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Electroplating solution for acid copper-plating for printed circuit board as well as preparation method and application method for same

A printed circuit board and acid copper plating technology, which is applied in the field of copper plating of printed circuit boards, can solve the problems of high cost, low additive depth capability and dispersion capability, and high cost, and achieve low cost of use and strong depth capability and dispersing ability, the effect of reducing the difference in thickness

Active Publication Date: 2013-04-24
CENT SOUTH UNIV
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Foreign dye-based additives are generally more expensive, and the cost is high for the production of low-end PCB boards. Therefore, the electroplating potions used by many domestic small and medium-sized electroplating factories are not foreign dye additives, and most of them are produced by domestic manufacturers. Electroplating additives, and the depth and dispersion capabilities of these additives are not particularly high, so it is still very meaningful and necessary to develop an electroplating additive suitable for domestic low-end PCB board production in my country

Method used

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  • Electroplating solution for acid copper-plating for printed circuit board as well as preparation method and application method for same
  • Electroplating solution for acid copper-plating for printed circuit board as well as preparation method and application method for same
  • Electroplating solution for acid copper-plating for printed circuit board as well as preparation method and application method for same

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0028] The synthesis of the copolymer of N-vinylimidazolium salt and propenyl lipid: put 9.4g (0.1mol) vinylimidazole into 250ml three-necked flask, put the flask into 0 ℃ ice-water bath, slowly under stirring Add 12.2g (0.1mol) of 1,3-propyl sultone, continue to stir for half an hour, a white solid precipitates, filter the solid, wash the solid with ether three times, and obtain 18.2g (about 0.0843mol) of solid after vacuum drying , Dissolve the dried solid in a small amount of deionized water, put it in an ice-water bath at 0°C, slowly add concentrated hydrochloric acid equal to the amount of substance, and then stir in a water bath at 60°C for 12 hours, wash the obtained solution with ether, and distill it under reduced pressure to remove water , after vacuum drying, 17.4g (about 0.0689mol) of light red viscous liquid (denoted as VIS) was obtained. Take 8.64g (0.04mol) of the above-prepared red viscous liquid (VIS), 5g (0.04mol) of propenyl butyl ), 50ml benzene and 0.5g fr...

Embodiment 2

[0030] The molar ratio of VIS and propenyl butyl was changed to 2:1, and the other synthesis steps were the same as in Example 1, and a yellow film-like solid was finally obtained.

Embodiment 3

[0032] The propenyl ethyl ester was used to replace the propenyl butyl ester in Example 1, and the other synthesis steps were the same as in Example 1 to finally obtain a pale yellow film-like solid.

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Abstract

The invention discloses an electroplating solution for acid copper-plating for a circuit board as well as a preparation method and an application method for the same. The electroplating solution disclosed by the invention is characterized in that a home-made synthesised levelling agent is added, and the levelling agent is matched with water-soluble copper salt, sulphuric acid, a brightening agent, chloride ions, a gloss agent and a surfactant to form the electroplating solution. The home-made levelling agent is one or more of the copolymer of N-vinyl imidazole onium salt and propenyl esters, and the polymer of N-vinyl imidazole and epoxides. The electroplating solution containing the home-made synthesised levelling agent is great in covering power and the dispersing power, capable of improving the uniform distribution of copper layers in the through holes of the printed circuit board, and capable of effectively reducing the ratio of the thickness of the surface copper layers to the thickness of the copper layers in the centres of the holes.

Description

technical field [0001] The invention belongs to the technical field of copper plating of printed circuit boards, in particular to an electroplating solution for through-hole copper plating of common printed circuit boards and a preparation and application method thereof. Background technique [0002] The acidic sulfate copper plating process is widely used in the metallization of printed board holes because of its simple basic composition, stable solution, high current efficiency, and adding appropriate additives to obtain a bright, smooth, and tough coating. [0003] The key to the quality of the acidic copper plating layer lies in the selection of additives. Large foreign companies have carried out research and development of acidic copper plating additives since the 1950s, and our country has also developed a dye-free coating in the late 1970s. Wide temperature acidic copper plating additive, its main components are M (2-thiobenzimidazole), N (ethylene thiourea), PN (polye...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C25D3/38C25D7/04
Inventor 唐有根黄远提彭志光王海燕蒋金芝
Owner CENT SOUTH UNIV
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