590 results about "Micro mirror" patented technology

The invention provides a manufacturing and processing photoetching method and system of a display panel, and relates to the technical field of photoetching processing. According to the method, the display panel substrate is subjected to cleaning, prime coating and partition division to form an imageable micro-mark covering all exposure partitions, and the thickness and the uniformity are measured after lower-layer supporting glue and upper-layer imaging glue are sequentially formed; carrying out in-situ acquisition and modeling by taking the micro-mark as an imaging object, and generating an exposure correction instruction and an overlapping energy table; performing partition exposure and real-time correction by using a digital micromirror, and completing development to obtain an anti-etching window with a steep side wall; and setting an etching window according to the exposure record and the window quality data, and executing low-damage etching and defect recovery to form stability evaluation data. According to the method, comprehensive improvement of high-precision exposure, pattern consistency and electrical stability is realized.

The invention discloses a preparation method of a vertical comb-driven MEMS (Micro Electro Mechanical System) micromirror, which comprises the following steps of: forming a through alignment mark and a pre-etched comb structure on a device layer by using a first composite mask, and forming the through alignment mark and the pre-etched comb structure on the back surface of the device layer on a first substrate through a composite mask process, after the first substrate and the second substrate are bonded, the self-alignment composite mask of the comb tooth structure is aligned with the back face pre-etched comb tooth structure through the through alignment mark, high-precision alignment of the comb tooth structure is achieved, accumulated errors are avoided, and the yield of device preparation is improved.

The invention relates to the technical field of preparation of medical supplies, in particular to a surgical membrane and a preparation process. During specific use, firstly, a polyurethane base membrane is selected and subjected to plasma treatment; spraying a nano SiO2 dispersion liquid containing a photoinitiator on the surface of the treated polyurethane base film, and then performing ultraviolet patterning irradiation to form a micro-bulge structure to obtain a base material layer; projecting the colloidal fluid to a temperature gradient mask through a digital micromirror device, so that the colloidal fluid is subjected to regional thermal polymerization on the substrate layer to form an intelligent adhesive layer with viscosity gradient; by adopting an aerosol jet printing technology, super absorbent fibers and polyvinyl alcohol-borax dynamic crosslinking hydrogel are co-deposited to form a drainage layer, so that the technical problems that a surgical membrane prepared by a surgical membrane preparation mode in the prior art is inflexible in adhesion and poor in surface structure performance, and a preparation process is difficult to accurately control are solved.

The invention provides an MEMS (Micro Electro Mechanical System) micromirror array chip, a module and optical scanning equipment. The MEMS micromirror array chip comprises a plurality of micromirror structures, a substrate, a vertical lead structure and a capacitance angle sensing structure, according to the micro-mirror array chip integrated with the capacitive sensor, array-level real-time angle detection, feedback control and high-precision scanning angle detection are realized, and the micro-mirror array chip is fast in driving and resistant to interference; meanwhile, the wiring density is reduced by frequency division multiplexing isolation signals; in addition, the application of a monolithic integrated capacitance angle sensor in a high-density micro-mirror array chip is realized by a thick substrate with a silicon through hole; and finally, the micromirror array chip of the monolithic integrated capacitance angle sensor is used for precision optical scanning equipment, a photoelectric angle detector is omitted, optical scanning high-precision real-time angle detection and feedback control, high-precision angle detection and high-speed scanning are realized, the use design is convenient, and the cost is low.

The invention provides a large-mirror-surface MEMS two-dimensional scanning micromirror which comprises a fast scanning shaft, a slow scanning shaft, a balance frame with multiple turns of coils, a micromirror surface and reinforcing ribs on the back face of the micromirror, the fast scanning shaft extends in the first direction, one end of the fast scanning shaft is connected with the micromirror surface, the slow scanning shaft extends in the second direction, and the other end of the fast scanning shaft is connected with the micromirror surface. The other end is connected with a balance frame with a plurality of turns of coils; the slow scanning shaft extends in a second direction perpendicular to the first direction, one end of the slow scanning shaft is connected with the balance frame with the multi-turn coil, and the other end of the slow scanning shaft is used for being connected with an external substrate; the balance frame with a plurality of turns of coils is of a hollow structure and is arranged around the mirror surface of the micro-mirror; the reinforcing ribs on the back face of the micro-mirror are of an oval hollow structure and are fixedly arranged on the lower surface of the mirror face of the micro-mirror, and the reinforcing ribs are connected in the first direction and the second direction to form a supporting structure. According to the structure, the rigidity of the mirror surface is greatly improved, and the capability of resisting external force interference is remarkably enhanced.

