254results about "Circuit precursor manufacture" patented technology

The invention relates to the technical field of copper foil surface treatment, in particular to a copper foil and a preparation method and application thereof. The copper foil comprises an electrolytic copper raw foil, and a roughening treatment layer, a catechol-based polymer layer and a silane coupling agent layer which are sequentially laminated on the rough surface of the electrolytic copper raw foil. According to the copper foil, the catechol-based polymer layer is introduced between the roughening treatment layer and the silane coupling agent layer, the catechol-based polymer layer contains rich functional groups such as hydroxyl and amino, the number of attachment sites of a silane coupling agent on the surface of the copper foil is increased, and then the binding force of the silane coupling agent and the copper foil is increased; meanwhile, rich functional groups can also improve the binding force between the copper foil and various base materials, so that the copper foil has higher peel strength under the condition of keeping lower roughness during application.

The invention relates to the technical field of copper-clad plate preparation, in particular to a preparation method of a high-frequency flexible copper-clad plate. The preparation method comprises the following steps: taking a mixture of a trifluorochlor oethylene-vinyl ether fluororesin emulsion and a tetrafluoroethylene-perfluoroalkoxy vinyl ether copolymer emulsion as a fluorine-containing emulsion matrix, then adding isopropanol polycarbonate to prepare a composite emulsion, coating two surfaces of a PI film with the composite emulsion to prepare a fluorine-containing polymer layer, and finally preparing the fluorine-containing polymer layer. The fluorine-containing polymer layer has an interface bonding effect, the modified PTFE layer has the effects of reducing dielectric loss and enhancing stability, and the fluorine-containing polymer layer and the modified PTFE layer have a synergistic effect, so that the high-frequency flexible copper-clad plate is prepared. Therefore, the prepared high-frequency copper-clad plate has excellent high-frequency dielectric property, high-strength interface bonding property and excellent mechanical and dimensional stability.

The invention provides a double-sided conduction AMB ceramic substrate and a manufacturing method thereof, and belongs to the technical field of ceramic substrates for power modules. The manufacturing method comprises the following steps: punching holes in a ceramic substrate; filling conductive metal slurry into the holes by using a screen printing machine and sintering at high temperature; brazing materials are printed on the two faces of the ceramic; the copper layer and the ceramic layer are laminated and then subjected to vacuum brazing; manufacturing a circuit; etching the solder layer of the AMB line groove to expose the ceramic; performing surface treatment; laser cutting; and conducting test and inspection. Two-sided conduction is realized through metal slurry hole filling and a high-temperature sintering process, the problem that conduction of an upper copper layer and a lower copper layer of a traditional AMB ceramic substrate cannot be realized is solved, the assembling size of a power module is reduced, the three-dimensional integration requirement of a high-end module is met, meanwhile, the technological process is reasonable, and the production cost is reduced.

The invention relates to a metal-ceramic substrate, to an electronic component comprising a metal-ceramic substrate, and to a method for producing a metal-ceramic substrate. The metal-ceramic substrate comprises: a) a ceramic body which has a main extension plane, b) a metal layer which is connected to the ceramic body in a planar manner, the metal layer having a structuring region which comprises (i) partially solid material and (ii) partially non-solid material, and c) a contact area which is arranged on the metal layer and comprises silver, the structuring region having a geometry in a cross-section through the metal-ceramic substrate perpendicular to the main extension plane, the following requirement being met: S(BCsolid) / S(BCtotal)>60%, wherein: S(BCtotal) represents the total length of the line between points B and C, and S(BCsolid) represents the length of the line between points B and C that intersects the solid material.

The invention relates to the field of ceramic copper-clad plates, in particular to a manufacturing method of a double-sided conducting ceramic copper-clad plate for improving adhesive force between a copper sheet and a ceramic substrate, which comprises the following steps of: a, drilling a hole on the ceramic substrate to obtain a ceramic substrate hole, and processing burrs on the surface of the ceramic substrate hole which is of a through hole structure; b, the surface of the ceramic substrate obtained in the step a is cleaned, then holes of the ceramic substrate are filled with hole filling slurry, and the component of the hole filling slurry comprises Cu; c, the front face and the back face of the ceramic substrate are coated with brazing filler metal, the brazing filler metal is dried, and the brazing filler metal comprises Cu; and d, cleaning the copper sheets, respectively arranging the copper sheets on the brazing materials on the front surface and the back surface of the ceramic substrate, and then completing vacuum brazing to obtain the double-sided conduction copper-clad plate. The method is particularly suitable for the manufacturing process of the double-sided conduction ceramic copper-clad plate.

