19 results about "Surface conduction" patented technology

A method for circumscribing an insulating barrier region around a singular conductive microneedle structure or plurality of conductive microneedle structures adhered to a fixed substrate for the purpose of spatially defining a conduit for the routing of an electrical signal from the surface of said microneedle or microneedles to the posterior surface of the substrate is disclosed herein. A microneedle-based electrochemical biosensors structure comprises a substrate, a microneedle biosensor, a primary electrically conductive element, a secondary electrically conductive element and an electrically insulative annular barrier.

A wafer structure is disclosed comprising a top silicon layer with a polished surface, an oxide layer selectively removed in defined regions, and a bottom silicon layer. Selective oxide removal improves dicing, prevents small molecule ingress, and enhances MEMS device release and performance. The invention addresses challenges of conventional silicon-on-insulator (SOI) wafers, including jagged edges, particle generation during stealth dicing, slow and uncontrolled under-etch rates, and high resistive losses in radio frequency (RF) applications due to parasitic surface conduction. Patterning the oxide layer enables precise MEMS structure release, reduces die size, and improves RF isolation. The wafer structure is suitable for high-speed electronics, RF analog circuits, and MEMS devices such as resonators, accelerometers, and waveguides, offering improved manufacturability and device reliability.

The invention relates to an AC synchronous motor carbon brush polishing device, and belongs to the technical field of metallurgical maintenance equipment. According to the technical scheme, a carbon brush (10) is arranged in a carbon brush groove (8), a nylon cambered surface conduction row (3) is arranged at the bottom of a door-shaped frame, the part, penetrating into the door-shaped frame, of an abrasive belt (11) is placed on the nylon cambered surface conduction row (3), and the bottom of the carbon brush (10) makes contact with the abrasive belt (11); the door-shaped frame is placed on the carbon brush slip ring, and the nylon cambered surface conduction row (3) lifts the abrasive belt (11) to arch up to form the same radian as the carbon brush slip ring. The carbon brush polishing device has the beneficial effects that the bottom surface of a new carbon brush can be polished according to the contact slip ring radian of a use part, the application range is wide, the contact area of the carbon brush and the slip ring is increased, and slip ring abrasion and motor faults caused by the carbon brush problem are avoided.

The invention discloses a heating device and substrate processing equipment, the heating device comprises a heat conduction piece and a heating film layer, the heating film layer is arranged on the heat conduction piece, and the heat conduction piece is provided with a lower surface; the heating device is configured in the mode that when the liquid film on the surface of the substrate is heated, the lower surface of the heat conduction piece faces the surface of the substrate, the projection of the lower surface on the substrate at least covers the center of the substrate, and the heating film layer is used for conducting heat to the liquid film through the lower surface. The liquid film on the surface of the substrate is directly heated, and the heating effect is achieved.

The invention relates to the technical field of lamp processing equipment, and discloses an automatic dispensing machine for lighting lamp production, which comprises a base, a stepping turntable is arranged on one side of the middle part of the top end of the base, and the stepping turntable is used for carrying out 90-degree position adjustment on a lighting lamp substrate each time; four positioning grooves are formed in the stepping rotary table in a circumferential array mode and used for feeding positioning, substrate dispensing, lamp bead shaping and discharging treatment of an illuminating lamp substrate. By adding and arranging the drying and shaping mechanism, different from traditional hot air drying surface conduction heating, the mechanism stimulates polar molecules in glue to vibrate at high frequency through microwaves after the illuminating lamp substrate is subjected to dispensing processing, endogenous heating from the interior to the surface is achieved, the drying time is greatly shortened, the production efficiency is remarkably improved, and meanwhile, the product quality is improved. The precise design of the resonant cavity ensures that each part of the glue layer is uniformly heated, and the problems of glue carbonization, bubble residue and the like caused by local overheating are avoided.

The invention discloses a shell, an operating handle and an endoscope, and relates to the technical field of medical instruments, the shell is used for the endoscope, a containing cavity is formed in the shell, the containing cavity is suitable for containing an electronic element, the shell is provided with a gap, the containing cavity is communicated with the outside of the shell through the gap, and a conductive part extending in the gap direction is arranged in the gap of the shell. The conductive member at least partially shields the gap. The shell can provide a protection capability for the electronic element, prevents external dust and foreign matters from entering the accommodating cavity, and improves the protection capability. The shell is provided with a gap, the handle shell is prone to carrying static electricity due to friction and / or contact with the hand and / or clothes, and electrostatic charges can enter the containing cavity from the gap. And the conductive piece can play a role in conducting charges conducted to the gap from the outside or the outer surface of the shell. The conductive member timely guides and shunts charges gathered at the gap, thereby preventing the charges from gathering in a large amount in the gap, and preventing the charges from breaking down or damaging electronic components in the housing.