The invention provides a multi-physical field compensation method and system for an exposure machine, and the method comprises the following steps: constructing a dynamic error transfer model, and obtaining a coupling parameter based on the output of a coupling function; carrying out eigenvalue decomposition on the coupling parameters, screening principal component vectors to obtain a mapping matrix, modulating the mapping matrix through a thermal weight matrix to obtain a modulation matrix, and carrying out space-time weight reconstruction based on the modulation matrix to obtain a four-dimensional compensation parameter matrix; the control parameters of the air supply pressure of the air floating guide rail, the deflection angle of the DMD micromirror and the power of the laser are adjusted. A dynamic error transfer model containing mechanical-thermal-optical coupling characteristics is constructed, a vibration spectrum, temperature field distribution and light intensity energy data are fused in real time, compensation parameters are subjected to space-time weight reconstruction to obtain a four-dimensional compensation parameter matrix, the real-time performance of matching correction is improved, and therefore the parameter compensation effect and the machining precision are improved.

The invention relates to the field of wafer defect detection, in particular to a rapid zooming wafer detection microscope based on MEMS and a detection method. The microscope comprises an illumination part, a sample stage, a spectroscope, a microscope objective, an MEMS micromirror array zoom module, a CMOS image sensor, a laser interference distance measuring sensor and a synchronous control and processing module based on an FPGA. The MEMS micro-mirror array zoom module composed of a plurality of micro-mirror units is introduced into a light path, the deflection state of each micro-mirror unit is adjusted, a dynamic reflecting surface with a controllable equivalent curvature is formed, focusing regulation and control of imaging light beams are achieved, electronic focusing without mechanical movement is completed, the response speed is superior to that of traditional mechanical adjustment, and the imaging quality is improved. And the method is suitable for high-speed online detection.

The invention provides a structured light projector calibration method and system and a medium, and the method comprises the steps: projecting a multi-frequency stripe pattern to a target region based on an MEMS micromirror array module, obtaining a distorted image sequence, and carrying out the phase decoding, and obtaining a phase diagram corresponding to each frequency; resolving the phase diagram based on a phase shift method and an optical path triangulation principle to obtain a preliminary three-dimensional point coordinate; constructing a neural network model and a calibration sample set, obtaining a real three-dimensional coordinate by using a standard calibration plate or a known curved surface, and calculating the deviation between the initial three-dimensional point coordinate and the real three-dimensional coordinate to obtain a training sample set; and training the neural network model according to a training sample set based on an Euclidean distance loss function, outputting a three-dimensional offset compensation amount according to the neural network model, correcting the initial three-dimensional point coordinates, and realizing an end-to-end error self-compensation mechanism through the neural network model, so that deviation compensation is effectively performed on the three-dimensional point coordinates, and the accuracy of the three-dimensional point coordinates is improved. And the three-dimensional reconstruction precision is improved.

The invention discloses a semiconductor etching end point detection method and a multi-channel detection system, and the detection method comprises the following steps: outputting detection light; expanding the detection light into a continuous spectrum band; imaging the continuous spectral band to a modulation surface of a digital micromirror device, and establishing a pixel group corresponding to each narrow-band wavelength of the continuous spectral band; performing spatial sampling on the continuous spectrum band, and distributing and writing a unique radio frequency modulation frequency f for each pixel group; respectively executing vibration type switch modulation on each pixel group at a radio frequency modulation frequency f so as to convert wavelength information of a continuous spectrum band into a time domain frequency optical signal; converting the time domain frequency optical signal into a time domain electric signal; performing frequency domain analysis on the time domain electric signal, and demodulating gas absorption light intensity corresponding to each modulation frequency; and judging the etching end point of the semiconductor according to the change trend of the gas absorption light intensity. According to the invention, parallel detection of a plurality of spectrum channels can be realized through a single detector so as to judge an etching end point.

