29 results about "Surface conduction" patented technology

A method for circumscribing an insulating barrier region around a singular conductive microneedle structure or plurality of conductive microneedle structures adhered to a fixed substrate for the purpose of spatially defining a conduit for the routing of an electrical signal from the surface of said microneedle or microneedles to the posterior surface of the substrate is disclosed herein. A microneedle-based electrochemical biosensors structure comprises a substrate, a microneedle biosensor, a primary electrically conductive element, a secondary electrically conductive element and an electrically insulative annular barrier.

A wafer structure is disclosed comprising a top silicon layer with a polished surface, an oxide layer selectively removed in defined regions, and a bottom silicon layer. Selective oxide removal improves dicing, prevents small molecule ingress, and enhances MEMS device release and performance. The invention addresses challenges of conventional silicon-on-insulator (SOI) wafers, including jagged edges, particle generation during stealth dicing, slow and uncontrolled under-etch rates, and high resistive losses in radio frequency (RF) applications due to parasitic surface conduction. Patterning the oxide layer enables precise MEMS structure release, reduces die size, and improves RF isolation. The wafer structure is suitable for high-speed electronics, RF analog circuits, and MEMS devices such as resonators, accelerometers, and waveguides, offering improved manufacturability and device reliability.

The invention relates to an AC synchronous motor carbon brush polishing device, and belongs to the technical field of metallurgical maintenance equipment. According to the technical scheme, a carbon brush (10) is arranged in a carbon brush groove (8), a nylon cambered surface conduction row (3) is arranged at the bottom of a door-shaped frame, the part, penetrating into the door-shaped frame, of an abrasive belt (11) is placed on the nylon cambered surface conduction row (3), and the bottom of the carbon brush (10) makes contact with the abrasive belt (11); the door-shaped frame is placed on the carbon brush slip ring, and the nylon cambered surface conduction row (3) lifts the abrasive belt (11) to arch up to form the same radian as the carbon brush slip ring. The carbon brush polishing device has the beneficial effects that the bottom surface of a new carbon brush can be polished according to the contact slip ring radian of a use part, the application range is wide, the contact area of the carbon brush and the slip ring is increased, and slip ring abrasion and motor faults caused by the carbon brush problem are avoided.

The invention discloses a heating device and substrate processing equipment, the heating device comprises a heat conduction piece and a heating film layer, the heating film layer is arranged on the heat conduction piece, and the heat conduction piece is provided with a lower surface; the heating device is configured in the mode that when the liquid film on the surface of the substrate is heated, the lower surface of the heat conduction piece faces the surface of the substrate, the projection of the lower surface on the substrate at least covers the center of the substrate, and the heating film layer is used for conducting heat to the liquid film through the lower surface. The liquid film on the surface of the substrate is directly heated, and the heating effect is achieved.

The invention relates to the technical field of lamp processing equipment, and discloses an automatic dispensing machine for lighting lamp production, which comprises a base, a stepping turntable is arranged on one side of the middle part of the top end of the base, and the stepping turntable is used for carrying out 90-degree position adjustment on a lighting lamp substrate each time; four positioning grooves are formed in the stepping rotary table in a circumferential array mode and used for feeding positioning, substrate dispensing, lamp bead shaping and discharging treatment of an illuminating lamp substrate. By adding and arranging the drying and shaping mechanism, different from traditional hot air drying surface conduction heating, the mechanism stimulates polar molecules in glue to vibrate at high frequency through microwaves after the illuminating lamp substrate is subjected to dispensing processing, endogenous heating from the interior to the surface is achieved, the drying time is greatly shortened, the production efficiency is remarkably improved, and meanwhile, the product quality is improved. The precise design of the resonant cavity ensures that each part of the glue layer is uniformly heated, and the problems of glue carbonization, bubble residue and the like caused by local overheating are avoided.

