487results about "Circuit precursor manufacture" patented technology

The invention discloses a copper-clad plate as well as a middle layer and a preparation method and application thereof, and belongs to the technical field of copper-clad plates. The preparation method of the intermediate layer for the copper-clad plate comprises the following steps: orthogonally weaving PBO fibers and glass fibers to obtain blend fibers; the mass ratio of the PBO fibers to the glass fibers is (10: 90)-(60: 40); carrying out modification treatment on the blend fibers to obtain modified blend fibers; dipping the modified blend fiber in a resin-containing dipping solution; and drying the impregnated modified blend fiber. The preparation method is simple and easy to operate, the PBO fibers and the glass fibers are orthogonally woven according to a specific ratio, so that on one hand, the blend fibers have the advantages of the PBO fibers and the glass fibers, on the other hand, the anisotropy of the blend fibers is effectively optimized, and the obtained copper-clad plate has relatively low dielectric loss and expansion coefficient; the peeling strength, the heat resistance and the flexibility are better.

The present invention relates to a process for preparing multi-material laminates for printed circuit boards that envisages the formation of a stack of plastic laminates, indicated below as "packages", separated by plates of electrically insulating material, and the heating of the stack in the presence of at least two temperature detectors that allow the uniformity of the temperature to be obtained along the whole stack, and a system for producing said laminates.

The invention relates to the field of copper-clad plates, and discloses a high-performance flame-retardant low-dielectric-loss copper-clad plate and a preparation method thereof.The copper-clad plate comprises epoxy resin, benzoxazine resin, composite filler, carboxyl-terminated nitrile rubber, an active diluent, a curing agent and the like; the composite filler is prepared by compounding flame-retardant modifier grafted graphene oxide and epoxy silane modified silicon dioxide hollow spheres; according to the flame-retardant modifier, boric acid and pentaerythritol are used for preparing a double-terminal hydroxyl boron-containing intermediate, then dichlorodiphenyl silane and phenylphosphonic dichloride react with hydroxyl groups at the two ends of the intermediate to prepare a flame-retardant intermediate, and amino silane and vanillic aldehyde react with chlorine atoms at the two ends of the intermediate to prepare an aldehyde modified flame-retardant intermediate; the copper-clad plate prepared by the preparation method disclosed by the invention is low in dielectric constant and dielectric loss, high in heat conductivity coefficient and good in flexibility, and also has excellent heat resistance and flame retardance.

A ceramic circuit board includes a ceramic substrate and a metal plate bonded together via a bonding layer, wherein when the ceramic circuit board is observed through a cross-section defined by a thickness direction and lateral direction of the ceramic circuit board: a side surface of the metal plate has an inclined shape; and the bonding layer has a bonding-layer protruding portion which protrudes by 20 μm or more and 150 μm or less from an edge where the bonding layer is in contact with the side surface of the metal plate. The shape and Vickers hardness of the side surface of the metal plate are controlled. The ceramic substrate is preferably a silicon nitride substrate.

The invention relates to the technical field of preparation of copper-clad plates, and discloses a preparation method of a phosphorus-containing flame-retardant halogen-free copper-clad plate, which comprises the following steps: uniformly stirring and mixing bisphenol A type epoxy resin, linear phenolic resin, phosphorus-containing tetraglycidyl ester and the like, smearing the mixture on E-glass fabric, baking to obtain prepregs, overlapping eight prepregs, coating copper foils on the two surfaces, and drying to obtain the phosphorus-containing flame-retardant halogen-free copper-clad plate. According to the preparation method, bisphenol A type epoxy resin is taken as matrix resin, linear phenolic resin is taken as a curing agent, phosphorus-containing tetraglycidyl ester is added, flame-retardant elements and a heat-resistant structure contained in the phosphorus-containing tetraglycidyl ester are utilized, the flame-retardant halogen-free copper-clad plate is obtained, and the flame-retardant halogen-free copper-clad plate is obtained. The flame retardant property, the heat resistance and the mechanical property of the copper-clad plate material are improved.