A method for manufacturing a circuit board that has both a high adhesive property and excellent high frequency characteristics is provided. Provided is a method for manufacturing a circuit board, the circuit board comprising a high frequency circuit that includes a base material, a ground layer, and a signal layer, at least the signal layer being a layer derived from a copper foil, the method comprising: (a) a step for, on the assumption of manufacturing a high frequency circuit using a copper foil having no adhesive agent layer, designing the specifications of a high frequency circuit having a predetermined impedance Z1; and (b) a step for forming a high frequency circuit in accordance with the specifications with the exception that the signal layer is formed by using, instead of the copper foil having no adhesive agent layer as assumed in the specifications, an adhesive agent layer-attached copper foil in such a way that an adhesive agent layer is interposed between the base material and the signal layer, to thereby manufacture a circuit board with the high frequency circuit having an impedance Z2 greater than Z1.

This application relates to a method for manufacturing a printed circuit board. According to the present application, it is possible to manufacture a printed circuit board having excellent bonding strength between a ceramic substrate and a metal sheet, and the manufacturing cost thereof can be reduced.

To provide a ceramic copper circuit board using a Ag-free brazing filler metal layer, wherein the brazing filler metal layer of the ceramic copper circuit board includes a protruding part, and a semiconductor device using the same.SOLUTION: A ceramic copper circuit board according to the embodiment includes a ceramic substrate, and a plurality of copper circuit parts bonded respectively via brazing filler metal layers on at least one surface of the ceramic substrate. The brazing filler metal layer does not contain Ag and contains Cu, Ti, and one or two kinds selected from Sn and In. The brazing filler metal layer includes a junction provided between the ceramic substrate and the copper circuit part, and a first protruding part provided around the junction and having a titanium content in the range of 70 mass% or more and 100 mass% or less. When the thickness of the copper circuit part is D and the shortest distance between adjacent copper circuit parts is P, the thickness D of the copper circuit part is 0.1 mm or more, and a region satisfying 1≤P / D≤3 is included.SELECTED DRAWING: Figure 1

The invention belongs to the technical field of converters, and relates to a magnetic integrated converter for fixed switching frequency resonant conversion, which comprises a magnetic core and a PCB (printed circuit board), the magnetic core is a UI-type magnetic core, and the PCB is a multilayer board; the secondary winding layer is located between the core columns of the magnetic core, the GND layer is arranged outside the core columns of the magnetic core in a sleeving mode, and the core columns of the magnetic core are sleeved with the core column via holes of the primary winding layer respectively; the secondary winding layer is provided with an output capacitor and a synchronous rectification transistor, and the primary winding layer is provided with an input capacitor, a primary transistor and a resonant capacitor; the secondary winding layer is electrically connected to the GND layer, so that the secondary side of the transformer forms a loop; the primary winding layers are connected in series; through the magnetic integrated converter with higher integration level, the area of the converter is remarkably reduced, so that the power density of the converter is improved.

The invention discloses a flexible copper-clad plate with high thermal conductivity and low dielectric property and a preparation method of the flexible copper-clad plate. The flexible copper-clad plate comprises an insulating substrate, the composite film is a thermoplastic polyimide / heat-conducting low-dielectric ePTFE / thermoplastic polyimide insulating composite film which is composed of a middle layer ceramic / boron nitride-expanded polytetrafluoroethylene functional hybrid membrane and thermoplastic polyimide layers on the two sides of the middle layer ceramic / boron nitride-expanded polytetrafluoroethylene functional hybrid membrane. And the flexible conductive metal foil is compounded with the single surface, double surfaces or multiple layers of the insulating substrate through a thermal forming compounding process. Through the mode, the flexible copper-clad plate can have excellent peel strength under the adhesive-free condition through structure optimization and process innovation, low dielectric constant and low dielectric loss tangent value can be realized under the high-frequency condition, and meanwhile, the heat conductivity coefficient is remarkably improved. And through continuous production, the efficiency is greatly improved, and a high-reliability base material is provided for the high-end electronic fields such as new energy vehicles, 5G / 6G communication and wearable equipment.

The invention relates to the technical field of multi-layer metal substrate production, in particular to a high-thermal-stability low-warpage PCB aluminum base layer and a preparation method thereof.The preparation method comprises the following steps that 1, an adhesive and a curing agent are mixed and dispersed for 20-40 min, then stirring is conducted for 20-30 min at the speed of 600-700 r / min, standing and exhaust treatment are conducted, and a glue solution is obtained; and (3) pretreating the surface of an aluminum plate, drying the aluminum plate, laminating the dried aluminum plate and the semi-cured adhesive film obtained in the step (2) on a roller press, laminating a copper foil on one side of the semi-cured adhesive film, and finally laminating the copper foil on a plate vulcameter to obtain the PCB aluminum base layer. The PCB aluminum base layer provided by the invention has better heat-conducting property, warping resistance and lower thermal expansion coefficient.