The invention discloses a shell, an operating handle and an endoscope, and relates to the technical field of medical instruments, the shell is used for the endoscope, a containing cavity is formed in the shell, the containing cavity is suitable for containing an electronic element, the shell is provided with a gap, the containing cavity is communicated with the outside of the shell through the gap, and a conductive part extending in the gap direction is arranged in the gap of the shell. The conductive member at least partially shields the gap. The shell can provide a protection capability for the electronic element, prevents external dust and foreign matters from entering the accommodating cavity, and improves the protection capability. The shell is provided with a gap, the handle shell is prone to carrying static electricity due to friction and / or contact with the hand and / or clothes, and electrostatic charges can enter the containing cavity from the gap. And the conductive piece can play a role in conducting charges conducted to the gap from the outside or the outer surface of the shell. The conductive member timely guides and shunts charges gathered at the gap, thereby preventing the charges from gathering in a large amount in the gap, and preventing the charges from breaking down or damaging electronic components in the housing.

Disclosed in the present application are a heating device and a substrate processing apparatus. The heating device comprises a heat conducting member and a heating film layer, wherein the heating film layer is arranged on the heat conducting member, and the heat conducting member has a lower surface. The heating device is configured such that: when the device is used to heat a liquid film on a surface of a substrate, the lower surface of the heat conducting member faces the surface of the substrate, the projection of the lower surface on the substrate at least covers the center of the substrate, and the heating film layer is used for conducting heat to the liquid film by means of the lower surface. The present application directly heats liquid films on surfaces of substrates to achieve a heating effect.

The utility model relates to a coaxial low-sensing test fixture applied to the field of testing of high-power semiconductors, which comprises a pressure frame structure, a coaxial electrode structure and a laminated lead-out structure, and is characterized in that the coaxial electrode structure and the laminated lead-out structure are carried on the pressure frame structure; the coaxial electrode structure with the upper surface conduction as a core and the lower surface conduction as a periphery is formed by the coaxial electrode structure through an electric conduction structure of electrodes on the upper surface and the lower surface of the tested device, and the tested device of the coaxial structure is led out to the power supply test cabinet through the laminated lead-out structure to form laminated output wiring; the utility model has the beneficial effects that the heating function of the traditional test fixture is considered, the laminated lead-out structure and the coaxial electrode structure are adopted, the distributed inductance value of a test loop is reduced to a great extent after actual implementation verification, and the test fixture is safe and simple to use, efficient, practical and good in effect.

The present invention relates to the technical field of cable extrusion, and proposes a cooling mechanism for a cable sheath extruder, including a cooling device and a refrigeration device. The lower end of the cooling device is fixedly connected to a base, and collection devices are fixedly connected to both sides of the upper end of the base. A cycloidal device is fixedly connected to one side of the upper end of the base close to the cooling device, and an extrusion device is arranged on the left side of the right cycloidal device. The vibration is conducted to the cable wrapped with the upper sheath through the vibration wheel, so that after the cable wrapped with the upper sheath comes out of the cooling water, the water film on the cable sheath can be shaken and broken off, avoiding the water film from hindering heat conduction, resulting in internal cooling lag and affecting the consistency of the crystallinity of the insulating layer. Moreover, when the mechanical wave generated by the vibration propagates inside the material, the molecular kinetic energy is increased through phonon scattering, accelerating the heat conduction from the core to the surface and further improving the cooling uniformity.

The utility model discloses an airborne electronic chassis product carbon fiber shell, which comprises a bottom plate, a mounting frame, an aluminum frame and an embedded part, the mounting frame is arranged above the bottom plate, the aluminum frame is arranged on the mounting frame, the embedded part is arranged on the bottom plate, a shell body is arranged, a side shell is arranged on one side of the shell body, and the embedded part is arranged on the side shell. The sides, close to each other, of the shell and the side shell are provided with openings, the shell and the side shell are communicated with each other through the openings, the shell is provided with an installation groove matched with an electronic product, the installation frame is arranged on the outer side surfaces of the shell and the side shell, the shell and the side shell are made of carbon fiber materials, and the surfaces of the shell and the side shell are coated with conductive coatings. Through the conductive coating, surface conduction of the carbon fibers is achieved, the requirement for electromagnetic shielding is met, meanwhile, due to the characteristics of high strength and light weight of the carbon fiber material, the quality of the product is greatly reduced, and the problem that the overall quality of a current case is high is solved.

