869results about "Circuit precursor manufacture" patented technology

The invention discloses a curved circuit three-dimensional printing-oriented base material surface modification and adhesive force enhancement method, which comprises the following steps of: performing surface modification on the surface of an insulating curved surface base material, and integrally plating copper after modification, so that a layer of uniform conductive copper film is formed on the surface of the base material; anti-etching mask ink is selectively jet-printed on the base material, curing is carried out after jet printing is completed until the anti-etching mask ink is completely dried, and an anti-etching film with a conductive pattern is formed on the surface of the insulation curved surface base material; then, the conductive copper film is soaked in etching liquid for selective etching, and the conductive copper film which is not covered with the anti-etching film is gradually dissolved until the original insulating curved surface base material is exposed; and then soaking in an alkaline solution until the anti-etching film with the conductive pattern is completely dissolved and falls off to obtain the insulating curved-surface base material with a clean surface and a complete conductive pattern. According to the method disclosed by the invention, the adhesive force between the conductive material and the insulating curved surface base material is greatly enhanced, and high-precision and high-reliability preparation of the curved surface circuit is realized.

The invention discloses a high-precision etching device for manufacturing a copper-clad plate and an etching method, and relates to the technical field of copper-clad plate etching, the high-precision etching device comprises a box body, the outer wall of the top of the box body is fixedly connected with a liquid inlet pipe used for conveying etching liquid, and a spraying assembly used for etching a copper-clad plate body is arranged in the box body; the spraying assembly comprises a corrugated pipe fixedly connected to the end, located in the box body, of the liquid inlet pipe, one end of the corrugated pipe is fixedly connected with a first liquid guide pipe, the two ends of the first liquid guide pipe are fixedly connected with second liquid guide pipes, and the two ends of each second liquid guide pipe are connected with spraying pipes in an inserted mode. In the etching process of the copper-clad plate, the copper-clad plate can be kept stable even if being impacted by etching liquid, the side clamp only acts on the side face of the copper-clad plate body, the front face and the back face of the copper-clad plate body cannot be shielded, etching dead angles are effectively avoided, the etching precision is further improved, and meanwhile the side face clamping can prevent the side etching phenomenon.

The invention discloses a copper-clad plate as well as a middle layer and a preparation method and application thereof, and belongs to the technical field of copper-clad plates. The preparation method of the intermediate layer for the copper-clad plate comprises the following steps: orthogonally weaving PBO fibers and glass fibers to obtain blend fibers; the mass ratio of the PBO fibers to the glass fibers is (10: 90)-(60: 40); carrying out modification treatment on the blend fibers to obtain modified blend fibers; dipping the modified blend fiber in a resin-containing dipping solution; and drying the impregnated modified blend fiber. The preparation method is simple and easy to operate, the PBO fibers and the glass fibers are orthogonally woven according to a specific ratio, so that on one hand, the blend fibers have the advantages of the PBO fibers and the glass fibers, on the other hand, the anisotropy of the blend fibers is effectively optimized, and the obtained copper-clad plate has relatively low dielectric loss and expansion coefficient; the peeling strength, the heat resistance and the flexibility are better.

A copper-ceramic bonded body (10, 110) in which a copper member (12, 13, 112, 113) comprising copper or a copper alloy is bonded to a ceramic member (11, 111), in which an active metal compound layer (31) or a magnesium oxide layer (131) is formed in a region on the copper member side of the ceramic member (11, 111). The active metal compound layer (31) contains a compound of one or more active metals selected from the group consisting of Ti, Zr, Nb and Hf, and transition metal layers (34, 134) containing one or more transition metals selected from the group consisting of V, Cr, Mn, Fe, Co, Ni, Mo, Ta and W are formed at the interface of the active metal compound layer (31) or the magnesium oxide layer (131) on the copper member side.

