4629 results about "Copper salt" patented technology

A method of preserving wood includes injecting into the wood an effective amount of a aqueous wood-injectable biocidal slurry, said a wood-injectable biocidal slurry containing dispersants and sub-micron biocidal particles selected from at least one of the following classes: 1) a plurality of particles containing at least 25% by weight of a solid phase of sparingly soluble salts selected from copper salts, nickel salts, tin salts, and/or zinc salts; 2) a plurality of particles containing at least 25% by weight of a solid phase of sparingly soluble metal hydroxides selected from copper hydroxide, nickel hydroxide, tin hydroxide, and/or zinc hydroxide; 3) a plurality of particles containing at least 25% by weight of a solid phase comprising a substantially-insoluble organic biocide selected from triazoles, chlorothalonil, iodo-propynyl butyl carbamate, copper-8-quinolate, fipronil, imidacloprid, bifenthrin, carbaryl, strobulurins, and indoxacarb; 4) a plurality of particles containing on the outer surface thereof a substantially-insoluble organic biocide; 5) a plurality of particles containing a solid phase of a biocidal, partially or fully glassified composition comprising at least one of Zn, B, Cu, and P. The particles may advantageously contain metallic copper, a leachability barrier, pigments, dyes, or other adjuvants disposed on the outer surface thereof.

The invention relates to a supported catalyst for use in the production of 1, 4-butynediol by a Reppe method, a preparation method thereof and application thereof, in particular to a method for preparing a catalyst for use in the synthesis of1, 4-butynediol by formaldehyde and acetylene in a slurry bed and application. The method is characterized by comprising the steps of: taking 40 to 60 mass percent of treated kaolin as a carrier, and depositing soluble copper salt and soluble bismuth salt on the carrier by a method for depositing sediments, so that the catalyst contains 57 to 37 mass percent of copper oxide. The catalyst prepared by the method has high activity and selectivity, and compared with similar catalysts without the carrier, the catalyst is wear-resistance and saves copper resources.

Compositions having antimicrobial activity contain particles comprising at least one inorganic copper salt; and at least one functionalizing agent in contact with the particles, the functionalizing agent stabilizing the particle in a carrier such that an antimicrobially effective amount of ions are released into the environment of a microbe. The average size of the particles ranges from about 1000 nm to about 3 nm. Preferred copper salts include copper iodide, copper bromide and copper chloride, most preferred being copper iodide. Preferred functionalizing agents comprise materials with a molecular weight of 60 or above, which include amino acids, other acidic materials, thiols, hydrophilic polymers, emulsions of hydrophobic polymers and surfactants. The functionalized particles are preferably made by a grinding process.

Disclosed herein is an electroless copper plating solution, including a copper salt, a completing agent, a reductant and a pH adjuster, in which the plating solution includes a 2,2-dipyridyl acid solution and the hydrogen ion concentration (pH) thereof is about 11.5 to about 13.0, a method of producing the same, and an electroless copper plating method. According to the plating solution of the present invention, an electroless copper plating film having stable and improved adhesivity and low electrical resistance can be obtained. Further, display devices including a metal pattern formed with the electroless copper plating solution can improve the reliability and price competitiveness of products prepared therefrom.

Embodiments of the invention are directed to a composition having antimicrobial activity comprising particles comprising at least one inorganic copper salt; and at least one functionalizing agent in contact with the particles, the functionalizing agent stabilizing the particle in a carrier such that an antimicrobially effective amount of ions are released into the environment of a microbe. The average size of the particles ranges from about 1000 nm to about 4 nm. Preferred copper salts include copper iodide, copper bromide and copper chloride. Preferred functionalizing agents include amino acids, thiols, hydrophilic polymers, emulsions of hydrophobic polymers and surfactants.

A method for preserving wood by injecting into the wood a slurry having: particles of a sparingly soluble copper salt, copper hydroxide, or both, wherein the weight average diameter d₅₀ of the particles in the slurry is between 0.1 microns and 0.7 microns and the d₉₈ of the particles in the slurry is less than about 1 micron; a dispersant; and water. The dispersant is anionic or a mix of anionic and non-ionic. Advantageously, less than 20% by weight of the particles have a diameter less than 20 nanometers. Useful copper salts include basic copper carbonate, tri-basic copper sulfate, copper oxychloride, basic copper nitrate, basic copper borate, copper borate, basic copper phosphate, or copper silicate. The slurry most preferably includes copper hydroxide particles. The slurry further advantageously includes at least one organic biocide, wherein at least a portion of the organic biocide is coated on the particles.

