental pollution and personal injury which are caused by the drifting pesticide are reduced in the spraying process. The method has the characteristics of good applicability, high working efficiency, fast response to a control system and precise application of pesticide, andpromotion of pesticide-saving technologies is facilitated.
Owner:CHINA AGRI UNIV

Monolithic integration method of hyperspectral image sensor

The invention discloses a monolithic integration method of a hyperspectral image sensor. The monolithic integration method comprises the following steps of forming a bottom reflection layer on the surface of a light sensing region of a complementary metal-oxide-semiconductor (CMOS) image sensor; forming a transparent cavity layer on the bottom reflection layer by an area selective atomic layer deposition process, wherein the transparent cavity layer comprise N step structures, N is equal to 2m, m is more than or equal to 1 and is an integer; and forming a top reflection layer on the transparent cavity layer. With the monolithic integration method of the hypersepctral image sensor, provided by the invention, the problem of non-uniform accumulation caused by an etching process adopted by the prior art is optimized, and meanwhile, the fact that the material of the cavity layer cannot be fabricated by the etching method is expanded on selection of the material of the cavity layer; the similar one-dimensional area selective atomic layer deposition mode can be extended, for example, another dimension is additionally arranged, several repeated regions are fabricated, and then a mosaic-type multiple cavity layers with different heights and the repeated structure can be formed; and the monolithic integration method can be applied to a snapshot hyperspectral image sensor, and the performance such as pixel of the hyperspectral image sensor is greatly improved.
Owner:INST OF MICROELECTRONICS CHINESE ACAD OF SCI

Spray bar balance active prediction adjustment system and method

The invention discloses a spray bar balance active prediction adjustment system and method, and relates to the field of plant protection machinery. A mechanical part comprises a driving chassis, an atomizing machine main frame, a spray bar, a rolling column, branchers, a spray bar lifting hydraulic cylinder, a left side balance hydraulic cylinder, a right side balance hydraulic cylinder, a left transverse folding hydraulic cylinder and a right transverse folding hydraulic cylinder; a control part includes a chassis attitude sensor, multi-dimensional force sensors, a data acquisition module, aspray bar balance controller, a data output module and a solenoid valve; an atomizing spray bar is provided with a plurality of branchers, each of the branchers is provided with the multi-dimensionalforce sensors to detect random branch resistance, and the chassis attitude sensor is mounted on the driving chassis to detect the posture change and the trend. During the actual field operation of anatomizing machine, the spray bar balance controller predicts the change amount of spray bar postures according to the random branch resistance of each brancher and the posture change and trend of thedriving chassis, and the balance hydraulic cylinders on both sides are controlled to conduct servo-predictive control on the spray bar.
Owner:JIANGSU UNIV

ITO thin film sputtering process and ITO thin film sputtering apparatus

The invention discloses an ITO thin film sputtering process and an ITO thin film sputtering apparatus. The method comprises the following steps: before introducing process gas into a reaction chamber, controlling output voltage of a direct current sputtering power source to be predetermined voltage and applying predetermined power on a target material by using the direct current sputtering power source; introducing the process gas into the reaction chamber after predetermined time so as to allow the process gas to realize glow starting in the reaction chamber; and after glow starting, applying sputtering power on the target material by using the direct current sputtering power source to implement sputtering, wherein the sputtering power is more than or equal to the predetermined power but less than or equal to the rated power of the sputtering power source. The ITO thin film sputtering process provided by the invention can greatly reduce glow starting voltage, mitigates bombardment of a GaN layer caused by too high particle energy at the moment of glow starting and effectively reduces damage to the GaN layer. Moreover, since no new mechanism is needed, stability is improved, adjustment of the process can be conveniently carried out, and thin film deposition uniformity is enhanced.
Owner:BEIJING NAURA MICROELECTRONICS EQUIP CO LTD

Cesium releasing agent for realizing low-temperature controlled release of cesium and manufacturingmethod of releaser used for cesium releasing agent