The invention relates to the field of copper-clad plates, and discloses a low-dielectric-constant high-performance copper-clad plate and a preparation method thereof.The preparation method comprises the specific steps that epoxy resin, phenolic resin, polyphenyl ether modified resin, modified nano silicon dioxide and the like are taken and mixed to obtain a resin glue solution; impregnating glass fabric in the resin glue solution to obtain a prepreg; laminating prepregs, and covering copper foil for hot pressing; the polyphenyl ether modified resin comprises epoxy resin, diallyl cyanate and fluorine-containing polyphenyl ether resin prepared by reaction of polyphenyl ether, bisphenol AF and benzoyl peroxide; the modified nano silicon dioxide is prepared by reacting allyl glycidyl ether, vinyltriethoxysilane and phenyltris (dimethylsiloxane) silane, then grafting with a phosphorus-containing intermediate to prepare a modified additive, and grafting with nano silicon dioxide, and the phosphorus-containing intermediate is prepared by reacting phenylphosphoryl dichloride and eugenol. The copper-clad plate with high flame retardance, high peel strength, heat resistance and low dielectric constant is prepared.

An integrated machine for automatic cutting, polishing, stacking, and unloading of substrates, including a laser cutting machine, a mechanical laser arm, a polishing machine, a polishing device, a first finished product placement rack, a second finished product placement rack, and an automatic stacking device. The mechanical laser arm is fixed on the frame of the laser cutting machine, the polishing device is fixed on the polishing machine, and the first finished product placement rack and the second finished product placement rack are arranged on both sides of the automatic stacking device. The present disclosure can achieve cutting the substrates of any size, and can automatically polish the edges of the cut substrates. The present disclosure has the characteristics of automation, integration, and multi-functionality, effectively reducing the number of supporting equipment and occupying space.

The present invention relates to a process for preparing multi-material laminates for printed circuit boards that envisages the formation of a stack of plastic laminates, indicated below as "packages", separated by plates of electrically insulating material, and the heating of the stack in the presence of at least two temperature detectors that allow the uniformity of the temperature to be obtained along the whole stack, and a system for producing said laminates.

Present embodiment relates to a method for manufacturing a circuit board, and more specifically, to a technique for solving problems that may arise due to etching by injecting epoxy or silicon or inserting a metal block into a gap formed between two or more ceramic substrates.

The invention discloses an automatic laminating device for a copper-clad plate. The automatic laminating device comprises a bottom frame, a conveying main body, a protective cover, a top cover, a glue spraying head, a connecting pipe, a rectangular groove, an assembling mechanism and a pressing mechanism, the assembling mechanism and the pressing mechanism are optimally arranged, four strip frames of the assembling mechanism are used for stacking the aluminum substrates, copper plates and the aluminum substrates are limited through a first positioning structure and a second positioning structure during laminating processing, and one aluminum substrate falls off at a time under the action of a first discharging structure and a second discharging structure, so that the production efficiency is improved, and the production efficiency is improved. The aluminum substrate is pressed on the copper plate through the pressing mechanism so that the aluminum substrate can fall on the copper plate, the attaching regularity of the copper plate and the aluminum substrate can be guaranteed, then the moving and pressing structure of the pressing mechanism rotates and moves downwards to make contact with the upper portion of the aluminum substrate, the aluminum substrate is pressed on the copper plate from right to left through the moving and pressing structure, air between the aluminum substrate and the copper plate is exhausted, and the attaching efficiency is improved.

The invention relates to the field of copper-clad plates, and discloses a high-performance flame-retardant low-dielectric-loss copper-clad plate and a preparation method thereof.The copper-clad plate comprises epoxy resin, benzoxazine resin, composite filler, carboxyl-terminated nitrile rubber, an active diluent, a curing agent and the like; the composite filler is prepared by compounding flame-retardant modifier grafted graphene oxide and epoxy silane modified silicon dioxide hollow spheres; according to the flame-retardant modifier, boric acid and pentaerythritol are used for preparing a double-terminal hydroxyl boron-containing intermediate, then dichlorodiphenyl silane and phenylphosphonic dichloride react with hydroxyl groups at the two ends of the intermediate to prepare a flame-retardant intermediate, and amino silane and vanillic aldehyde react with chlorine atoms at the two ends of the intermediate to prepare an aldehyde modified flame-retardant intermediate; the copper-clad plate prepared by the preparation method disclosed by the invention is low in dielectric constant and dielectric loss, high in heat conductivity coefficient and good in flexibility, and also has excellent heat resistance and flame retardance.