The invention discloses a calibration method of a polarization focal plane imaging system and an imaging system, relates to the field of photoelectric imaging and remote sensing detection imaging, and solves the problems of low correction efficiency and difficulty in correcting a system with a changed polarization state in the conventional polarization error correction technology. According to the calibration method, a plurality of coding patterns and corresponding polarization modulation matrixes are obtained based on the collected uniform light field and serve as calibration results. The polarization error correction method comprises the steps of obtaining an observation intensity vector based on a target scene; a corresponding polarization modulation matrix is obtained based on the coding pattern according to a coding polarization modulation matrix lookup table, and then a down-sampling Stokes vector after polarization error correction is obtained; and completing the correction of the polarization error through an imaging reconstruction method. A polarization focal plane imaging system comprises an imaging lens, a DMD digital micromirror array coding module, a focal plane DoFP polarization detector and an imaging reconstruction module. The method is suitable for the fields of remote sensing detection, target identification, environment monitoring and the like.

Laser-scanning systems for augmented reality glasses displays and LiDAR (light detection and ranging) use photonic integrated circuits to generate multiple collimated (or low-divergence) modulated laser beams. Laser light is guided on the photonic chip, expanded, and emitted from the surface of the chip (using grating coupler devices) as one or more large-diameter (e.g., millimeter-scale), collimated or low-divergence beams. These gratings may be integrated onto movable microelectromechanical systems (MEMS) plates to steer the beam along two angular axes. Alternatively, the beam(s) from the grating(s) may be steered by a separate MEMS mirror integrated onto the photonic chip or on another chip. Such systems enable multi-beam laser scanning systems without collimation lenses, reducing the size and packaging complexity of high-performance laser scanning systems for augmented reality glasses and LiDAR.

The invention discloses a scanning type exposure method and system adopting a parallel digital micromirror array, and relates to the technical field of photoetching exposure and maskless direct writing of mask.The scanning type exposure method comprises the steps that parallel digital micromirror initial mapping is established through a reference target exposure detection registration method; generating a block distortion field parameter table according to the initial mapping of the parallel digital micromirror, determining a micro-mark insertion position based on the block distortion field parameter table, and generating an expected coordinate; performing micro-mark exposure on the expected coordinate position, acquiring imaging data of the inserted micro-mark position, extracting an actual measurement coordinate from the imaging data of the micro-mark position, calculating a residual error by taking the expected coordinate and the actual measurement coordinate as an input difference, and writing the residual error into a residual error set; incremental fitting is carried out according to the residual set, the block distortion field parameter table is updated, and the exposure controller controls the parallel digital micromirror array to remap the pattern according to the updated block distortion field parameter table and triggers exposure. The method provided by the invention has better effects in coordinate mapping consistency and block parameter manageability.

The invention relates to a structured light illumination confocal super-resolution measurement system and method, and relates to the technical field of optical measurement. The system comprises a digital micromirror device (DMD), a sample platform, an electric displacement platform, a microscopic imaging assembly, a complementary metal oxide semiconductor (CMOS) imaging assembly and computer equipment, and the DMD is used for adjusting the point light source array and the structured light field. According to the DMD-based confocal super-resolution measurement method, a structured light field and a signal-noise separation technology are combined, and high-precision and high-resolution three-dimensional surface reconstruction can be realized. By using the flexibility of the DMD and the advantages of the super-resolution technology, the spatial resolution and speed of confocal imaging are effectively improved, so that the measurement process is more accurate. In addition, low-rank decomposition and self-supervised deep learning methods are fused, the image reconstruction process is optimized, noise interference is suppressed, and the overall performance of the system is further improved.

The invention relates to a micromirror element (200) as it can be used in micro-electro-mechanical systems (100), in particular for use in equipment (1) for semiconductor technology, and to a corresponding micro-electro-mechanical system (100) with at least one micromirror element (200). The micromirror element (200) comprises a mirror substrate (210) and a reflective coating (220) applied to the mirror surface (215) of the mirror substrate (210) which is intended to reflect, wherein at least one intermediate layer (230) is provided between the mirror substrate (210) and the reflective coating (220), wherein the at least one intermediate layer (230) is designed such that the at least one intermediate layer (230) together with the reflective coating (220) can be regarded as a combined layer (240) in relation to the mirror substrate (210) and the combined coefficient of thermal expansion of the reflective coating (220) and the at least one intermediate layer (230) corresponds essentially to the coefficient of thermal expansion of the mirror substrate (210) at least for a predetermined temperature.