ActiveCN105483397AReasonable designGood deposition uniformityTungstateEvaporation
The invention discloses a cesium releasing agent for realizing low-temperature controlled release of cesium and a manufacturing method of a releaser used for the cesium releasing agent, belonging to the field of cesium releasing agents for third-generation low-light level night vision devices and releasers used for the cesium releasing agents. The cesium releasing agent comprises a cesium salt and a reducing agent, wherein the cesium salt is cesium chromate or cesium tungstate, and the reducing agent is a modified ZrVFe getter. The releaser is produced by processing an NiCr alloy pipe, a Cs steam escape outlet is formed through laser boring in the pipe, the middle part of the pipe is filled with the cesium releasing agent and is subjected to press molding, and meanwhile two ends of the pipe are clamped to be flat so as to be used as heating electrodes. If being put into a low-light level night vision device, the manufacturedreleaser is found to have the cesium releasing temperature of 300-500 DEG C and the cesium releasing frequency of 300-400 times and to be freeof releasing harmful impurity gases and controllable in release rate and release amount; and the steam escape outlet of the releaser is reasonably designed, and the evaporation uniformity of Cs on a photoelectric cathode is good, so that the performance of the photoelectric cathode with negative electron affinity (NEA) is remarkably improved.
Owner:GRIMAT ENG INST CO LTD

Composite negative electrode material, negative electrode, lithium ion battery and preparation method

The invention particularly discloses a composite negative electrode material, a negative electrode, a lithium ion battery and a preparation method. The preparation method comprises the following steps: carbonizing foam resin of melamine or derivatives thereof to obtain a matrix, and dipping the matrix into molten lithium to obtain the composite negative electrode material. The nitrogen-containingfunctional groups are uniformly distributed in the foam carbon matrix provided by the invention, so that the foam carbon matrix has relatively strong binding energy to lithium, lithium ion flow can behomogenized in a lithium ion deposition process, uniform deposition of metal lithium is facilitated, and formation of nucleation sites for lithium dendritic crystal growth is avoided; meanwhile, thefoam carbon matrix of the three-dimensional network structure further has a high specific surface area, the local current density can be reduced, the deposition uniformity of metal lithium in the matrix is further improved, the hollow structure of the foam carbon matrix serves as an ion transmission channel, carriers are provided in the lithium deposition process, and aggregation of lithium ions/electrons is dispersed. The continuous growth of the lithium dendrites is favorably relieved, so that the effects of inhibiting the lithium dendrites and buffering the volume expansion are achieved.
Owner:HEBEI UNIVERSITY OF SCIENCE AND TECHNOLOGY

Ion beam deposition equipment for infrared metal film and film deposition method

The invention discloses ion beam deposition equipment for an infrared metal film and a film deposition method. The equipment comprises a wafer loading and unloading cavity and a sputtering cavity, wherein a first high-vacuum isolation valve is arranged between the wafer loading and unloading cavity and the sputtering cavity, the wafer loading and unloading cavity is provided with a vacuum sealingdoor, a pushing rod penetrates through the vacuum sealing door, a workpiece table is arranged at the end, on the inner side of the vacuum sealing door, of the pushing rod, a pushing mechanism used forpushing the pushing rod is arranged on the outer side of the vacuum sealing door, and the wafer loading and unloading cavity is connected with a first vacuumizing device. The film deposition method adopts the equipment to perform film deposition. According to the invention, the wafer loading and unloading cavity is arranged, so that the cavity opening and vacuumizing times of the sputtering cavity can be reduced, the vacuumizing time can be shortened, the productivity can be improved, the vacuum environment can be always kept in the sputtering cavity, the target burning times can be reduced,and the utilization rate of a target material can be improved. The ion beam deposition equipment has the advantages of high productivity, high target material utilization rate and the like, can be widely used for depositing infrared metal films, and has very high use values and application prospects.
Owner:48TH RES INST OF CHINA ELECTRONICS TECH GROUP CORP
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