The present application discloses a method for laminating and preparing a high thermal conductivity circuit board and a high thermal conductivity circuit board. The preparation method comprises: dispersing and curing a liquid metal gallium-indium alloy and a fiber mixture in an inert argon atmosphere, and fusing the mixture with a matrix to obtain an adaptive thermal conductive substrate; performing gradient deposition and etching on the adaptive thermal conductive substrate to obtain a gradient spacing template; performing electrospinning infiltration and heat treatment on the gradient spacing template to obtain a substrate containing a dynamic thermal conductive network; performing a conductive layer pre-pressing treatment on the substrate containing the dynamic thermal conductive network to obtain a pre-assembled plate; performing a staged dynamic lamination treatment on the pre-assembled plate to obtain a molded circuit board; and performing surface spraying and deposition treatment on the molded circuit board to obtain the high thermal conductivity circuit board. The present application solves the problems of poor heat flow path and poor interface bonding in the prior art, significantly improving the thermal management effect and significantly improving the reliability and performance of electronic products.

The invention relates to a copper substrate embedding method for separated special-shaped copper blocks and a circuit board, and the method comprises the following steps: processing a plurality of special-shaped copper blocks with preset shapes on a copper plate, and reserving a plurality of connecting ribs which are not completely cut off between the adjacent special-shaped copper blocks; a gap between every two adjacent special-shaped copper blocks is filled with resin; a heat-conducting insulating layer and a copper foil are sequentially overlaid on the two opposite faces of the copper plate to form a stacked structure, and a substrate is formed through high-temperature pressing; an isolation groove is formed in the position, corresponding to the connecting rib, of the substrate, and the isolation groove cuts off the connecting rib; the isolation groove is filled with resin, and the resin overflowing out of the plate surface is rubbed down; and conducting treatment: forming a continuous conductive copper layer on the surface of the resin filling area. According to the invention, no copper groove needs to be buried, the copper block can be processed into a specific shape, and the distance between two adjacent special-shaped copper blocks is controlled to be 1.0 mm, so that the number and the area of the copper blocks buried in the substrate are greatly increased, and the heat dissipation performance and the electrical performance of the circuit board are improved.

The present invention relates to the field of copper clad laminates, and discloses a copper clad laminate with low dielectric constant and high performance and a preparation method thereof. The specific steps are as follows: taking epoxy resin, phenolic resin, polyphenylene ether modified resin, modified nano-silica, etc. and mixing them to obtain a resin glue solution; impregnating glass fiber cloth in the resin glue solution to obtain a prepreg; taking the prepregs and laminating them and hot pressing them with copper foil; the polyphenylene ether modified resin includes epoxy resin, diallyl cyanate, and a fluorinated polyphenylene ether resin prepared by reacting polyphenylene ether, bisphenol AF, and benzoyl peroxide; the modified nano-silica is prepared by reacting allyl glycidyl ether and vinyltriethoxysilane with phenyltris(dimethylsilyl)silane, and then grafting it with a phosphorus-containing intermediate to form a modified additive, and grafting the modified additive with nano-silica. The phosphorus-containing intermediate is prepared by reacting phenylphosphoryl dichloride and eugenol. A copper clad laminate with high flame retardancy, high peel strength, and heat-resistant low dielectric constant is prepared.

Provided are: a fluororesin sheet having both a low linear expansion coefficient (CTE) and improved adhesion to a copper foil having a smooth surface; and a copper-clad laminate using the fluororesin sheet. A fluororesin sheet containing a fluororesin and silica particles, the fluororesin sheet having an oxygen element ratio of 3.0 at% or more and a linear expansion coefficient (CTE) of 100 ppm / DEG C or less when measured by X-ray photoelectron spectroscopy (XPS) on one or both surfaces thereof.

The invention relates to the technical field of copper foil surface treatment, in particular to a copper foil and a preparation method and application thereof. The copper foil comprises an electrolytic copper raw foil, and a roughening treatment layer, a catechol-based polymer layer and a silane coupling agent layer which are sequentially laminated on the rough surface of the electrolytic copper raw foil. According to the copper foil, the catechol-based polymer layer is introduced between the roughening treatment layer and the silane coupling agent layer, the catechol-based polymer layer contains rich functional groups such as hydroxyl and amino, the number of attachment sites of a silane coupling agent on the surface of the copper foil is increased, and then the binding force of the silane coupling agent and the copper foil is increased; meanwhile, rich functional groups can also improve the binding force between the copper foil and various base materials, so that the copper foil has higher peel strength under the condition of keeping lower roughness during application.

