9 results about "Surface conduction" patented technology

A wafer structure is disclosed comprising a top silicon layer with a polished surface, an oxide layer selectively removed in defined regions, and a bottom silicon layer. Selective oxide removal improves dicing, prevents small molecule ingress, and enhances MEMS device release and performance. The invention addresses challenges of conventional silicon-on-insulator (SOI) wafers, including jagged edges, particle generation during stealth dicing, slow and uncontrolled under-etch rates, and high resistive losses in radio frequency (RF) applications due to parasitic surface conduction. Patterning the oxide layer enables precise MEMS structure release, reduces die size, and improves RF isolation. The wafer structure is suitable for high-speed electronics, RF analog circuits, and MEMS devices such as resonators, accelerometers, and waveguides, offering improved manufacturability and device reliability.

The invention discloses a shell, an operating handle and an endoscope, and relates to the technical field of medical instruments, the shell is used for the endoscope, a containing cavity is formed in the shell, the containing cavity is suitable for containing an electronic element, the shell is provided with a gap, the containing cavity is communicated with the outside of the shell through the gap, and a conductive part extending in the gap direction is arranged in the gap of the shell. The conductive member at least partially shields the gap. The shell can provide a protection capability for the electronic element, prevents external dust and foreign matters from entering the accommodating cavity, and improves the protection capability. The shell is provided with a gap, the handle shell is prone to carrying static electricity due to friction and / or contact with the hand and / or clothes, and electrostatic charges can enter the containing cavity from the gap. And the conductive piece can play a role in conducting charges conducted to the gap from the outside or the outer surface of the shell. The conductive member timely guides and shunts charges gathered at the gap, thereby preventing the charges from gathering in a large amount in the gap, and preventing the charges from breaking down or damaging electronic components in the housing.

The utility model discloses an airborne electronic chassis product carbon fiber shell, which comprises a bottom plate, a mounting frame, an aluminum frame and an embedded part, the mounting frame is arranged above the bottom plate, the aluminum frame is arranged on the mounting frame, the embedded part is arranged on the bottom plate, a shell body is arranged, a side shell is arranged on one side of the shell body, and the embedded part is arranged on the side shell. The sides, close to each other, of the shell and the side shell are provided with openings, the shell and the side shell are communicated with each other through the openings, the shell is provided with an installation groove matched with an electronic product, the installation frame is arranged on the outer side surfaces of the shell and the side shell, the shell and the side shell are made of carbon fiber materials, and the surfaces of the shell and the side shell are coated with conductive coatings. Through the conductive coating, surface conduction of the carbon fibers is achieved, the requirement for electromagnetic shielding is met, meanwhile, due to the characteristics of high strength and light weight of the carbon fiber material, the quality of the product is greatly reduced, and the problem that the overall quality of a current case is high is solved.

The utility model discloses a power chip packaging module with directional heat dissipation. The packaging module of the embodiment comprises a ceramic substrate, a circuit board and a power chip packaged between the circuit board and the ceramic substrate. Wherein the circuit board comprises an insulating substrate provided with a vacuum cavity, a conducting strip, an inner side conducting circuit and an outer side conducting circuit, the inner side conducting circuit is arranged on the inner side surface of the insulating substrate, the outer side conducting circuit is arranged on the outer side surface of the insulating substrate, and the conducting strip is embedded in the insulating substrate and exposed from the inner side surface of the insulating substrate; the vacuum cavity is located between the conducting strip and the outer side surface of the insulating substrate in the thickness direction of the circuit board. According to the utility model, the vacuum cavity is arranged in the insulating substrate of the circuit board, so that heat of the power chip is prevented from being conducted to the outer side surface of the insulating substrate, and the influence of the heat on electronic elements / assemblies attached to the circuit board is reduced.

The utility model relates to the technical field of electronic precision dies, in particular to a cooling mechanism of a stamping die, which comprises a die holder and a die body, the top of the die holder is fixedly provided with the die body, the inner wall of the die body is fixedly provided with a cooling pipe, one side of the cooling pipe is provided with a liquid pumping pipe, and the other side of the cooling pipe is provided with a liquid discharging pipe. And the liquid pumping pipe extends to one side of the exterior of the mold body and is fixedly connected with the mold body, and a liquid pump is fixedly installed between the liquid pumping pipe and the mold body. The cooling pipe is filled with anti-rust cooling liquid, heat conducted out of the surface of the inner shell of the die body is consumed, and therefore the effect of dissipating and cooling the stamping die is achieved, the anti-rust cooling liquid can rapidly take away the heat on the stamping die, and the service life of the stamping die is prolonged. And through the arrangement of the cooling pipe in the spiral water way shape and the spraying holes, metal powder and residual release agents adhered to the surface of the inner wall of the mold body can be washed and cleaned online.

The invention belongs to the technical field of connectors, and particularly relates to a surface treatment method of a high-current connector. A nickel layer is formed on the surface of a base material of the high-current connector, then a silver-zinc alloy layer is formed, corrosion treatment is carried out, and liquid metal is used for vacuum treatment. According to the invention, a point contact mode between solids in a traditional connector is changed, and full-contact-surface conduction is realized by constructing a composite system of the nano-porous silver skeleton and the liquid metal. The liquid metal is pressed in and filled into nanoscale pores of the silver skeleton through vacuum, and a layer of dynamic and flowable electronic bridge is formed on a contact interface. When the connector is used subsequently, even if the surface is uneven or abrasion is generated in the plugging process, the liquid metal can instantly fill the gap, and the contact resistance is reduced to the level close to the intrinsic resistance of the material.

A semiconductor package includes a die pad having a die attach surface, a semiconductor die mounted on the die attach surface and having a first bond pad at an upper surface facing away from the die attach surface, and an interconnect clip including a first section at least partially surrounding a central opening, a second section offset in a vertical direction from and spaced apart from the first section, and a support extending between the first section and the second section. The package further includes an electrically insulating encapsulant covering the semiconductor die. An upper surface of the first section of the interconnect clip is exposed from a planar surface of the encapsulant. A lower surface of the second section is flush with the upper surface of the semiconductor die, and the lower surface of the second section is conductively connected to the first bond pad.

This invention discloses a series of tall vertically raised and deep depressed features on the surface of the fabric that extends the electrical current pathway and hence lower the electrical conductance of the fabric surface and the diminish the risk of electrocution via surface conduction paths.

The invention discloses a corrosion-resistant part, a preparation method thereof and a plasma processing device. The preparation method comprises the following steps: providing a part body made of a transparent yttrium-based sintered body; performing surface conduction on the upper surface of the part body to form a conductive layer; and punching the part body subjected to surface conduction to form a hole channel penetrating through the part. Transparent yttrium-based powder is sintered into a transparent yttrium-based sintered body, the transparent yttrium-based sintered body is compounded with a conductive layer to prepare a conductive part body, and then the conductive part body is punched. Before and after punching, the surface of the part body and the inner walls of the holes are all transparent yttrium-based sintered bodies, so that film coating on the surface of the part body and the inner walls of the holes after punching is avoided, and then generation of microparticles is prevented.