A wood preservative includes injectable particles comprising one or more sparingly soluble copper salts. The copper-based particles are sufficiently insoluble so as to not be easily removed by leaching but are sufficiently soluble to exhibit toxicity to primary organisms primarily responsible for the decay of the wood. Exemplary particles contain for example copper hydroxide, basic copper carbonate, copper carbonate, basic copper sulfates including particularly tribasic copper sulfate, basic copper nitrates, copper oxychlorides, copper borates, basic copper borates, and mixtures thereof. The particles typically have a size distribution in which at least 50% of particles have a diameter smaller than 0.25 μm, 0.2 μm, or 0.15 μm. At least about 20% and even more than 75% of the weight of the particles may be composed of the substantially crystalline copper salt. Wood or a wood product may be impregnated with copper-based particles of the invention.

The invention relates to preparation of a supported catalyst for 1,4-butynediol. The supported catalyst used is characterized in that a mesoporous molecular sieve is used as a carrier, and soluble copper salt and bismuth are loaded on the carrier by an impregnation method so that the mass content of copper in the catalyst is 15-30%, and the mass content of bismuth is 1-6%. In the prepared catalyst, the particle size of copper oxide is 10-80nm, and the bismuth oxide is amorphous powder; the copper oxide and the bismuth oxide are uniformly distributed on the carrier and interact with the carrier; and the catalyst has high activity and high selectivity in producing 1,4-butynediol through an alkyne hydroformylation reaction, is more stable and wear-resistant than similar catalysts, and saves copper resources.

The invention discloses a preparation method of a chelate coating with copper ions capable of controllably catalyzing release nitrogen monoxide and a polyphenol complex. The preparation method comprises the following steps: soaking a target modified material or an instrument in a mixed aqueous solution consisting of soluble metal salt, soluble copper salt and a compound having an o-phenol structure; and depositing a layer of chelate coating with copper ions with a function of catalyzing nitrogen monoxide and the polyphenol complex on the surface. The chelate coating with the copper ions and the polyphenol complex, which is obtained by the preparation method disclosed by the invention, not only has excellent biocompatibility and bacterial resistance, but also has a function of inducing catalysis of endogenous nitrogen monoxide to release in a blood environment. In addition, the coating is nearly applicable to surface modification of materials of all textures, complex geometrical shapes and different topological structures.

Disclosed herein are antimicrobial compositions comprising an effective concentration of a metal salt combined with a plant extract. In some embodiments the composition comprises a copper salt and/or an iron salt and/or a nickel salt and/or a cobalt salt; and an extract of a plant selected from a group consisting of Punka granatum, Viburnum plicatum, Camellia sinensis, and Acer spp. The invention extends to uses of such compositions as medicaments, and to methods of treating microbial infections. The invention extends to methods for preventing microbial infections by coating objects and surfaces with the compositions.

A method for making nanoparticles includes the steps of dipping a metal element in a solution that contains metallic ions or ions with a metal, wherein the metal element has a lower electronegativity or redox potential than that of the metal in the ions, and rubbing the metal element to make nanoparticles. Another method for making nanoparticles includes the steps of dipping a metal element in a solution that contains metallic ions or ions with a metal, wherein the metal element has a lower electronegativity or redox potential than that of the metal in the ions, and applying sonic energy to at least one of the metal element and solution. A further method for making copper nanoparticles includes the step of adding ascorbic acid to a copper salt solution.

The present invention relates to a method for manufacturing copper nanoparticles, in particular, to a method for manufacturing copper nanoparticles, wherein the method includes preparing a mixture solution including a copper salt, a dispersing agent, a reducing agent and an organic solvent; raising temperature of the mixture solution up to 30-50° C. and agitating; irradiating the mixture solution with microwaves; and obtaining the copper nanoparticles by lowering temperature of the mixture solution.

According to the present invention, several tens of nm of copper nanoparticles having a narrow particle size distribution and good dispersibility can be synthesized in mass production.

The invention discloses a method for preparing nano copper conductive ink, which can be applied in the field of printing electronic technology, in particular ink jet printing technology. The preparation method comprises the following steps of: dissolving copper salt and protective agent into a solvent, heating and stirring the solution, adding a small amount of alkali solution to adjust the pH ofthe solution to between 7 and 10, dripping a reducing agent into the solution, continuously stirring the solution to react for 30 to 60 minutes, and then cooling the reaction solution to room temperature to obtain nano copper dispersion; performing centrifuging, washing and vacuum drying at room temperature on the nano copper dispersion to obtain nano copper granules; and dispersing the nano copper granules into an organic solvent, and ultrasonically treating the solution to obtain the nano copper conductive ink. The method solves the problems of complex preparation process and long preparation period in the prior art, has the advantages of simple and convenient operation, low production cost, short flow and no harmful waste generation, and realizes the goals of environmental protection and economy; and the prepared nano copper conductive ink has good dispersion property and high stability.