The invention discloses an FPC high step manufacturing process, which comprises the following steps of: firstly selecting copper plating and then removing a film to carry out whole board copper plating, firstly carrying out local copper electroplating on an area which only needs to be thickened, and covering and protecting a circuit part by a dry film without participating in the copper plating process, so that the copper thickness of a via hole area can be effectively improved on the premise of not excessively increasing the copper thickness of the circuit; after selective plating is completed, copper electroplating is conducted on the whole plate, so that a thin copper layer is evenly plated on the surface of the whole copper foil base material, the step height difference generated during selective copper plating can be effectively reduced, the step gradient can be reduced, and copper surface transition is smoother.

The invention relates to the technical field of copper-clad plate preparation, in particular to a preparation method of a high-frequency flexible copper-clad plate. The preparation method comprises the following steps: taking a mixture of a trifluorochlor oethylene-vinyl ether fluororesin emulsion and a tetrafluoroethylene-perfluoroalkoxy vinyl ether copolymer emulsion as a fluorine-containing emulsion matrix, then adding isopropanol polycarbonate to prepare a composite emulsion, coating two surfaces of a PI film with the composite emulsion to prepare a fluorine-containing polymer layer, and finally preparing the fluorine-containing polymer layer. The fluorine-containing polymer layer has an interface bonding effect, the modified PTFE layer has the effects of reducing dielectric loss and enhancing stability, and the fluorine-containing polymer layer and the modified PTFE layer have a synergistic effect, so that the high-frequency flexible copper-clad plate is prepared. Therefore, the prepared high-frequency copper-clad plate has excellent high-frequency dielectric property, high-strength interface bonding property and excellent mechanical and dimensional stability.

The invention provides a double-sided conduction AMB ceramic substrate and a manufacturing method thereof, and belongs to the technical field of ceramic substrates for power modules. The manufacturing method comprises the following steps: punching holes in a ceramic substrate; filling conductive metal slurry into the holes by using a screen printing machine and sintering at high temperature; brazing materials are printed on the two faces of the ceramic; the copper layer and the ceramic layer are laminated and then subjected to vacuum brazing; manufacturing a circuit; etching the solder layer of the AMB line groove to expose the ceramic; performing surface treatment; laser cutting; and conducting test and inspection. Two-sided conduction is realized through metal slurry hole filling and a high-temperature sintering process, the problem that conduction of an upper copper layer and a lower copper layer of a traditional AMB ceramic substrate cannot be realized is solved, the assembling size of a power module is reduced, the three-dimensional integration requirement of a high-end module is met, meanwhile, the technological process is reasonable, and the production cost is reduced.

The invention relates to a metal-ceramic substrate, to an electronic component comprising a metal-ceramic substrate, and to a method for producing a metal-ceramic substrate. The metal-ceramic substrate comprises: a) a ceramic body which has a main extension plane, b) a metal layer which is connected to the ceramic body in a planar manner, the metal layer having a structuring region which comprises (i) partially solid material and (ii) partially non-solid material, and c) a contact area which is arranged on the metal layer and comprises silver, the structuring region having a geometry in a cross-section through the metal-ceramic substrate perpendicular to the main extension plane, the following requirement being met: S(BCsolid) / S(BCtotal)>60%, wherein: S(BCtotal) represents the total length of the line between points B and C, and S(BCsolid) represents the length of the line between points B and C that intersects the solid material.

The invention discloses a high-temperature-resistant resin glue solution for a copper-clad plate and a preparation method of the high-temperature-resistant resin glue solution, and relates to the technical field of copper-clad plates. The high-temperature-resistant resin glue solution is prepared from the following raw materials in parts by mass: 60 to 80 parts of dicyclopentadiene phenol type epoxy resin, 20 to 40 parts of fluorinated benzoxazine, 10 to 30 parts of dicyclopentadiene phenol type phenolic resin, 5 to 10 parts of hyperbranched polysiloxane, 90 to 100 parts of solvent, 5 to 8 parts of additive and 10 to 20 parts of inorganic filler. Wherein trifluoromethyl and naphthalene rings are introduced into the fluorinated benzoxazine, so that the heat-resistant stability and the dielectric property of the resin glue solution are effectively improved; a copper-clad plate sample prepared from the resin glue solution has a good application effect.