The utility model discloses a power chip packaging module with directional heat dissipation. The packaging module of the embodiment comprises a ceramic substrate, a circuit board and a power chip packaged between the circuit board and the ceramic substrate. Wherein the circuit board comprises an insulating substrate provided with a vacuum cavity, a conducting strip, an inner side conducting circuit and an outer side conducting circuit, the inner side conducting circuit is arranged on the inner side surface of the insulating substrate, the outer side conducting circuit is arranged on the outer side surface of the insulating substrate, and the conducting strip is embedded in the insulating substrate and exposed from the inner side surface of the insulating substrate; the vacuum cavity is located between the conducting strip and the outer side surface of the insulating substrate in the thickness direction of the circuit board. According to the utility model, the vacuum cavity is arranged in the insulating substrate of the circuit board, so that heat of the power chip is prevented from being conducted to the outer side surface of the insulating substrate, and the influence of the heat on electronic elements / assemblies attached to the circuit board is reduced.

The utility model belongs to the technical field of electric equipment, and discloses a power supply device and electric equipment. The power supply device comprises a shell and a power supply module, the shell comprises an upper cover and a lower shell, the upper cover is detachably connected to the lower shell, and an accommodating space is defined by the upper cover and the lower shell; the power module comprises a functional assembly, a first shell and an air cooling assembly, the functional assembly is located between the lower shell and the first shell and makes contact with the first shell, and the air cooling assembly is arranged on one side of the first shell and used for dissipating heat. By arranging the detachable upper cover, the maintenance is convenient, internal components of the power supply device are maintained only by detaching the upper cover, the whole power supply device does not need to be replaced, and the maintenance cost is reduced; the first shell is arranged outside the functional assembly, the functional assembly makes contact with the first shell, heat generated in the functional assembly can be conducted to the surface of the first shell from the surface of the element, the air cooling assembly blows air towards the first shell, the surface area of the first shell is larger, and therefore the heat dissipation effect is effectively improved.

The utility model relates to the technical field of electronic precision dies, in particular to a cooling mechanism of a stamping die, which comprises a die holder and a die body, the top of the die holder is fixedly provided with the die body, the inner wall of the die body is fixedly provided with a cooling pipe, one side of the cooling pipe is provided with a liquid pumping pipe, and the other side of the cooling pipe is provided with a liquid discharging pipe. And the liquid pumping pipe extends to one side of the exterior of the mold body and is fixedly connected with the mold body, and a liquid pump is fixedly installed between the liquid pumping pipe and the mold body. The cooling pipe is filled with anti-rust cooling liquid, heat conducted out of the surface of the inner shell of the die body is consumed, and therefore the effect of dissipating and cooling the stamping die is achieved, the anti-rust cooling liquid can rapidly take away the heat on the stamping die, and the service life of the stamping die is prolonged. And through the arrangement of the cooling pipe in the spiral water way shape and the spraying holes, metal powder and residual release agents adhered to the surface of the inner wall of the mold body can be washed and cleaned online.

The invention relates to the technical field of concrete, in particular to a polymer insulating resin composite material which comprises the following raw materials in parts by weight: 50-70 parts of epoxy resin, 10-20 parts of a curing agent, 2-8 parts of a first additive, 1-5 parts of a second additive, 5-10 parts of a flame retardant and 0.5-2 parts of a coupling agent. According to the invention, the first additive catalyzes and carbonizes waste paper to form a carbon nanotube loaded zinc oxide structure, by virtue of high conductivity of a conjugated pi bond, a charge conduction network is formed on the surface of the material, static electricity is quickly dissipated, and corona discharge caused by local electric field concentration is avoided; carriers are adsorbed and captured by surface hydroxyl groups, bulk phase conduction is inhibited by combining a physical barrier effect, surface conduction and bulk phase insulation functions are realized, and the problem of early failure caused by electrostatic accumulation of a traditional insulation resin material is solved.

