Diamond wire saw production method of surface modified diamond

Abstract

The invention relates to a diamond wire saw production method of a surface modified diamond, which comprises the following steps: 1. removing surface grease and surface metal oxides on the surface of the diamond; 2. placing diamond micropowder into a cationic surfactant solution, applying positive potential and forming a layer of positive charge film on the surface of the diamond under the electrophoretic action by action of a cationic surfactant; and 3. carrying out composite electroplating of a diamond wire saw. In the invention, conductive processing is carried out on the diamond, so that diamond grains can orderly move in a plating solution under the action of an electric field to realize the electroplating deposition on the surface of a metal wire without the influence of the size of the diamond grains; the surfactant is adsorbed on the surface of the diamond, so that a plating layer and the diamond present an infiltrative type interface, and a Ni plating layer has strong holding capability on the diamond; and the diamond micropowder has high utilization ratio. The invention has simple process method and convenient operation, the diamond grains have rapid deposition speed, good deposition uniformity and high deposition density on the metal wire, an electroplating layer has high holding force on the diamond grains, and the diamond micropowder has high utilization ratio. The invention can realize industrialized production and provides a method for efficiently and rapidly producing the diamond wire saw.

Description

A kind of diamond wire saw production method of surface modified diamond technical field The invention discloses a diamond wire saw production method, in particular to a diamond wire saw production method with surface-modified diamond. The invention belongs to the technical field of diamond surface conduction treatment. Background technique Hard and brittle materials such as silicon crystals, gemstones, stones, quartz crystals, and rare earth magnetic materials have been developed rapidly in recent years, and cutting processing is a key process in the processing of these materials. The main technical requirements are: high efficiency, low cost, narrow cutting Seams, no damage, no pollution, etc. Compared with other cutting methods, diamond wire cutting is the best method. At present, wire cutting of brittle materials mostly adopts the method of evenly dispersing diamond powder in a cutting fluid with a certain viscosity. Driven by the high speed of the steel wire, the d...

AI Technical Summary

Problems solved by technology

The first step: diamond surface pretreatment