Vacuum evaporation device

A technology of vacuum coating and evaporation, which is applied in vacuum evaporation coating, sputtering coating, ion implantation coating and other directions, can solve the problem of high requirements on mask accuracy, difficult mask production, and evaporation mask. The problem of high board production cost, to achieve the effect of reducing the manufacturing cost

Inactive Publication Date: 2014-06-18
BOE TECH GRP CO LTD +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0008] Evaporation films with different patterns need to be realized by evaporation masks with different patterns, that is, the pattern on the evaporation mask plate is consistent with the pattern of the vapor deposition film, and the vapor deposition films of different patterns need Replace the evaporation mask with different graphics, and th...

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0076] Figure 4 It is a schematic diagram of the cross-sectional structure of the vacuum evaporation device in the second direction X in Example 1 of the present invention.

[0077] Such as Figure 4 As shown, in this embodiment, the vacuum evaporation device includes:

[0078] A substrate driving mechanism (not shown) for moving and carrying the substrate 100, the surface of the substrate 100 forms a pattern area 101 to be evaporated;

[0079] A first mask drive mechanism (not shown) for moving and carrying the first mask 201;

[0080] A second mask driving mechanism (not shown) for moving and carrying the second mask 202;

[0081] an alignment mechanism for aligning the first mask plate 201 and the second mask plate 202 with the substrate 100 respectively; and an evaporation source 300 located on the second mask plate 200 Below the mask plate 202; wherein, the size of the effective mask pattern area A formed after the first mask plate 201 and the second mask plate 202 o...

Embodiment 2

[0094] Figure 11 It is a schematic cross-sectional structure diagram of the vacuum evaporation device in the second direction X in Example 2 of the present invention; Figure 12 It is a schematic diagram of the side structure of the vacuum evaporation device in the first direction Y in Example 2 of the present invention.

[0095] refer to Figure 11 and Figure 12 , in this embodiment, the vacuum evaporation device includes:

[0096] Line evaporation source 300;

[0097] A substrate driving mechanism (not shown) for moving and carrying the substrate 100. The surface of the substrate 100 forms a pattern area 101 to be evaporated, and the pattern area 101 to be evaporated is divided into several evaporation sub-areas 1012 of the same size;

[0098] A first mask drive mechanism (not shown) for moving and carrying the first mask 201;

[0099] A second mask drive mechanism (not shown) for moving and carrying the second mask 202, wherein the first mask 201 and the second mask ...

Embodiment 3

[0119] The schematic cross-sectional structure schematic diagram of the vacuum evaporation device of embodiment 3 in the second direction X is the same as the schematic cross-sectional structural schematic diagram of the vacuum evaporation device of embodiment 2 in the second direction X; Figure 15 It is a schematic diagram of the side structure in the first direction Y of the vacuum evaporation device according to Embodiment 3 of the present invention.

[0120] refer to Figure 11 and Figure 15 , in this embodiment, the vacuum evaporation device includes:

[0121] Line evaporation source 300;

[0122] A substrate driving mechanism (not shown) for moving and carrying the substrate 100. The surface of the substrate 100 forms a pattern area 101 to be evaporated, and the pattern area 101 to be evaporated is divided into several evaporation sub-areas 1012 of the same size;

[0123] A first mask drive mechanism (not shown) for moving and carrying the first mask 201;

[0124] ...

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Abstract

The invention provides a vacuum evaporation device. The vacuum evaporation device comprises a baseplate driving mechanism which is used for bearing and moving a baseplate, and a first mask plate driving mechanism which is used for bearing and moving a first mask plate positioned below the baseplate, a second mask plate driving mechanism which is used for bearing and moving a second mask plate positioned below the first mask plate so as to be matched with the first mask plate driving mechanism to change a mutual overlapping state of mask plate graphic areas of the first mask plate and the second mask plate, and an evaporation source which is positioned below the second mask plate. According to the vacuum evaporation device, at least two mask plates are arranged, so that the mutual overlapping state of the mask plate graphic areas of at least two mask plates is changed according to the graphic characteristics of graphic areas to be evaporated on the surface of the baseplate so as to be matched with graphics of the graphic areas to be evaporated on the surface of the baseplate. Thus, the graphic treatment of each layer of evaporated film is realized. As a result, the manufacturing cost of the mask plates is decreased.

Description

technical field [0001] The invention relates to the technical field of thin film formation, in particular to a vacuum evaporation device. Background technique [0002] At present, in the field of optoelectronics and display, especially in the fields of organic light-emitting diode (Organic Light-Emitting Diode, OLED), organic thin film transistor (Organic Thin Film Transistor, OTFT) and other device manufacturing fields, the inhomogeneity of vacuum evaporation of small organic molecules, Factors such as the strength and accuracy requirements of the evaporation mask (Mask) restrict the development of OLED display technology in the direction of large-scale substrates. In the vacuum evaporation device of the prior art, whether the evaporation source is a point evaporation source, a line evaporation source, or a surface evaporation source, etc., it is generally a one-step vacuum evaporation, that is, each layer of film is evaporated on the entire substrate at one time. [0003...

Claims

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Application Information

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IPC IPC(8): C23C14/24C23C14/04
CPCC23C14/042C23C14/24C23C14/50C23C14/54
Inventor 沐俊应马大伟
Owner BOE TECH GRP CO LTD
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