The present invention discloses a method for improving the surface temperature uniformity of a Peltier hot / cold stage. The method utilizes a method of adding a thermal resistor with high transverse thermal conductivity and low longitudinal thermal conductivity of a suitable material to the surface of the Peltier plate. By setting five temperature measurement points on the Peltier surface, the temperature distribution data of the Peltier surface is obtained through a five-point thermocouple patch measurement method, and the surface temperature uniformity is calculated. Based on the relationship between the thermal resistor thickness and temperature uniformity, the thermal resistor thickness is continuously adjusted to ensure that the temperature uniformity meets the requirements. Increasing the thermal resistor with high transverse thermal conductivity and low longitudinal thermal conductivity can help evenly distribute heat, reduce the occurrence of hot spots and cold spots, and improve the temperature uniformity of the hot / cold stage based on the Peltier effect. The higher the transverse thermal conductivity, the faster the heat can be conducted on the surface, improving the heat conduction efficiency. The thermal resistor with low longitudinal thermal conductivity can reduce the difference between the thermal resistors, making the temperature more uniform.

A semiconductor-on-insulator (SOI) substrate includes a handle substrate, a charge-trapping layer located over the handle substrate and including nitrogen-doped polysilicon, an insulating layer located over the charge-trapping layer, and a semiconductor material layer located over the insulating layer. The nitrogen atoms in the charge-trapping layer suppress grain growth during anneal processes used to form the SOI substrate and during subsequent high temperature processes used to form semiconductor devices on the semiconductor material layer. Reduction in grain growth reduces distortion of the SOI substrate, and facilitates overlay of lithographic patterns during fabrication of the semiconductor devices. The charge-trapping layer suppresses formation of a parasitic surface conduction layer, and reduces capacitive coupling of the semiconductor devices with the handle substrate during high frequency operation such as operations in gigahertz range.

This invention improves performance of a semiconductor device including a diamond device. In the present disclosure, a semiconductor device comprises: a non-doped layer; a surface conductive layer formed in the non-doped layer; a drain electrode electrically connected to the surface conductive layer; a source electrode electrically connected to the surface conductive layer; a gate electrode formed on the surface conductive layer and configured from a T-gate structure; a surface protective film in contact with the drain electrode, the source electrode, and the gate electrode; and a cavity portion formed between the gate electrode and the source electrode.

The present application relates to the technical field of thin film inductor through copper pillar processing, and discloses a thin film inductor front and back surface through copper pillar cavity-free processing technology, including the following steps: preparing the inductor material to be processed, including the substrate with front and back surface lines and an insulating layer PI in the middle, drilling on the material in step S1, fixing the inductor to be drilled on the processing platform, determining the drilling position by using the positioning system of the numerical control drilling machine, starting the drilling machine, the drill starts to rotate and feeds downward according to the set parameters, drilling the inductor material to form a hole for subsequent copper pillar filling. The thin film inductor front and back surface through copper pillar cavity-free processing technology performs copper cutting treatment on the copper foil of the hole before copper plating, avoids sharp end electricity absorption during copper plating, causes sharp end pain speed too fast, performs one-time copper plating protection on the hole during copper pillar plating, improves the integrity of the copper foil in the hole, and avoids the formation of cavities due to bubbles during copper pillar processing.

The utility model relates to the technical field of work fixtures, in particular to a spring knurling type single-point fixing and limiting hanger contact device, which comprises a first steel wire and a second steel wire, the contact parts of the first steel wire and the second steel wire are flat and are provided with rough patterns, the original large-surface conduction of a round steel needle is changed into multi-point small-surface contact type conduction, and the contact points of the first steel wire and the second steel wire are flat. Therefore, the problem that a workpiece is scrapped when intermittent conduction occurs due to large-surface conduction is fundamentally solved, multi-point small-surface contact type conduction is adopted, no matter how the workpiece shakes on a hanging tool contact, contact points are always in conduction, continuous conduction of the workpiece in the electroplating process can be effectively guaranteed, the product is completely not stressed on the hanging tool contact, and the workpiece is not damaged. And the product cannot be deformed. Therefore, in the use process of the spring embossing type single-point fixing and limiting hanger contact device, the operation is simple, the electric conduction is effective, the qualified rate of electroplated products is ensured, and the production loss is avoided.