To provide a copper clad laminate and a method for manufacturing the same that enables high adhesion between low-dielectric resin film and copper plating layer and good volume resistivity while suppressing transmission loss when applied to flexible circuit boards.SOLUTION: A copper clad laminate according to the present invention includes: a low dielectric resin film with a relative permittivity of 3.5 or less and a dielectric loss tangent of 0.008 or less at a frequency of 10 GHz; and an electroless copper plating layer laminated on at least one surface of the low dielectric resin film, the weighted average size of crystallites in the electroless copper plating layer is 25 to 300 nm, and the adhesion strength between the resin film and the electroless copper plating layer is 4.2 N / cm or more.SELECTED DRAWING: Figure 1

The invention belongs to the technical field of halogen-free flame-retardant resin, and particularly relates to an aromatic phosphate type flame retardant as well as a preparation method and application thereof. The preparation method of the aromatic phosphate flame retardant comprises the following steps: in a nitrogen atmosphere, sequentially adding a phosphorus-containing compound, an acid-binding agent and a solvent A into a reaction flask, uniformly stirring at normal temperature, adding a bisphenol compound and a monophenol compound under a water bath condition, controlling the temperature not to exceed 45 DEG C, keeping stirring for 1-2 hours after the charging is completed, then heating to 50-60 DEG C, reacting for 8-12 hours, and cooling to room temperature to obtain the aromatic phosphate flame retardant. And after the reaction is finished, washing with pure water until the pH value is 7, and carrying out reduced pressure distillation to obtain the aromatic phosphate type flame retardant. The aromatic phosphate type flame retardant provided by the invention can provide halogen-free flame retardant characteristics, and a copper-clad plate prepared by compounding the aromatic phosphate type flame retardant with hydrocarbon resin is excellent in heat resistance, dimensional stability, dielectric property and the like, and can be used in the field of high-frequency and high-speed printed circuit boards.

[Object]To provide a copper clad laminate that is capable of achieving high adhesion between a low dielectric resin film and a copper plating layer and a good volume resistivity while suppressing a transmission loss when being applied to a flexible circuit board, and a method for producing the copper clad laminate.[Solving Means]A copper clad laminate of the present invention includes a low dielectric resin film having a relative permittivity of 3.5 or lower and a dissipation factor of 0.008 or lower at a frequency of 10 GHz, and an electroless copper plating layer laminated on at least one surface of the low dielectric resin film. A weighted average size of crystallites in the electroless copper plating layer is 25 to 300 nm, and an adhesion strength between the resin film and the electroless copper plating layer is 4.2 N / cm or more.

Disclosed is a substrate for printed circuits, which comprises a base film having polyimide as a main component and a conductor layer formed on at least one side of the base film, the conductor layer having a metal sintered layer formed on the base film and an electrolysis-free plating layer formed on the metal sintered layer, wherein the number of voids having a maximum width of 5 μm or more in plan view in the base film is 10 or less per 0.25 mm 2 of the reference unit area on the surface of the base film.

A semifinished product (100) which comprises a sacrificial structure (102) and two component carriers (104) releasably formed on opposing main surfaces of the sacrificial structure (102), wherein each of the component carriers (104) comprises at least one electrically insulating layer structure (114), and at least one electrically conductive layer structure (116), and wherein the two electrically insulating layer structures (114), each of which relating to a respective one of the component carriers (104), located closest to the sacrificial structure (102) are pure or unprocessed electrically insulating layers without electrically conductive material therein.

A system and process for manufacturing a flexible circuit board by laser cutting are provided. The process includes the steps of: S1, loading and adding protective layers, introducing a copper foil base layer, and laminating the protective layers to upper and lower surfaces of the copper foil base layer, respectively, S2, performing laser cutting on a semi-finished product treated in S1 to form a circuit structure; S3, removing scraps from the semi-finished product treated in S2, performing activated cleaning on the surfaces of the copper foil, and performing pseudo-lamination hot-pressing for; S4, performing combinational hot-pressing on the semi-finished product treated in S3; S5, performing a windowing operation on the semi-finished product treated in S4; and S6, detecting and coding the semi-finished product treated in S5.