The invention belongs to a manufacture method of an antibacterial conductive acrylic fiber, which is characterized by being composed of the following steps: (1) arranging the acrylic fiber into a reaction vessel, then pouring a solvent into the reaction vessel, dissolving copper salt containing Cu<2+> into the solvent, adjusting the pH valve of the solution to be between 1.5 to 3.0, then adding a reducer and heating, maintaining the temperature of the solution to be between 90 to 100 DEG C, carrying out reduction on the Cu<2+> by utilizing the reducer to generate Cu<+> and lead the Cu<+> to be absorbed on the acrylic fiber; (2) adjusting the pH value of the solution to be between 1.5 to 3.0 and then maintaining the temperature of the solution to be between 40 to 120 DEG C, adding salt containing sulfur atoms and leading a great amount of Cu<+> to be oxidized to generate the Cu<2+> after the reaction time lasts 2 to 4 hours; thereby generating a sulfide of copper that is not easy to be dissolved in the solvent to lead the sulfide of copper to be sufficiently and uniformly dispersed on the surface of the whole fiber. The copper sulphide in the acrylic fiber manufactured by utilizing the method is dispersed on the surface of the whole fiber. The self physical and chemical characteristics of the copper sulphide lead the fiber to have excellent antibacterial property and conductibility; the copper sulphide on the fiber surface is not easy to fall off and has excellent anti-washing property.

Embodiments of the invention are directed to a composition having antimicrobial activity comprising particles comprising at least one inorganic copper salt; and at least one functionalizing agent in contact with the particles, the functionalizing agent stabilizing the particle in a carrier such that an antimicrobially effective amount of ions are released into the environment of a microbe. The average size of the particles ranges from about 1000 nm to about 4 nm. Preferred copper salts include copper iodide, copper bromide and copper chloride. Preferred functionalizing agents include amino acids, thiols, hydrophilic polymers emulsions of hydrophobic polymers and surfactants.

A Fe-based catalyst for the Fischer-Tropsch synthesis contains Re2O3, Fe3O4, La2O3, CuO, K2O and SiO2. It is prepared through using oxidant to oxidize partially the ferrous sulfate to obtain the mixed solution of iron sulfate and ferrous sulfate, mixing with the mixed solution of lanthanum nitrate and copper salt, fast depositing by alkaline compound, washing the deposited slurry, adding potassium silicate-water glass solution, and spray drying.

The invention discloses a graphene loaded Cu-CuxO composite material and a preparation method thereof. Through the preparation method, Cu-CuxO composite particles with uniform particle size and controllable morphology and components can be loaded on graphene. The preparation method comprises the following steps of dispersing uniformly oxidized graphite in deionized water by supersonic waves to obtain an oxidized graphene solution, adding a copper salt into the oxidized graphene solution, mixing uniformly, adjusting a pH value of the mixed solution obtained by the previous step to an appropriate pH value, putting the mixed solution into a reactor for a hydro-thermal reaction, carrying out separation and calcination of reaction products obtained by the hydro-thermal reaction to obtain the graphene loaded Cu-CuxO composite material. The preparation method has the advantages of common and easily available raw materials, low cost, and simple and safe preparation processes. The prepared graphene loaded Cu-CuxO composite material has good structural stability, excellent physicochemical properties, and potential application values in the fields of lithium ion batteries, photoelectric conversion, catalytic degradation and electron devices.

The invention provides chemical copper-plating solution. The chemical copper-plating solution is the aqueous solution containing copper salt, N-methylmorpholine, formaldehyde, complexing agent, stabilizer and pH regulator and the pH value of the chemical copper-plating solution is 12-13. The invention also provides a chemical copper-plating method. The method comprises the following steps: directly contacting a part to perform chemical copper plating with the chemical copper-plating solution, cleaning and drying to obtain the plated part. By adopting the chemical copper-plating solution, the stability of the copper-plating solution can be greatly increased and the plating speed can be increased. By adopting the chemical copper-plating method provided by the invention to plate copper on the part to be plated, the yield of the copper-plating product can be increased largely and the work efficiency of chemical plating can be increased, thus the method is good for industrialized mass production.

In a copper electroplating apparatus having separate anolyte and catholyte portions, the concentration of anolyte components (e.g., acid or copper salt) is controlled by providing a diluent to the recirculating anolyte. The dosing of the diluent can be controlled by the user and can follow a pre-determined schedule. For example, the schedule may specify the diluent dosing parameters, so as to prevent precipitation of copper salt in the anolyte. Thus, precipitation-induced anode passivation can be minimized.