The invention discloses a production process for preparing a three-dimensional circuit by using laser forming and chemical etching after metallization of a plastic surface, and relates to the technical field of three-dimensional circuit preparation. The method comprises the following steps: S1, carrying out ultrasonic cleaning and oil removal on a plastic base material; s2, performing sand blasting roughening or laser treatment; s3, chemical coarsening is carried out; s4, palladium activation; s5, chemically plating a copper bottom; s6, thickening the circuit by chemical copper plating or electro-coppering; s7, plating a tin or nickel protective layer on the surface of the copper layer; s8, surface metal in a non-circuit area is cut off through laser forming; s9, copper etching is carried out; and S10, surface layer metal is plated again, and passivation hole sealing protection is carried out. According to the method, the material selection range of a three-dimensional circuit is greatly expanded, the processing limitation of a traditional process on a complex circuit structure is broken through, the circuit design requirements in different fields can be met, the process effectively solves the problem of high risk of circuit overflow plating connection when a high-precision circuit is manufactured on the surface of a plastic base material in the past, and the product quality is improved. The precision and the product yield of the three-dimensional circuit are further improved, and the method has a wide application prospect.

[Problem] To provide a copper-clad laminate capable of simultaneously achieving good volume resistivity in an electroless copper plating layer of a low dielectric resin film and suppression of transmission loss when applied to a flexible circuit board, and a manufacturing method thereof. [Solution] This copper-clad laminate is characterized by including a low dielectric resin film which has a relative dielectric constant of 3.5 or lower and a dielectric loss tangent of 0.008 or lower at a frequency of 10 GHz and an electroless copper plating layer which is laminated on at least one surface of the low dielectric resin film, wherein the electroless copper plating layer has a Ni-content of 0.01 to 1.2 wt%, and the electroless copper plating layer has a volume resistivity of 6.0 µΩ·cm or lower.

The invention relates to the field of ceramic copper-clad plates, in particular to a manufacturing method of a double-sided conducting ceramic copper-clad plate for improving adhesive force between a copper sheet and a ceramic substrate, which comprises the following steps of: a, drilling a hole on the ceramic substrate to obtain a ceramic substrate hole, and processing burrs on the surface of the ceramic substrate hole which is of a through hole structure; b, the surface of the ceramic substrate obtained in the step a is cleaned, then holes of the ceramic substrate are filled with hole filling slurry, and the component of the hole filling slurry comprises Cu; c, the front face and the back face of the ceramic substrate are coated with brazing filler metal, the brazing filler metal is dried, and the brazing filler metal comprises Cu; and d, cleaning the copper sheets, respectively arranging the copper sheets on the brazing materials on the front surface and the back surface of the ceramic substrate, and then completing vacuum brazing to obtain the double-sided conduction copper-clad plate. The method is particularly suitable for the manufacturing process of the double-sided conduction ceramic copper-clad plate.

A method for manufacturing a circuit board that has both a high adhesive property and excellent high frequency characteristics is provided. Provided is a method for manufacturing a circuit board, the circuit board comprising a high frequency circuit that includes a base material, a ground layer, and a signal layer, at least the signal layer being a layer derived from a copper foil, the method comprising: (a) a step for, on the assumption of manufacturing a high frequency circuit using a copper foil having no adhesive agent layer, designing the specifications of a high frequency circuit having a predetermined impedance Z1; and (b) a step for forming a high frequency circuit in accordance with the specifications with the exception that the signal layer is formed by using, instead of the copper foil having no adhesive agent layer as assumed in the specifications, an adhesive agent layer-attached copper foil in such a way that an adhesive agent layer is interposed between the base material and the signal layer, to thereby manufacture a circuit board with the high frequency circuit having an impedance Z2 greater than Z1.