The application provides a kind of grain texture synergic control's ceramic copper-clad plate oxygen-free copper strip, by mass percentage, chemical composition is: Cu is greater than or equal to 99.97%, O is less than or equal to 0.0005%, P: 0.0015%~0.0025%, Mg: 0.005%~0.01%, Sn: 0.005%~0.01%, the remainder is inevitable impurity.The application also provides the preparation method of the above copper strip, based on multiple rolling+intermediate annealing composite process.The application has the advantages that: through the microalloying treatment of oxygen-free copper, simultaneously using multiple rolling+intermediate annealing composite process, by adjusting the reduction distribution, the ratio of deformation texture and recrystallization texture is optimized, effectively inhibits high temperature grain growth;The prepared copper strip has high conductivity, high thermal conductivity, excellent surface quality, low plane anisotropy, and the grain is small and uniform after high temperature annealing, which significantly improves the high temperature resistance.

The application provides a high-frequency high-speed flexible copper-clad plate and a preparation method and application thereof. The high-frequency high-speed flexible copper-clad plate comprises a first copper foil layer, a first polyimide film layer, a first PFA film layer, a PTFE paint cloth layer, a second PFA film layer, a second polyimide film layer and a second copper foil layer arranged in sequence. The dielectric constant of the first polyimide film layer and the second polyimide film layer is independently 2.1-2.4, and the dielectric loss tangent is independently 0.0015-0.0025. The thickness of the first polyimide film layer and the second polyimide film layer accounts for 13-35% of the total thickness of the insulating layer. The copper-clad plate has excellent dimensional stability, better dielectric properties, better bending resistance and a lower thermal expansion coefficient.

A wiring circuit board has a metal support substrate, a base insulating layer disposed on a one-side surface of the metal support substrate in a thickness direction, and a conductor layer disposed on a one-side surface of the base insulating layer in the thickness direction. The metal support substrate and / or the conductor layer contain(s) a copper alloy, and the copper alloy contains a first metal consisting of copper and a second metal that can be alloyed with copper. In the metal support substrate and / or the conductor layer, the copper alloy has a sea-island structure including a sea portion having a continuous shape and an island portion having a discontinuous shape.

The application relates to the technical field of semiconductor packaging and relates to a kind of MSAP processing technology of carrier-like, copper foil is selected as starting material, the surface of copper foil is cleaned and activated, copper foil is immersed in special brown liquor, reaction time and temperature are controlled, copper foil is uniformly thinned to 4 mu m, copper foil is taken out from brown liquor, after washing and drying, a layer of photoresist is uniformly coated on the thinned copper foil, specific photomask is used to expose photoresist, then development treatment is carried out, the required circuit pattern is formed, electroplating is carried out in the area not protected by photoresist, conductive path is formed, remaining photoresist is removed by laser, and etchant is used to remove excess copper foil, leaving circuit pattern, the application can effectively replace the 18+3 mu m thick carrier copper foil manufactured by traditional technology by using brown liquor to thin copper foil to about 4 mu m, thereby solving the problems of thick carrier copper foil and high price in the prior art.

The present application relates to the technical field of semiconductor, especially to a kind of DBC copper-clad plate automatic positioning silk screen printing equipment, there is no equipment that can adapt to DBC copper-clad plate automatic positioning silk screen printing in current market or prior art, provide a kind of DBC copper-clad plate automatic positioning silk screen printing equipment, including operation platform, the rear side of the upper end of the operation platform is equipped with silk screen printing device, silk screen printing device includes the support box of being fixedly connected with operation platform, support box is equipped with rotatable cylindrical cam, cylindrical cam front end is equipped with suction wafer plate, when the cylindrical cam rotates, it can form the structure that suction wafer plate moves up and down intermittently and swings intermittently again;The right side of the upper end of the operation platform is equipped with the carrier base that can move forward and backward, the upper end of carrier base is equipped with the carrier holder that can move left and right, the upper end of carrier holder is equipped with carrier plate;Instead of manual installation, save human resources, form automatic production.

The invention relates to the technical field of electronic materials, in particular to a non-adhesive flexible copper-clad plate and a preparation method thereof.Nickel-phosphorus is sputtered on base material polyimide, the phosphorus element destroys the crystal structure of the nickel element, a nickel-phosphorus seed layer of an amorphous structure is formed, a copper layer is sputtered on the nickel-phosphorus seed layer, and the non-adhesive flexible copper-clad plate is obtained. And carrying out epitaxial growth of the copper element on the surface of the nickel-phosphorus seed layer in a two-dimensional layered manner to form a copper film, electroplating the surface of the copper film in an alkaline electroplating bath to thicken a copper layer, and carrying out oxidation treatment to obtain the non-adhesive flexible copper-clad plate. The seed layer selects a nickel-phosphorus target material to replace traditional nickel-chromium, so that environmental pollution is remarkably reduced. The technology is high in integration level, intermediate pollution is avoided, the peel strength of the obtained product can reach 0.8 N / mm or above, and the method is suitable for ultrathin high-frequency electronic devices.

