The invention relates to a
copper foil with a carrier, a laminate, a method of producing a printed wiring board, and a method of producing electronic devices. The invention provides the
copper foil with the carrier having a small absolute value of the difference in releasing strength between the
copper foil with a carrier prepared by laminating and hot-pressing the surface close to an ultra-thin copper layer of the
copper foil with a carrier to an insulating substrate and used after the carrier is peeled off and the
copper foil with a carrier prepared by laminating and hot-pressing the surface close to the carrier of the
copper foil with a carrier to an insulating substrate and used after the ultra-thin copper layer is peeled off, while generation of swelling during laminating of the copper foil with a carrier to the insulating substrate by
hot pressing is prevented, discoloring of the surface of the ultra-thin copper layer due to oxidation is prevented, and the circuit
formability is high. A copper foil with a carrier, including a carrier, an intermediate layer, an ultra-thin copper layer, and a surface treated layer in this order, wherein no roughened layer is disposed on the surface of the ultra-thin copper layer, and the surface treated layer consists of Zn or a Zn
alloy, the amount of Zn applied in the surface treated layer is 30 to 300 <mu>g / dm2, and if the surface treated layer is composed of the Zn
alloy, the proportion of Zn in the Zn
alloy is 51% by
mass or more.