The present invention relates to a copper-clad plate with plated-through holes, a circuit board with plated-through holes, and manufacturing methods therefor. Specifically, a method for manufacturing a copper-clad plate with plated-through holes comprises the following steps: drilling an insulating substrate; performing a pre-treatment on the substrate with holes; simultaneously treating the surface and hole walls of the substrate by means of a combination of a plurality of physical vapor deposition methods, so as to form conductive seed layers on the surface and hole walls of the substrate, thereby obtaining a metallized substrate with plated-through holes; and performing electroplating thickening on the metallized substrate, so as to obtain a copper-clad plate with plated-through holes.

A ceramic circuit board includes a ceramic substrate and a metal plate bonded together via a bonding layer, wherein when the ceramic circuit board is observed through a cross-section defined by a thickness direction and lateral direction of the ceramic circuit board: a side surface of the metal plate has an inclined shape; and the bonding layer has a bonding-layer protruding portion which protrudes by 20 μm or more and 150 μm or less from an edge where the bonding layer is in contact with the side surface of the metal plate. The shape and Vickers hardness of the side surface of the metal plate are controlled. The ceramic substrate is preferably a silicon nitride substrate.

The present disclosure provides a package device including a redistribution layer. The redistribution layer includes a first dielectric layer, a conductive layer, and a second dielectric layer, and the conductive layer is disposed between the first dielectric layer and the second dielectric layer, wherein the redistribution layer has a test mark, the test mark includes a conductive pattern formed of the conductive layer, the conductive pattern includes a center portion and a plurality of extension portions, and the plurality of extension portions are respectively connected to the center portion.

The invention belongs to the technical field of electrolytic copper foils, and relates to an additive for an ultralow-profile electrolytic copper foil, an electrolyte, a preparation process of the electrolytic copper foil, the electrolytic copper foil and application of the electrolytic copper foil. The additive comprises a brightening agent, a wetting agent and a leveling agent; the brightening agent is hexylbenzylamine salt, sodium dithiodipropane sulfonate and sodium N, N-dimethyl dithioformamide propane sulfonate; the wetting agent is hydroxyethyl cellulose and polyethylene glycol; and the leveling agent is hydrolyzed collagen. When the electrolyte containing the additive is used for preparing the copper foil, grain refinement of the raw foil and leveling of the outline are realized, and a foundation is laid for realizing the ultralow-outline electrolytic copper foil. And the design of the front section, the middle section and the rear section of the anode plate is combined, an original two-step method is replaced for producing the electrolytic copper foil, equipment is simplified, the production technological process is shortened, and the production cost of the ultra-low-profile electrolytic copper foil is greatly reduced.

A ceramic copper circuit board according to an embodiment includes a ceramic substrate and a first copper part. The first copper part is bonded at a first surface of the ceramic substrate via a first brazing material part. The thickness of the first copper part is 0.6 mm or more. The side surface of the first copper part includes a first sloped portion. The width of the first sloped portion is not more than 0.5 times the thickness of the first copper part. The first brazing material part includes a first jutting portion jutting from the end portion of the first sloped portion. The length of the first jutting portion is not less than 0 μm and not more than 200 μm. The contact angle between the first jutting portion and the first sloped portion is 65° or less.

The invention relates to the technical field of electronic manufacturing, and discloses a circuit board printing manufacturing device which comprises a conveying belt, one end of the conveying belt is provided with a board placing device used for storing solder resist ink needing to be coated, one side of the board placing device is provided with two brushing devices, and the two brushing devices are arranged on the conveying belt. A fixing plate is arranged between the two brushing devices, the fixing plate is fixedly mounted on a fixing mounting plate of the conveying belt, a square rod is arranged between the fixing plate, one end of the square rod is rotationally connected with a gear, the other side of the gear is fixedly connected with a sliding square block, the other end of the sliding square block is slidably connected with a clamping block, and the clamping block is fixedly connected with the clamping block. One side of the clamping block communicates with an air pipe used for adsorbing a copper-clad plate, the square rod is sleeved with a torsional spring, and one end of the torsional spring is fixedly connected with the square rod. The circuit board printing and manufacturing device can fix the position of the copper-clad plate after the copper-clad plate is turned over.