A printed wiring board substrate according to one embodiment is provided with: a base material layer; and a copper foil which is laminated, directly or indirectly, over at least some part of one or both surfaces of the base material layer. The base material layer includes a matrix consisting mainly of a fluororesin and one or a plurality of reinforcing material layers included in the matrix. When the average thickness of the base material layer is represented by A, and the average distance between the copper foil surface facing the matrix, and the reinforcing material layer surface closest to said surface and facing the copper foil is represented by B, the ratio B / A is 0.003 to 0.37.

According to the copper foil for the flexible copper-clad plate, the preparation method of the copper foil and the flexible copper-clad plate, the copper foil for the flexible copper-clad plate is used for observing a square area with the side length of 26 microns in any selected visual field range of the copper foil under the 8000 multiplying power of a scanning electron microscope, and the number of observed air holes with the air hole diameter of 0.3-0.7 microns is 3-15; the surface roughness Rz of the copper foil is 0.2-0.4 [mu] m, and the thickness of the copper foil is 6-18 [mu] m. The copper foil for the flexible copper-clad plate is good in flexibility, the number of times of bending resistance can be increased, and crack propagation when the copper foil cracks in the bending process is inhibited; and no copper nodule exists on the surface, so that breakpoints between the copper foil and the flexible copper-clad plate can be avoided.

A copper clad laminate (500) has at least a first copper sheet layer (510), and a second copper sheet layer (520) laminated on opposing sides of a dielectric layer (530) comprising syndiotactic polystyrene and a filler comprising at least 3 vol.% hexagonal boron nitride particles (540), wherein more than 50% of the hexagonal boron nitride particles are aligned in parallel to the first copper sheet layer.

The invention provides a composite copper foil. The composite copper foil comprises a first copper foil, a second copper foil and an insulating joint layer, the insulating bonding layer is located between the first copper foil and the second copper foil. The thickness of the insulating bonding layer is less than 5 microns.

The present application relates to printed circuit board technology field, specifically a kind of double-sided buried line PCB board manufacturing method, first make circuit on thicker PCB single-sided board, then the circuit is pressed into insulating adhesive film, obtain single-sided buried line board, again two single-sided buried line board is pasted to a high-temperature-resistant adhesive film, obtain double-sided buried line board, and a circle of copper-plated conductive via is made at the edge of each unit of double-sided buried line board, to improve the overall strength of double-sided buried line board, while making copper-plated conductive blind hole, so that the circuit of upper and lower board forms a loop.Single-sided buried line board is thick and has high strength, which can avoid the warping of PCB during single-layer circuit manufacturing.The present application has short pressing time and low pressing temperature, which can avoid the problem of PCB warping due to the asymmetry of the circuit patterns of the two single-sided buried line boards.

The invention discloses an anti-static rigid-flex PCB and a processing technology thereof, and belongs to the technical field of PCB preparation. The processing technology of the anti-static rigid-flex PCB comprises the following steps: step 1, preparing polyimide base material particles and epoxy resin base material particles; 2, preparing a polyimide copper-clad plate and an epoxy resin copper-clad plate; and 3, cutting the polyimide copper-clad plate and the epoxy resin copper-clad plate, roughening the surface of a copper foil, coating a photoresist, pre-drying, exposing, developing, etching, removing a film, laminating, performing vacuum lamination, drilling, depositing copper, electroplating, manufacturing an outer circuit, performing resistance welding, performing surface treatment, forming and cutting to obtain the anti-static rigid-flex PCB. The PCB prepared according to the method has excellent antistatic performance.

The present invention provides an asymmetric metal foil-clad laminate and a printed circuit board including the same. The asymmetric metal foil-clad laminate includes one or at least two laminated low-modulus prepregs and a metal foil coated on one side of the one or at least two laminated low-modulus prepregs, or a metal foil with different thicknesses on both sides. The low-modulus prepreg has an elastic modulus of 22 GPa or less after curing. By using a low-modulus prepreg with an elastic modulus of 22 GPa or less after curing as an insulating material for the asymmetric metal foil-clad laminate, the obtained asymmetric metal foil-clad laminate and the printed circuit board manufactured therefrom have low warpage in state A and warpage after reflow soldering, ensuring the reliability of the printed circuit board.