12 results about "Micromirror device" patented technology

The invention relates to a method for producing at least one first (205) and second micromirror device (206). Here, a silicon wafer (100), in particular plate-shaped, having a front side (110) and a back side (120) is provided. Then, a silicon oxide layer (130) is applied to at least the front side (110) of the silicon wafer (100, 101). Subsequently, the silicon oxide layer (130) is removed such that at least one first separation region (131) and at least one second separation region (132) of the silicon oxide layer (130) are produced, wherein the first (131) and second separation region (132) of the silicon oxide layer (130) are arranged spatially separated from one another along a separation plane (140). Then, a silicon layer (150) is applied to the front side (110) of the silicon wafer (101) and the silicon oxide layer (130). Subsequently, an etching mask (180) is applied (70) to the back side (120) of the silicon wafer (100), wherein the etching mask (180) has a first opening (190) along the separation plane (140) of the first (131) and second separation region (132) of the silicon oxide layer (130). Subsequently, the silicon layer (150, 350) and the silicon wafer (100, 101) are removed (80) by means of an etching method in accordance with the etching mask (180) on the back side (120) of the silicon wafer (100, 101) and in accordance with the silicon oxide layer (130) of the silicon wafer (100), in particular the first (131) and second separation region (132) of the silicon oxide layer (130), such that at least one first (205) and second micromirror device (206) are produced.

A method for producing a first and second micromirror device. A silicon oxide layer is applied to at least the front side of a silicon wafer. The silicon oxide layer is removed so that a first and second separation region of the silicon oxide layer are generated, which are arranged spatially separated from each other along a separation plane. A silicon layer is applied to the front side of the silicon wafer and to the silicon oxide layer. An etching mask is applied to the rear side of the silicon wafer, the etching mask having a first opening along the separation plane of the first and second separation region. The silicon layer and the silicon wafer are removed, according to the etching mask on the rear side of the silicon wafer and according to the silicon oxide layer of the first and second separation region.

A photogrammetric camera for the two-dimensional measurement of objects has a lens, an image sensor and a pupil filter configured as a micromirror, each of which is transferable into a first and second tilted position. An illumination system produces light. A micromirror in the first tilt position reflects light produced by the illumination system such that the light cannot reach the object while light reflected at the object is guided to the image sensor. Conversely, a micromirror in the second tilt position reflects light such that the light can reach the object while light reflected at the object is supplied to the image sensor. To implement a recording of an image with coaxial dark or coaxial reflected light illumination, the micromirror device is controlled such that the light produced by the illumination system is incident on the surface at different angles within an angular range of at least arcsin(NA).

A micromechanical device (1a), in particular a micromirror device, is proposed, which has at least a first micromechanical component (2a) and a second micromechanical component (3a). The first component (2a) and the second component (3a) are connected to one another directly or indirectly. The first micromechanical component (2a) has a first sub-body (4a) and at least one second sub-body (5a). The first sub-body (4a) extends in a first plane (20a) and the second sub-body (5a) extends in a second plane (21a), which is different from the first plane (20a). The first plane (20a) and the second plane (21a) extend parallel to one another and the first plane (20a) extends above the second plane (21a). Here, the second sub-body (5a) is arranged in a transition region to the second micromechanical component (3a). A second extension (26a) of the second sub-body (5a) in a longitudinal direction is greater than a first extension (25a) of the first sub-body (4a) in the longitudinal direction.

A micromirror chip (200), a micromirror device, and an optical device, relating to the technical field of optical communications. The micromirror chip (200) comprises a substrate (1), a micromirror (2), a rotating platform (3), a cantilever beam (4), a support post (5), and a counterweight (6); the rotating platform (3) is connected to the substrate (1) by means of the cantilever beam (4), the micromirror (2) is fixed above the rotating platform (3) by means of the support post (5), and the counterweight (6) is fixed below the rotating platform (3); the substrate (1) has a surface at a position opposite the counterweight (6) in an arrangement direction of the counterweight (6), the rotating platform (3), and the support post (5), and there is a gap between mutually-facing surfaces of the substrate (1) and the counterweight (6) in the arrangement direction. The structure improves micromirror (2) rotational accuracy, and also allows for good hermeticity in substrates (1) of MEMS micromirror chips (200).

The present disclosure relates to multi-channel optical transmitter modules, lidar systems, and methods that involve micromirror devices. An example optical transmitter module includes at least one light-emitter device and a plurality of micromirror devices optically-coupled to the at least one light-emitter device. The at least one light-emitter device is configured to emit respective light beams toward an environment via the micromirror devices. The micromirror devices are configured to deflect the light beams. The optical transmitter module also includes a controller having at least one processor and a memory. The controller is configured to carry out operations. The operations include receiving information indicative of a retroreflector object in the environment. The operations include, based on the received information, causing at least one micromirror device of the plurality of micromirror devices to deflect at least one light beam so the at least one light beam does not interact with the retroreflector object.

An optical scanning device of the present disclosure includes: a micromirror device including a mirror that has a reflecting surface for reflecting light and is swingable around at least one axis, an actuator that allows the mirror to swing, and a piezoelectric element that generates and outputs electromotive force by the swinging of the mirror; a control device configured to control an operation of the actuator; and an abnormality detection device configured to detect an abnormal operation of the mirror based on a temporal fluctuation amount in an output signal from the piezoelectric element.

A MEMS micromirror device is formed in a package comprising a housing and a cover transparent to optical radiation. The package forms a cavity that houses a tiltable platform having a reflective surface. A metastructure is formed on the cover and / or the reflective surface and comprises a plurality of diffractive optical elements.

The invention provides a micro-mirror chip, a micro-mirror device and optical equipment, and belongs to the technical field of optical communication. The micro-mirror chip comprises a substrate, a micro-mirror, a rotating table, a cantilever beam, a supporting column and a balance block. The rotating table is connected with the substrate through the cantilever beam, the micromirror is fixed above the rotating table through the supporting column, and the balance block is fixed below the rotating table; the substrate is provided with a surface at a position opposite to the balance block in the arrangement direction of the balance block, the rotating table and the supporting column, and a gap is formed between the opposite surfaces of the substrate and the balance block in the arrangement direction. By adopting the MEMS micromirror chip and the manufacturing method thereof, the rotation accuracy of the micromirror can be improved, and the substrate of the MEMS micromirror chip can have good air tightness.

The utility model relates to the technical field of microscope equipment, and discloses a trinocular microscope camera interface structure, which comprises a slot arranged at the top of a microscope; the springs are symmetrically and fixedly connected to the inner side wall of the cavity; the limiting blocks are symmetrically and fixedly connected to the opposite ends of the spring, and inclined planes are arranged on the limiting blocks; the pull rods are symmetrically and fixedly connected to the top of the limiting block, and the top of the microscope is provided with through grooves for the pull rods to move; the fixing blocks are symmetrically and fixedly connected to the outer side wall of the connector; and the limiting grooves are symmetrically formed in the fixing block. The connector is directly inserted into the inserting groove, the limiting block is pushed into the cavity when the bottom end of the connector makes contact with the inclined face of the limiting block, the spring is extruded, when the limiting groove in the fixing block moves downwards to be located on the same horizontal line with the limiting block, the spring generating elastic force after deformation pops the limiting block into the limiting groove, and limiting of the fixing block and the connector is completed. Therefore, the camera can be inserted and installed conveniently and quickly.