Disclosed in the present application are a heating device and a substrate processing apparatus. The heating device comprises a heat conducting member and a heating film layer, wherein the heating film layer is arranged on the heat conducting member, and the heat conducting member has a lower surface. The heating device is configured such that: when the device is used to heat a liquid film on a surface of a substrate, the lower surface of the heat conducting member faces the surface of the substrate, the projection of the lower surface on the substrate at least covers the center of the substrate, and the heating film layer is used for conducting heat to the liquid film by means of the lower surface. The present application directly heats liquid films on surfaces of substrates to achieve a heating effect.

The utility model discloses an airborne electronic chassis product carbon fiber shell, which comprises a bottom plate, a mounting frame, an aluminum frame and an embedded part, the mounting frame is arranged above the bottom plate, the aluminum frame is arranged on the mounting frame, the embedded part is arranged on the bottom plate, a shell body is arranged, a side shell is arranged on one side of the shell body, and the embedded part is arranged on the side shell. The sides, close to each other, of the shell and the side shell are provided with openings, the shell and the side shell are communicated with each other through the openings, the shell is provided with an installation groove matched with an electronic product, the installation frame is arranged on the outer side surfaces of the shell and the side shell, the shell and the side shell are made of carbon fiber materials, and the surfaces of the shell and the side shell are coated with conductive coatings. Through the conductive coating, surface conduction of the carbon fibers is achieved, the requirement for electromagnetic shielding is met, meanwhile, due to the characteristics of high strength and light weight of the carbon fiber material, the quality of the product is greatly reduced, and the problem that the overall quality of a current case is high is solved.

The utility model discloses a power chip packaging module with directional heat dissipation. The packaging module of the embodiment comprises a ceramic substrate, a circuit board and a power chip packaged between the circuit board and the ceramic substrate. Wherein the circuit board comprises an insulating substrate provided with a vacuum cavity, a conducting strip, an inner side conducting circuit and an outer side conducting circuit, the inner side conducting circuit is arranged on the inner side surface of the insulating substrate, the outer side conducting circuit is arranged on the outer side surface of the insulating substrate, and the conducting strip is embedded in the insulating substrate and exposed from the inner side surface of the insulating substrate; the vacuum cavity is located between the conducting strip and the outer side surface of the insulating substrate in the thickness direction of the circuit board. According to the utility model, the vacuum cavity is arranged in the insulating substrate of the circuit board, so that heat of the power chip is prevented from being conducted to the outer side surface of the insulating substrate, and the influence of the heat on electronic elements / assemblies attached to the circuit board is reduced.

The utility model relates to the technical field of electronic precision dies, in particular to a cooling mechanism of a stamping die, which comprises a die holder and a die body, the top of the die holder is fixedly provided with the die body, the inner wall of the die body is fixedly provided with a cooling pipe, one side of the cooling pipe is provided with a liquid pumping pipe, and the other side of the cooling pipe is provided with a liquid discharging pipe. And the liquid pumping pipe extends to one side of the exterior of the mold body and is fixedly connected with the mold body, and a liquid pump is fixedly installed between the liquid pumping pipe and the mold body. The cooling pipe is filled with anti-rust cooling liquid, heat conducted out of the surface of the inner shell of the die body is consumed, and therefore the effect of dissipating and cooling the stamping die is achieved, the anti-rust cooling liquid can rapidly take away the heat on the stamping die, and the service life of the stamping die is prolonged. And through the arrangement of the cooling pipe in the spiral water way shape and the spraying holes, metal powder and residual release agents adhered to the surface of the inner wall of the mold body can be washed and cleaned online.

The present invention discloses a method for improving the surface temperature uniformity of a Peltier hot / cold stage. The method utilizes a method of adding a thermal resistor with high transverse thermal conductivity and low longitudinal thermal conductivity of a suitable material to the surface of the Peltier plate. By setting five temperature measurement points on the Peltier surface, the temperature distribution data of the Peltier surface is obtained through a five-point thermocouple patch measurement method, and the surface temperature uniformity is calculated. Based on the relationship between the thermal resistor thickness and temperature uniformity, the thermal resistor thickness is continuously adjusted to ensure that the temperature uniformity meets the requirements. Increasing the thermal resistor with high transverse thermal conductivity and low longitudinal thermal conductivity can help evenly distribute heat, reduce the occurrence of hot spots and cold spots, and improve the temperature uniformity of the hot / cold stage based on the Peltier effect. The higher the transverse thermal conductivity, the faster the heat can be conducted on the surface, improving the heat conduction efficiency. The thermal resistor with low longitudinal thermal conductivity can reduce the difference between the thermal resistors, making the temperature more uniform.

A semiconductor-on-insulator (SOI) substrate includes a handle substrate, a charge-trapping layer located over the handle substrate and including nitrogen-doped polysilicon, an insulating layer located over the charge-trapping layer, and a semiconductor material layer located over the insulating layer. The nitrogen atoms in the charge-trapping layer suppress grain growth during anneal processes used to form the SOI substrate and during subsequent high temperature processes used to form semiconductor devices on the semiconductor material layer. Reduction in grain growth reduces distortion of the SOI substrate, and facilitates overlay of lithographic patterns during fabrication of the semiconductor devices. The charge-trapping layer suppresses formation of a parasitic surface conduction layer, and reduces capacitive coupling of the semiconductor devices with the handle substrate during high frequency operation such as operations in gigahertz range.