The invention discloses a moving target identification and tracking system based on an analog micromirror array (AMA), belongs to the technical field of photoelectric tracking and machine vision, and aims to solve the technical problems of slow response, large inertia and complex structure of a traditional mechanical tracking system. According to the technical scheme, an AMA composed of a plurality of MEMS micromirror units which can be independently controlled and have the static or quasi-static two-dimensional deflection capacity is adopted as a non-mechanical light beam deflection actuator, the AMA can be composed of micromirror arrays in various forms, digital image data are analyzed in real time to solve the target offset, and the non-mechanical light beam deflection actuator is obtained. And an instruction is generated to drive the AMA to deflect at a high speed so as to compensate the deflection, so that continuous and stable locking and tracking imaging of the moving target are realized. The system has the advantages of being high in response speed, high in tracking precision, free of mechanical inertia and compact in structure, supports flexible switching of various working modes such as wide-area scanning and long-distance tracking, and is high in application flexibility.

The invention relates to a MEMS mirror array module (100) for use in semiconductor technology equipment. The MEMS mirror array module (100) comprises at least one MEMS micromirror unit (200) with a MEMS mirror array structure (210) and an elongated interface element (250) over which the MEMS mirror array structure (210) projects laterally, and a higher-level assembly (300) with at least one receptacle (350) for the interface element (250) of the MEMS micromirror unit (200), wherein the MEMS micromirror unit (200) is mounted in a receptacle (350) of the higher-level assembly (300) such that the MEMS mirror array structure (210) of the MEMS micromirror unit (200) abuts the higher-level assembly (300). A gas atmosphere with a thermal conductivity of more than 0.05 W / (m·K) is introduced into a gap (400) between the interface element (250) and the receptacle (350).

The invention relates to a method for producing at least one micromirror element (200) as it can be used in micro-electro-mechanical systems (100), in particular for use in semiconductor technology equipment (1), and to a micro-electro-mechanical system (100) comprising corresponding micromirror elements (200). The process includes the following steps: - Providing a flat, two-sided mirror substrate (210); - Incorporating a predetermined shape at least on the side (215) of the provided mirror substrate (210) intended to be reflective; and - Applying a reflective coating (220) at least to the side (215) of the provided mirror substrate (210) intended to be reflective.

The invention relates to the technical field of intelligent peripherals, in particular to a user-oriented interaction information expansion method, which comprises the following steps that: each keycap acquires displacement and pressure, generates an event packet, uploads the event packet through an optical wireless link, and obtains a clock and supplies power; constructing a keycap graph by a master controller, obtaining an intention vector through graph convolution and pooling, inputting the intention vector into a cyclic network to generate a pixel matrix and a phase matrix, and downlink after Bernoulli sparse coding; performing key cap side orthogonal matching pursuit decoding and four-round gradient optimization, and outputting a differential pixel set, a differential phase set and a synchronization mark; the master control refreshes the digital micromirror array and the ultrasonic phased array in a differential manner, locks a frame-level time sequence through a synchronization pulse, compensates link delay and hardware drift in real time based on Kalman filtering, and keeps an optical-acoustic alignment error to be less than 100 microseconds; degradation monitoring enables a link to be automatically switched to a pre-carved character layer and to be quickly recovered when the link is abnormal, and a keyboard interaction information expansion scheme with low delay and high consistency is provided.

The invention relates to the technical field of optical waveguide preparation, and discloses an optical waveguide mother set splicing-free preparation method based on a DMD dynamic mask, and the method comprises the steps: obtaining the layout data of an optical waveguide mother set as initial design information, and generating a mask pattern sequence which comprises a plurality of partition mask patterns; establishing a pixel mapping relationship between the on-off state of the micro-mirror unit and the partition mask pattern; driving the transparent substrate to execute partition positioning movement on the platform, and controlling the current exposure area of the photosensitive material layer to be aligned with the projection area of the partition mask pattern; on the basis of the pixel mapping relation and the partition positioning movement result, activating the mask pattern, and carrying out non-interval continuous exposure to form a full-page latent image pattern; the whole latent image pattern is subjected to developing treatment, the embossment structure of the optical waveguide master mask is treated and transferred into the transparent substrate, a waveguide core layer pattern is formed, the effects of non-interval continuous exposure and no segmented splicing are achieved, the preparation period of the surface embossment optical waveguide master mask is shortened, and the processing efficiency and the batch preparation yield are improved.