Thermally conductive coatings are deposited on an inner surface of a particle containment chamber to mitigate excessive heating of the inner surface. A particle manipulation system includes a particle containment plasma containment chamber with a thermally-conductive coating comprising bort, graphite, and / or diamond on the inner surface of the chamber. The coating material and thickness can be selected to absorb a majority of energetic radiation (such as X-rays) incident on the coating and transport heat generated by the absorbed X-rays away from the inner surface of the chamber. Methods of deposition, including in situ deposition, are also described.

A high-sensitivity MEMS graphene wind speed and direction sensor chip, the sensor includes: a glass substrate, a plurality of glass through holes are opened on the glass substrate, and a heat-conducting metal is arranged in the glass through holes; a temperature measuring component is arranged on the upper surface of the glass substrate and located at the top of the glass through hole, and is used to detect the change of resistance; a heating component is arranged at the bottom of the glass through hole, and is used to generate a measurement reference temperature; and an interconnection component is arranged on both sides of the interconnection component to derive the electrical signal of the temperature measuring component. The beneficial effect of the present invention is that the present invention adopts a double-sided layout, the upper surface of the glass substrate is distributed with a detection unit for temperature measurement, and the lower surface is provided with a heating resistor for heating. The heat emitted by the heating resistor can be conducted to the graphene temperature measuring unit at the shortest distance, which reduces the time for the heat of the sensor with a single-sided layout to be conducted from the substrate surface to the back of the substrate, thereby greatly improving the accuracy, sensitivity and response rate of wind measurement.

The invention belongs to the technical field of connectors, and particularly relates to a surface treatment method of a high-current connector. A nickel layer is formed on the surface of a base material of the high-current connector, then a silver-zinc alloy layer is formed, corrosion treatment is carried out, and liquid metal is used for vacuum treatment. According to the invention, a point contact mode between solids in a traditional connector is changed, and full-contact-surface conduction is realized by constructing a composite system of the nano-porous silver skeleton and the liquid metal. The liquid metal is pressed in and filled into nanoscale pores of the silver skeleton through vacuum, and a layer of dynamic and flowable electronic bridge is formed on a contact interface. When the connector is used subsequently, even if the surface is uneven or abrasion is generated in the plugging process, the liquid metal can instantly fill the gap, and the contact resistance is reduced to the level close to the intrinsic resistance of the material.

A semiconductor-on-insulator (SOI) substrate includes a handle substrate, a charge-trapping layer located over the handle substrate and including nitrogen-doped polysilicon, an insulating layer located over the charge-trapping layer, and a semiconductor material layer located over the insulating layer. The nitrogen atoms in the charge-trapping layer suppress grain growth during anneal processes used to form the SOI substrate and during subsequent high temperature processes used to form semiconductor devices on the semiconductor material layer. Reduction in grain growth reduces distortion of the SOI substrate, and facilitates overlay of lithographic patterns during fabrication of the semiconductor devices. The charge-trapping layer suppresses formation of a parasitic surface conduction layer, and reduces capacitive coupling of the semiconductor devices with the handle substrate during high frequency operation such as operations in gigahertz range.

A semiconductor package includes a die pad having a die attach surface, a semiconductor die mounted on the die attach surface and having a first bond pad at an upper surface facing away from the die attach surface, and an interconnect clip including a first section at least partially surrounding a central opening, a second section offset in a vertical direction from and spaced apart from the first section, and a support extending between the first section and the second section. The package further includes an electrically insulating encapsulant covering the semiconductor die. An upper surface of the first section of the interconnect clip is exposed from a planar surface of the encapsulant. A lower surface of the second section is flush with the upper surface of the semiconductor die, and the lower surface of the second section is conductively connected to the first bond pad.