The present application relates to the technical field of thin film inductor through copper pillar processing, and discloses a thin film inductor front and back surface through copper pillar cavity-free processing technology, including the following steps: preparing the inductor material to be processed, including the substrate with front and back surface lines and an insulating layer PI in the middle, drilling on the material in step S1, fixing the inductor to be drilled on the processing platform, determining the drilling position by using the positioning system of the numerical control drilling machine, starting the drilling machine, the drill starts to rotate and feeds downward according to the set parameters, drilling the inductor material to form a hole for subsequent copper pillar filling. The thin film inductor front and back surface through copper pillar cavity-free processing technology performs copper cutting treatment on the copper foil of the hole before copper plating, avoids sharp end electricity absorption during copper plating, causes sharp end pain speed too fast, performs one-time copper plating protection on the hole during copper pillar plating, improves the integrity of the copper foil in the hole, and avoids the formation of cavities due to bubbles during copper pillar processing.

The utility model relates to the technical field of work fixtures, in particular to a spring knurling type single-point fixing and limiting hanger contact device, which comprises a first steel wire and a second steel wire, the contact parts of the first steel wire and the second steel wire are flat and are provided with rough patterns, the original large-surface conduction of a round steel needle is changed into multi-point small-surface contact type conduction, and the contact points of the first steel wire and the second steel wire are flat. Therefore, the problem that a workpiece is scrapped when intermittent conduction occurs due to large-surface conduction is fundamentally solved, multi-point small-surface contact type conduction is adopted, no matter how the workpiece shakes on a hanging tool contact, contact points are always in conduction, continuous conduction of the workpiece in the electroplating process can be effectively guaranteed, the product is completely not stressed on the hanging tool contact, and the workpiece is not damaged. And the product cannot be deformed. Therefore, in the use process of the spring embossing type single-point fixing and limiting hanger contact device, the operation is simple, the electric conduction is effective, the qualified rate of electroplated products is ensured, and the production loss is avoided.

The invention belongs to the technical field of connectors, and particularly relates to a surface treatment method of a high-current connector. A nickel layer is formed on the surface of a base material of the high-current connector, then a silver-zinc alloy layer is formed, corrosion treatment is carried out, and liquid metal is used for vacuum treatment. According to the invention, a point contact mode between solids in a traditional connector is changed, and full-contact-surface conduction is realized by constructing a composite system of the nano-porous silver skeleton and the liquid metal. The liquid metal is pressed in and filled into nanoscale pores of the silver skeleton through vacuum, and a layer of dynamic and flowable electronic bridge is formed on a contact interface. When the connector is used subsequently, even if the surface is uneven or abrasion is generated in the plugging process, the liquid metal can instantly fill the gap, and the contact resistance is reduced to the level close to the intrinsic resistance of the material.

A semiconductor package includes a die pad having a die attach surface, a semiconductor die mounted on the die attach surface and having a first bond pad at an upper surface facing away from the die attach surface, and an interconnect clip including a first section at least partially surrounding a central opening, a second section offset in a vertical direction from and spaced apart from the first section, and a support extending between the first section and the second section. The package further includes an electrically insulating encapsulant covering the semiconductor die. An upper surface of the first section of the interconnect clip is exposed from a planar surface of the encapsulant. A lower surface of the second section is flush with the upper surface of the semiconductor die, and the lower surface of the second section is conductively connected to the first bond pad.

This invention discloses a series of tall vertically raised and deep depressed features on the surface of the fabric that extends the electrical current pathway and hence lower the electrical conductance of the fabric surface and the diminish the risk of electrocution via surface conduction paths.

An imaging element unit that is built in a housing of an imaging device includes an imaging element that includes an imaging surface imaging a subject and a back surface opposite to the imaging surface, an anti-vibration function that moves the imaging element in plane directions of the imaging surface, and a first heat conductive member to which driving heat of the imaging element is conducted from the back surface and which is deformed to be capable of following movement of the imaging element caused by the anti-vibration function. The first heat conductive member includes an outer layer portion and at least one inner layer portion that is connected to the outer layer portion and is disposed in a space surrounded by the outer layer portion, and the outer layer portion and the inner layer portion include bent portions that allow the first heat conductive member to be deformable.

The invention discloses a corrosion-resistant part, a preparation method thereof and a plasma processing device. The preparation method comprises the following steps: providing a part body made of a transparent yttrium-based sintered body; performing surface conduction on the upper surface of the part body to form a conductive layer; and punching the part body subjected to surface conduction to form a hole channel penetrating through the part. Transparent yttrium-based powder is sintered into a transparent yttrium-based sintered body, the transparent yttrium-based sintered body is compounded with a conductive layer to prepare a conductive part body, and then the conductive part body is punched. Before and after punching, the surface of the part body and the inner walls of the holes are all transparent yttrium-based sintered bodies, so that film coating on the surface of the part body and the inner walls of the holes after punching is avoided, and then generation of microparticles is prevented.