The invention relates to a method for manufacturing MEMS devices, in particular MEMS micromirror devices (14, 78), from a substrate
wafer (36). The substrate
wafer comprises
silicon material and MEMS structures (78, 80) separated by
silicon oxide (24). According to process step a), a first
coating part (32) of a MEMS device, in particular a MEMS
micromirror device (14, 78), is provided on a top surface of the substrate
wafer (36). Subsequently, according to process step b), a handling wafer (30) provided with a second
coating part (34) of the MEMS device, in particular a MEMS
micromirror device (14, 78), is applied over a surface area to the previously provided first
coating part (32). A connection, in particular a bond connection (50), is then formed between the coating parts (32, 34) as a full-surface connection to form a composite (86).Subsequently, micromirror elements (78) and / or
electrode arrangements (80) are formed in the substrate wafer (36), isolated from the
silicon material of the substrate wafer (36). Furthermore, the invention relates to the use of the method for the fabrication of MEMS devices, in particular MEMS micromirror elements (14, 78), from substrate wafers (36) containing silicon material.