Preparation method of nano-copper printing ink and copper conductive film

A conductive film and nano-copper technology, applied in chemical instruments and methods, inks, conductive coatings, etc., can solve the problem of copper conductive film being easily oxidized

Inactive Publication Date: 2013-02-13
FUDAN UNIV
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  • Claims
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Problems solved by technology

[0006] The purpose of the present invention is to provide a preparation method of nano-copper ink and copper conductive film, so that the preparation process of nano-copper ink and the problem that nano-copper ink is easily oxidized in the process of making copper conductive film through post-processing steps such as printing and roasting be resolved

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  • Preparation method of nano-copper printing ink and copper conductive film
  • Preparation method of nano-copper printing ink and copper conductive film
  • Preparation method of nano-copper printing ink and copper conductive film

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Embodiment Construction

[0020] In order to make the object, technical solution and advantages of the present invention clearer, various embodiments of the present invention will be described in detail below in conjunction with the accompanying drawings. However, those of ordinary skill in the art can understand that, in each implementation manner of the present invention, many technical details are provided for readers to better understand the present application. However, even without these technical details and various changes and modifications based on the following implementation modes, the technical solution claimed in each claim of the present application can be realized.

[0021] The first embodiment of the present invention relates to a preparation method of nano-copper ink. In this method, nano-copper particles are uniformly dispersed in a solvent containing short-chain hydroxycarboxylic acid by ultrasonic action to obtain nano-copper ink; wherein, the weight of nano-copper The percentage co...

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Abstract

The invention relates to technical field of printed electronics, and discloses a preparation method of nano-copper printing ink and a copper conductive film. The preparation method comprises the following steps of: dispersing nano-copper into ethanol containing short-chain hydroxyl carboxylic acid, ethylene glycol or a mixed solution of ethanol and ethylene glycol, coating onto the surface of a substrate; and baking at a low temperature to form a copper conductive film. In the dispersing process of nano-copper, the short-chain hydroxyl carboxylic acid can react with oxidized nano-copper to generate an organic copper salt, and the organic copper salt and residual hydroxyl carboxylic acid are coated on the surface of nano-copper for preventing the nano-copper from being further oxidized; and in a baking process, the generated organic copper salt can be reduced into copper, the hydroxyl carboxylic acid is used for preventing nano-copper from being oxidized, and residual short-chain hydroxyl carboxylic acid has relatively-low boiling point and low decomposing temperature and is very easy to remove in the baking process, so that the problem of easiness in oxidizing of nano-copper in treatment processes such as dispersing, printing, baking and the like is solved effectively.

Description

technical field [0001] The invention relates to the technical field of printed electronics, in particular to a preparation method of using short-chain hydroxycarboxylic acid as a reducing agent and a dispersant to stably print nano-copper ink for electronics and a method for making a copper conductive film with the nano-copper ink. Background technique [0002] In recent years, printed electronics technology has attracted great attention in the application of radio frequency identification tags, wearable electronics, organic light-emitting diodes and organic solar materials. The traditional printed circuit industry uses photolithography. However, this method involves many steps, such as etching, metal deposition and electroplating. These processes are accompanied by the generation of large amounts of toxic chemical waste. Therefore, many researchers have begun to pay attention to the direct inkjet printing technology, because this method does not require additional etching a...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C09D11/02B32B15/20C09D11/52
CPCC09D5/24C09D11/037C09D11/52H05K1/097H01B1/026C09D11/033C09D7/67
Inventor 邓吨英肖斐
Owner FUDAN UNIV
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