This application relates to a method for manufacturing a printed circuit board. According to the present application, it is possible to manufacture a printed circuit board having excellent bonding strength between a ceramic substrate and a metal sheet, and the manufacturing cost thereof can be reduced.

To provide a ceramic copper circuit board using a Ag-free brazing filler metal layer, wherein the brazing filler metal layer of the ceramic copper circuit board includes a protruding part, and a semiconductor device using the same.SOLUTION: A ceramic copper circuit board according to the embodiment includes a ceramic substrate, and a plurality of copper circuit parts bonded respectively via brazing filler metal layers on at least one surface of the ceramic substrate. The brazing filler metal layer does not contain Ag and contains Cu, Ti, and one or two kinds selected from Sn and In. The brazing filler metal layer includes a junction provided between the ceramic substrate and the copper circuit part, and a first protruding part provided around the junction and having a titanium content in the range of 70 mass% or more and 100 mass% or less. When the thickness of the copper circuit part is D and the shortest distance between adjacent copper circuit parts is P, the thickness D of the copper circuit part is 0.1 mm or more, and a region satisfying 1≤P / D≤3 is included.SELECTED DRAWING: Figure 1

A resin composition for a metal-clad laminate plate includes a block copolymer comprising a butadiene block having a molar ratio of a 1,2-bonding structure to a 1,4-bonding structure of 80:20 to 100:0 and a styrene block. Further, the resin composition for the metal-clad laminate plate includes polybutadiene having a molar ratio of a 1,2-bonding structure to a 1,4-bonding structure of 80:20 to 100:0.

The present invention relates to a method for manufacturing a signal transmission cable for a battery management system (BMS), the method comprising the steps of: adhering a metal substrate to the upper surface of a carrier film, cutting the metal substrate into a predetermined shape, and transferring same; forming a circuit pattern by etching the transferred metal substrate with a laser; removing a scrap area of the metal substrate other than the circuit pattern; modifying surface roughness of the upper surface of the circuit pattern; laminating a first cover layer on the upper surface of the circuit pattern; removing a carrier film adhered to the lower surface of the circuit pattern; modifying the surface roughness of the lower surface of the circuit pattern; and laminating a second cover layer on the lower surface of the circuit pattern.

The invention belongs to the technical field of converters, and relates to a magnetic integrated converter for fixed switching frequency resonant conversion, which comprises a magnetic core and a PCB (printed circuit board), the magnetic core is a UI-type magnetic core, and the PCB is a multilayer board; the secondary winding layer is located between the core columns of the magnetic core, the GND layer is arranged outside the core columns of the magnetic core in a sleeving mode, and the core columns of the magnetic core are sleeved with the core column via holes of the primary winding layer respectively; the secondary winding layer is provided with an output capacitor and a synchronous rectification transistor, and the primary winding layer is provided with an input capacitor, a primary transistor and a resonant capacitor; the secondary winding layer is electrically connected to the GND layer, so that the secondary side of the transformer forms a loop; the primary winding layers are connected in series; through the magnetic integrated converter with higher integration level, the area of the converter is remarkably reduced, so that the power density of the converter is improved.

To provide a metal-clad laminate or the like which can reduce variation in the amount of warpage of a semiconductor package and has a small variation in the rate of dimensional change. The metal-clad laminate is a metal-clad laminate including a metal foil and a cured product of one or more plies of a prepreg, in which an average thickness measured according to the following method using a laser displacement meter is 400 µm or more, and a value calculated from the following formula (1) is 0.70% or less: (average value of standard deviation of thickness obtained by the following method) × 100 / (average thickness of metal-clad laminate) (Method for measuring thickness of metal-clad laminate) The thickness is measured by cutting out four measurement substrates each having a size of 60 mm (vertical) × 60 mm (horizontal) in a plane direction from an arbitrary portion of the metal-clad laminate. Measurements are carried out at intervals of 1 mm on two diagonal lines, with the starting point and the ending point of the measurement not located at the ends of the metal-clad laminate. For each of the four measurement substrates, a standard deviation is obtained from the measured thicknesses at all the points, and then an average value of the standard deviations of the thicknesses of each of the four measurement substrates is obtained. Further, the average thickness of all the points measured for the four measurement substrates is calculated, and this is taken as the average thickness of the metal-clad laminate. Details are as described in the description herein.

