A wired circuit board having a terminal portion formed as a flying lead that can provide enhanced strength of the conductive pattern, both sides of which are exposed, by simple construction to effectively prevent disconnection of the conductive pattern. The wired circuit board having the terminal portion formed as the flying lead in which the both sides of the conductive pattern are exposed includes, in crossing areas where ends of a cover-side opening and ends of a base-side opening and the conductive pattern are crossed each other, (i) the widened portions formed in the conductive pattern or (ii) cover-side projections and base-side projections formed in the cover layer and the base layer, respectively.