The invention discloses a miniaturized laser differential confocal Raman-LIBS (laser-induced breakdown spectroscopy) microscopic imaging method and device, and belongs to the technical field of microscopic spectral imaging. The device comprises a double-laser light source system for generating excitation light beams, an optical filter for separating spectral signals, a double-two-dimensional galvanometer light beam scanning system, a microscope objective, an axial scanning system, a differential confocal microscopic detection system, a mixed spectrum detection system and a computer control and display system. A double-two-dimensional micromirror scanning technology and a differential confocal microscopy technology are combined to carry out three-dimensional scanning on a sample, so that high-spatial-resolution detection of the geometrical morphology of the sample is realized; a same-light-path continuous laser and a pulse laser are respectively used as excitation light sources of Raman spectrum and laser-induced breakdown spectrum, and detection is carried out at a focal point on the surface of a sample, so that high-precision spectral information detection on the surface of the sample is realized. The sensor has the advantages of high sensitivity, multiple information, miniaturization, simple structure, wide applicability and the like, and is particularly suitable for the fields of environmental science, biomedicine, geological exploration and the like.

The invention relates to a MEMS mirror array module (100) for use in semiconductor technology equipment. The MEMS mirror array module (100) comprises at least one MEMS micromirror unit (200) with a MEMS mirror array structure (210) and a higher-level assembly (300), wherein the MEMS micromirror unit (200) is attached to the higher-level assembly (230) such that the MEMS mirror array structure (210) of the MEMS micromirror unit (200) is in contact with the higher-level assembly (300). The MEMS mirror array module (100) is configured such that sufficient heat conduction from the MEMS mirror array structure (210) to the higher-level assembly (300) is achieved to prevent an undesirably high temperature rise in or on the MEMS mirror array structure (210).

The application discloses a vertical micro-mirror structure optical computing chip and a wafer-level intelligent manufacturing method thereof, and relates to the field of optical computing chips.The optical computing chip comprises a plurality of optical modulators and a plurality of quantum logic gates, and the optical modulators are provided with interference light paths based on vertical micro-mirrors, so that optical modulation is realized; the quantum logic gates construct stable light paths through the mirrors provided by the vertical micro-mirrors, realize interference by means of a beam splitter, and perform Hadamard transformation by a wave plate at the entrance or exit of a target light path, so that optical computing is realized; a deep-groove beam splitter or a deep-wall beam splitter is used as the beam splitter, the silicon walls in the deep-wall beam splitter are provided with a predetermined included angle perpendicular to the two side walls of the substrate, and the deep-groove beam splitter is manufactured in the following manner: a deep groove pattern is photoetched on the surface of a single-crystal silicon wafer; the deep groove with the predetermined angle is etched by deep etching and the side walls are smoothed; an optical thin film is deposited in the deep groove; the shape of the deep-groove beam splitter is photoetched and etched by deep etching, and the side walls are smoothed; and an optical antireflection film is grown on the vertical side walls.

A beam projection apparatus includes a light source, micromirror component, a light guide lens set, a projection lens, a condensing lens with a lens portion and an asymmetrical lens portion extending from the lens portion and having a cut surface, and a wavelength conversion component disposed at a side of the condensing lens for at least partially converting a wavelength of a color light and reflecting the color light to the condensing lens. The light source is disposed corresponding to the cut surface and emits the color light. The micromirror component is disposed at another side of the condensing lens relative to the wavelength conversion component. The light guide lens set is disposed on a light exit axis of the lens portion to guide the color light to be incident to the micromirror component for forming a projection beam. The projection lens receives the projection beam for optical projection.

The application provides a microelectronic element and a preparation method thereof and an electronic device, and relates to the technical field of integrated circuits. The microelectronic element comprises a substrate, at least two adjusting members, a support structure and a micro-mirror structure; the at least two adjusting members are arranged along a first direction, the first end of each adjusting member is arranged on the substrate, and the second end of each adjusting member is arranged in an extendable and retractable manner along a second direction; the support structure comprises a support beam, a support column and a rotating beam, the support beam is connected to the second end of the adjusting member, the surface of the support beam away from the substrate is connected to the rotating beam through the support column, and the surface of the rotating beam away from the support beam is connected to the micro-mirror structure. The application can solve the problems that the structure of the microelectronic element is complex and the adjustment process of the deflection angle of the micro-vibration mirror is difficult.