The printed wiring board disclosed in the present invention comprises: a substrate layer having insulating properties; a first conductive layer directly or indirectly laminated on the surface of the substrate layer and comprising copper foil; a second conductive layer directly or indirectly laminated on the back surface of the substrate layer and comprising copper foil; and a through-hole laminated on the inner periphery and bottom of a connection hole penetrating the first conductive layer and the substrate layer in the thickness direction and electrically connecting the first conductive layer and the second conductive layer, the through-hole laminate comprising an electroless copper plating layer laminated on the inner periphery and bottom of the connection hole and an electrolytic copper plating layer laminated on the surface of the electroless copper plating layer, the copper foil containing copper grains oriented along the (100) plane direction, the average grain size of the copper in the copper foil being 10 μm or more, the electroless copper plating layer containing palladium, and the amount of palladium laminated per unit area of ​​the copper foil surface being 0.03 μg / cm 2 Above and 0.15 μg / cm 2 the following.

The invention discloses a flexible copper-clad plate with high thermal conductivity and low dielectric property and a preparation method of the flexible copper-clad plate. The flexible copper-clad plate comprises an insulating substrate, the composite film is a thermoplastic polyimide / heat-conducting low-dielectric ePTFE / thermoplastic polyimide insulating composite film which is composed of a middle layer ceramic / boron nitride-expanded polytetrafluoroethylene functional hybrid membrane and thermoplastic polyimide layers on the two sides of the middle layer ceramic / boron nitride-expanded polytetrafluoroethylene functional hybrid membrane. And the flexible conductive metal foil is compounded with the single surface, double surfaces or multiple layers of the insulating substrate through a thermal forming compounding process. Through the mode, the flexible copper-clad plate can have excellent peel strength under the adhesive-free condition through structure optimization and process innovation, low dielectric constant and low dielectric loss tangent value can be realized under the high-frequency condition, and meanwhile, the heat conductivity coefficient is remarkably improved. And through continuous production, the efficiency is greatly improved, and a high-reliability base material is provided for the high-end electronic fields such as new energy vehicles, 5G / 6G communication and wearable equipment.

Provided are a copper-clad laminate including an insulating layer containing a resin and a copper foil arranged on at least one surface of the insulating layer, wherein the copper foil is a surface-treated copper foil having a metal-treated layer containing zinc, and a content of zinc in the metal-treated layer is 10 to 2,500 μg / dm2; a method for producing the copper-clad laminate; and a printed wiring board and a semiconductor package using the copper-clad laminate.

[Problem] To provide: a copper-clad layered body which, when applied to a flexible circuit board, is capable of suppressing transmission loss and achieving good volume resistivity and high adhesion between a low-dielectric resin film and a copper plate layer; and a method for producing the same. [Solution] This copper-clad layered body is characterized by: comprising a low-dielectric resin film having a relative permittivity of 3.5 or less and a dielectric loss tangent of 0.008 or less at a frequency of 10 GHz, and an electroless copper plating layer laminated on at least one surface of the low-dielectric resin film; the weighted average size of crystallites in the electroless copper plating layer being 25 to 300 nm; and the adhesion strength between the resin film and the electroless copper plating layer being 4.2 N / cm or more.

The present invention relates to an electrolytic copper foil having a preferred orientation of a (200) crystal plane, a method for manufacturing the same, and an application thereof, in which the electrolytic copper foil before heat treatment has a crystal grain orientation ratio of 20% or less in the (200) crystal plane as measured by XRD analysis, and a crystal grain orientation ratio of less than 20% in a {001} crystal plane family as measured by EBSD analysis; the electrolytic copper foil after heat treatment has a crystal grain orientation ratio in the (200) crystal plane of 50% or more as measured by XRD analysis and a crystal grain orientation ratio in the {001} family of crystal planes of 20% or more as measured by EBSD analysis. And the heat treatment is heating at 200 DEG C for two hours. The electrolytic copper foil subjected to heat treatment has a microstructure similar to that of a rolled and annealed copper foil and shows excellent mechanical properties.