This invention discloses a series of tall vertically raised and deep depressed features on the surface of the fabric that extends the electrical current pathway and hence lower the electrical conductance of the fabric surface and the diminish the risk of electrocution via surface conduction paths.

The utility model relates to the technical field of limiting hanging tool contacts, in particular to an elastic pressing knurling type double-point fixing limiting hanging tool contact device which comprises a copper frame, a hanging tool mechanism and a rough processing assembly, the rough processing assembly comprises a steel wire A, a steel wire B, a positioning component and an auxiliary component, the steel wire A is arranged on the copper frame, the steel wire B is arranged on the copper frame, and the positioning component is arranged on the copper frame. In the electroplating process of a workpiece, the steel wire A and the steel wire B are arranged, and the surface of a steel needle is subjected to rough treatment, so that the original large-surface electric conduction of a round steel needle is changed into multi-point small-surface contact type electric conduction, and the problems that the workpiece is scrapped when interrupted electric conduction occurs due to large-surface electric conduction, and multi-point small-surface contact type electric conduction is not easy to damage are fundamentally solved. No matter how the workpiece shakes on the connecting points of the hanging tool, the contact points always conduct electricity, and continuous electricity conduction in the electroplating process of the workpiece can be effectively guaranteed, so that poor batch of the workpiece caused by poor electricity conduction is avoided, and the production loss is reduced.

An imaging element unit that is built in a housing of an imaging device includes an imaging element that includes an imaging surface imaging a subject and a back surface opposite to the imaging surface, an anti-vibration function that moves the imaging element in plane directions of the imaging surface, and a first heat conductive member to which driving heat of the imaging element is conducted from the back surface and which is deformed to be capable of following movement of the imaging element caused by the anti-vibration function. The first heat conductive member includes an outer layer portion and at least one inner layer portion that is connected to the outer layer portion and is disposed in a space surrounded by the outer layer portion, and the outer layer portion and the inner layer portion include bent portions that allow the first heat conductive member to be deformable.

The invention discloses a corrosion-resistant part, a preparation method thereof and a plasma processing device. The preparation method comprises the following steps: providing a part body made of a transparent yttrium-based sintered body; performing surface conduction on the upper surface of the part body to form a conductive layer; and punching the part body subjected to surface conduction to form a hole channel penetrating through the part. Transparent yttrium-based powder is sintered into a transparent yttrium-based sintered body, the transparent yttrium-based sintered body is compounded with a conductive layer to prepare a conductive part body, and then the conductive part body is punched. Before and after punching, the surface of the part body and the inner walls of the holes are all transparent yttrium-based sintered bodies, so that film coating on the surface of the part body and the inner walls of the holes after punching is avoided, and then generation of microparticles is prevented.

The utility model discloses a direct-filtering type air purification device which comprises a variable-frequency microcontroller, a variable-frequency negative ion circuit, a negative ion discharge body, an ornament with a surface conduction characteristic and a synchronous variable-frequency positive electric signal, the variable-frequency negative ion generating circuit releases variable-frequency negative ions through the negative ion discharging body, the variable-frequency negative ions are released into the space through the fan, and the negative ions with the variable-frequency characteristic are released, so that the variable-frequency negative ions have the frequency characteristic after being combined with suspended particles, pollen, bacteria or viruses in the air; by outputting a positive charge signal with synchronous frequency conversion, a time-varying positive electric signal is connected to an ornament with a conductive characteristic, so that the ornament generates a frequency resonance effect on suspended particles, pollen, bacteria or viruses with negative charges in a space and captures and adsorbs the suspended particles, the pollen, the bacteria or the viruses on the ornament; negative electrons released at a high speed in a variable-frequency manner can cut off and break down hydrocarbon valence bonds of virus shells and RNA or DNA valence bonds in the shells, so that space virus and bacterium propagation is effectively inhibited.