An output control device of a laser direct writing image comprises a digital micromirror device and a carrying plate, a driving plate is connected with a host and the carrying plate, the host outputs data through a first output port, the driving plate comprises a first input port, a data processor, a display controller, a storage assembly and a second output port, and the first input port is connected with the data processor. The first input port communicates with the first output port, the first input port is connected with the data processor, the data processor is connected with the storage component and the display controller, and the display controller is connected with the second output port; the data processor comprises a first interface unit, a data processing unit and a second interface unit, the input interface of the display controller adopts a high-speed serial interface, and the second output port and the second input port adopt high-speed serial interfaces. The image control data is transmitted at a high speed, so that the transmission rate is greatly improved, and the transmission of ultra-high-rate image data signals is realized.

Lamp (10) with: a light source (100) designed to emit a first light; and a beam splitter (200) exposed to the first light beam and configured to transmit part of the first light beam to form a transmitted light beam and to reflect another part of the first light to form a reflected light beam, wherein the luminaire (10) produces an output beam pattern that includes the transmitted light beam and the reflected light beam, and a reflector (300) configured to further reflect the first light beam reflected by the beam splitter (200) to form a second reflected light beam, wherein the output beam pattern includes the second reflected light beam, characterized by a digital micromirror device (DMD, 400) configured to further reflect the second reflected light beam to form a third reflected light beam, wherein the output beam pattern includes the third reflected light beam, and a common circuit board (PCB, 800) on which the light source (100) and the digital micromirror device (400) are mounted.

The present invention presents improved systems and methods for performing multi-photon lithography. A line-scanning temporally focused two-photon lithography (LS-TFTPL) technique is capable of patterning three-dimensional structures with high throughput. An example LS-TFTPL system may include a pulsed laser, first optical components for expanding light pulses into an elongated or line cross section, a digital micromirror device for modulating the light pulses with a linear pattern and dispersing spectral components of the modulated light pulses, and second optical components for focusing the dispersed spectral components of the modulated light pulse at a line in or on a target material. The focused spectral components may alter the target material within selected voxels along the line, where the selected voxels spatially correspond to the linear pattern.

A micromirror device includes a first support portion that is connected to the mirror portion on a first axis located in a plane including the reflecting surface of the mirror portion in a stationary state, and that swingably supports the mirror portion around the first axis. The first support portion is composed of a main shaft stretched along the first axis and a plurality of sub-shafts symmetrically disposed on both sides of the main shaft across the first axis and stretched along the first axis, the first support portion has a folded structure having three or more folded portions formed by connecting the plurality of sub-shafts, and in a case where inner curvature radii of the folded portions are denoted by R1, R2, R3, . . . , in order from the closest to the first axis, a relationship of 0.73≤Rk+1 / Rk≤0.9 (k=1, 2, . . . ) is satisfied.

The invention relates to the technical field of micro-electro-mechanical systems, in particular to an MEMS micromirror structure and a preparation method thereof, and a supporting structure is bonded to the top surface of a substrate; the torsion beam is fixedly connected with the supporting structure, and the reflector is fixed in the middle of the torsion beam and divided into a first part and a second part by the torsion beam; the first interdigital electrodes are located on the side, away from the torsion beam, of the first part and comprise first fixed electrodes and first movable electrodes which are sequentially and alternately distributed in the direction away from the first part, and the top faces of the first fixed electrodes and the top faces of the first movable electrodes are not flush. The second interdigital electrode is located on the side, away from the torsion beam, of the second part and comprises a second fixed electrode and a second movable electrode which are sequentially and alternately distributed in the direction away from the second part, and the top faces of the second fixed electrode and the second movable electrode are not flush; the first movable electrode and the second movable electrode are used for being inclined by applying opposite driving force and driving the reflecting mirror to rotate around the torsion beam by a preset angle. The driving voltage for driving the micromirror structure can be reduced at least under the condition that the same driving force is provided.

This application discloses a calibration method, apparatus, electronic device, and storage medium for a circuit board exposure machine, relating to the field of circuit board manufacturing. According to a first aspect of this application, a calibration method for a circuit board exposure machine is proposed, applied to a circuit board exposure machine including a camera, a platform, and a digital micromirror. The method includes: moving the camera based on a standard target point on a test board to calibrate the camera; moving the platform based on the standard target point to calibrate the platform; acquiring a first exposure result from the digital micromirror and calibrating the digital micromirror based on the first exposure result; acquiring a second exposure result from the digital micromirror and calibrating the circuit board exposure machine based on the second exposure result. The circuit board exposure machine calibration method according to the first aspect of this application allows for step-by-step inspection of each key component of the circuit board exposure machine, enabling rapid identification of problematic components and reducing repair time.