Provided is a surface-treated
copper foil that has excellent adhesion between a resin substrate and the surface-treated
copper foil, has
low transmission loss, and can be used to manufacture a
printed circuit board or the like with good
laser workability. This surface-treated
copper foil has, on at least one side, a roughened surface on which roughened particles have been formed, and measured physical values for the roughened surface fulfill the following (a), (b), and (c). (a) The true reflectance of the roughened surface, measured using a spectrophotometer with a
light source that emits 45° polarized light at a
wavelength of 600 nm, and on condition that the incidence angle and the reflection angle are both 70°, is at least 0.20% and no greater than 0.90%. (b) The Y value for the brightness of the roughened surface is at least 10.0 and no greater than 15.5. (c) The Ssk of the roughened surface, measured using a
laser microscope, is at least 0.30 and no greater than 0.80.