425results about How to "Thin profile" patented technology

Certain embodiments of the invention provide plates for treating periarticular fractures or other non-full body weight bearing applications that combine polyaxial fixation with a low profile and enhanced contouring that more closely conforms to bone. Such plates can be designed to achieve buttressing effect and/or to be used in a reinforcement mode. Other features can be combined with these. Such plates can be created for use on bone sites such as on a tibia, fibula, metatarsal, calcaneous, other foot bone, humerus, radius, ulna, spinal, maxillofacial, as well as sites on other bones.

Embodiments of the invention are directed to semiconductor die packages. One embodiment of the invention is directed to a semiconductor die package including, (a) a semiconductor die including a first surface and a second surface, (b) a source lead structure including protruding region having a major surface, the source lead structure being coupled to the first surface, (c) a gate lead structure being coupled to the first surface, and (d) a molding material around the source lead structure and the semiconductor die, where the molding material exposes the second surface of the semiconductor die and the major surface of the source lead structure.

A knee brace divided into anterior and posterior sides by a frontal plane, and having first and second sides divided by a median plane. The knee brace having a frame, and at least one cross strap that is connected to the frame and extends across over at least a portion of the first and second brace sides. The at least one cross strap is arranged obliquely relative to the median plane. The brace also includes a tightening mechanism that is connected to the frame and is configured to incrementally tension the at least one cross strap at predefined settings and to release tension on the at least one cross strap. A first end of the at least one cross strap engages the tightening mechanism. A dosage meter is connected to the frame, and includes an indication feature representing tension settings of the at least one cross strap.

An endoscopic surgery apparatus is provided, including a tubular member, a handle located on a proximal end of the tubular member, and one or more pivotable arms detachably connected to a distal end of the tubular member. The tubular member has channels along its longitudinal axis, wherein at least one of the channels is an optical channel and at least one other channel is an illumination channel. The arms have guiding channels adapted to receive surgical tools, which direct the surgical tools. The arms are interchangeable with other arms of different configurations. Also, said arms have an open and a closed position, such that when the arms are in the closed position an opening is defined allowing viewing of a surgical site via the optical channel.

A flux concentrator and method for manufacturing a flux concentrator is provided. The method can include combining powdered soft magnetic material, a binder, a solvent, a internal lubricant; mixing the materials to create a mixture, evaporating the solvent from the mixture, molding the mixture to form a flux concentrator, and curing the flux concentrator. The flux concentrator may be laminated and broken into multiple pieces, which makes the flux concentrator more flexible. Breaking the flux concentrator does not significantly affect the magnetic properties. Since the permeability of the binder is very similar to that of air, adding tiny air gaps between the fractions is not significantly different than adding more binder.

A heat pipe with a nanostructured wick is disclosed, with the method of forming the nanostructured wick on a metal substrate. The wicking material is a pattern of metallic nanostructures in the form of bristles or nanowires attached to a substrate, where the bristles are substantially freestanding.

An FPGA is readily connectable to a high-speed fiber optic link by snap fitting an external fiber optic cable into an accommodating duplex fiber optic connector of a low-profile packaged FPGA integrated circuit. The low-profile packaged FPGA integrated circuit includes a die-bonded assembly disposed within a co-fired multilayer ceramic integrated circuit package. The die-bonded assembly includes the optoelectronic die, the bottom surface of which is die-bonded and electrically interconnected by micropads to the upper surface of the core of an FPGA integrated circuit die. A first optical fiber communicates light from the connector, through the package, and to a photodetector on the optoelectronic die. A second optical fiber communicates light from a laser diode on the optoelectronic die, through the package, and to the connector. In some embodiments, a micromirror device is disposed within the package to redirect light between the optoelectronic die and the optical fibers.

A display device includes: a display panel displaying an image; a first frame surrounding the display panel; and an adhesive between a side surface of the display panel and a side surface of the first frame, wherein the display device is attached and fixed to the first frame by the adhesive.

A refrigerator has a compartment defined by a liner. A door is configured to provide access into the compartment. A sub-compartment is mounted in the door. The sub-compartment has an access door that opens to provide access into the sub-compartment. The access door includes an inner door panel, an outer door panel, and a vacuum insulation panel disposed between the inner and outer door panels.

A communication terminal includes a housing carrying therein a radio antenna element, a speaker, and a chamber that acts as an electromagnetic resonance cavity for the antenna and as an acoustic resonance cavity for the speaker. The speaker is mounted inside the chamber and is coupled to the outside of the housing through a sound channel. The terminal includes a user interface on a front side of the housing and the speaker is placed behind the user interface as viewed from the front side, with the sound channel extending from a channel inlet at the speaker to a channel front outlet at the front side.