Surface state checking method and circuit board checker

Abstract

The invention provides a surface conduction examination method and a substrate examination device, using the optical system which is the same as its prior art to promote the tilting angle resolution, thereby enhancing the examination accuracy. A substrate examination device having a light projecting section 4 consisting of the light sources which emits respectively the R, G, B coloring light and are installed respectively in different azimuth directions with respect to the examination region including soldering portion., extracts 1 or 2 color ingredients which have intensity higher than that of average value. The tilting surfaces adapting to each of light sources 8, 9, 10 are converted respectively into a light and shade monochrome red, green and blue image. Further, the tilting surface at boundary position, which a adapts to light sources 8, 9 is converted into a light and shade image having a color mixed with red and green, whereas the tilting surface at boundary position, which adapts to the light sources 9, 10 is converted into a light and shade image having a color mixed with green and blue.

Description

technical field [0001] The present invention relates to a technique for inspecting the surface state of a predetermined object to be inspected, such as a curved surface of an object with a curved surface such as a solder portion formed on a device-mounted circuit board, and an inclination state of a device lead. Background technique [0002] The applicant has previously developed a device for automatically inspecting solder portions on circuit boards by using the specular reflection characteristics of solder portions and by means of image processing (see Patent Document 1). [0003] Patent Document 1 - Special Publication No. 6-1173 [0004] Figure 8 The configuration and inspection principle of the circuit board inspection device disclosed in the aforementioned Patent Document 1 are shown. This inspection device is a device that generates an image of an inspection object by using three light sources 8, 9, 10 and an imaging device 3 capable of emitting red (R), green (G) a...

AI Technical Summary

Problems solved by technology

For example, using the above Figure 8 Even if the lead is deflected when observing the upper surface of the lead, if the change of the inclination angle caused by the deflection is very small, it is difficult to detect this small change because it is included in the range that is usually detected by red light. Detects tiny skew on leads

[0012] In this way, when it is desired to observe the inclination state of a steep object in detail or to detect a small change in the inclination angle, it will be difficult to achieve this with the above-mentioned optical system.

[0013] On the other hand, increasing the number of light sources was considered as a method of improving resolution in inclined surface detection, but this would inevitably lead to an increase in cost

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