Provided are: a laminate which does not undergo roughening of the surface of a support body, is simple and inexpensive, and has stable quality, such as no damage caused by contact with a coating device or a transfer roller during coating of a plating base layer; and a rigid printed wiring board, a flexible printed wiring board, and a molded article using the same. A seed layer serving as a plating base is formed, and the adhesion between a support and a metal layer (metal plating layer) is excellent. A transfer laminate is produced by forming a plating base layer containing a dispersant and a conductive substance on a temporary support, forming a resin layer thereon, and then reacting functional groups of the plating base layer and the resin layer with each other. Furthermore, the present invention has been accomplished by simply and inexpensively forming a plating underlayer on the surface of a support with high quality by adhering the transfer laminate to both the front surface and the back surface of the support, or only adhering the transfer laminate to one surface of the support, and peeling off only the temporary support of the transfer laminate.

The invention discloses a circuit board preparation method. The circuit board preparation method comprises the following steps: respectively processing through holes in positions, corresponding to copper bosses or embedded parts, in a copper-clad core plate and a prepreg; laminating and hot-pressing the copper-clad core plate, the prepreg and the metal radiating plate or the embedded part provided with the copper boss, wherein one part of the prepreg is hot-pressed to form a bonding part for connecting the side wall of the copper boss or the embedded part with the copper-clad core plate; grinding the plate to reduce the concave depth of the bonding part relative to the plate surface; plating copper on the whole board to manufacture a surface copper foil layer on the surface of the circuit board; grinding the plate so as to further improve the surface flatness of the surface copper foil layer; wherein the copper-clad core plate located on the outermost side during laminated plate hot pressing comprises an outer-layer copper foil and an inner-layer copper foil, and the thickness of the outer-layer copper foil is smaller than that of the inner-layer copper foil, so that the initial concave depth of the bonding part is reduced. According to the preparation method, the surface flatness of the copper foil layer on the surface of the circuit board can be improved, and the product yield is improved.

The invention relates to the technical field of preparation of copper-clad plates, and discloses a preparation method of a phosphorus-containing flame-retardant halogen-free copper-clad plate, which comprises the following steps: uniformly stirring and mixing bisphenol A type epoxy resin, linear phenolic resin, phosphorus-containing tetraglycidyl ester and the like, smearing the mixture on E-glass fabric, baking to obtain prepregs, overlapping eight prepregs, coating copper foils on the two surfaces, and drying to obtain the phosphorus-containing flame-retardant halogen-free copper-clad plate. According to the preparation method, bisphenol A type epoxy resin is taken as matrix resin, linear phenolic resin is taken as a curing agent, phosphorus-containing tetraglycidyl ester is added, flame-retardant elements and a heat-resistant structure contained in the phosphorus-containing tetraglycidyl ester are utilized, the flame-retardant halogen-free copper-clad plate is obtained, and the flame-retardant halogen-free copper-clad plate is obtained. The flame retardant property, the heat resistance and the mechanical property of the copper-clad plate material are improved.

Disclosed is a copper foil to which a carrier foil is attached, which has favorable peel strength under high-temperature pressing conditions, the copper foil to which the carrier foil is attached comprising: a carrier foil; a release layer on the carrier foil; a heat-resistant layer on the release layer; and an ultra-thin copper foil on the heat-resistant layer, in which a buffer layer of a nickel alloy is interposed between the release layer and the heat-resistant layer.

The invention discloses a press-fit preparation method of a high-thermal-conductivity circuit board and the high-thermal-conductivity circuit board, and the preparation method comprises the steps: carrying out the dispersion and solidification of a liquid metal gallium-indium alloy and fiber mixture in an inert argon atmosphere, and fusing with a substrate, and obtaining a self-adaptive heat-conduction substrate; carrying out gradient deposition and etching treatment on the self-adaptive heat conduction base material to obtain a gradient spacing template; carrying out electrospinning infiltration and heat treatment on the gradient spacing template to obtain a base material containing a dynamic heat-conducting network; conducting layer pre-pressing treatment is conducted on the base material containing the dynamic heat conduction network, and a pre-assembled plate is obtained; performing staged dynamic pressing treatment on the pre-assembled board to obtain a molded circuit board; and performing surface spraying and deposition treatment on the molded circuit board to obtain the high-thermal-conductivity circuit board. The problems of poor heat flow path, poor interface bonding performance and the like in the prior art are solved, the heat management effect is remarkably improved, and the reliability and performance of an electronic product are remarkably improved.

The present application discloses a method for laminating and preparing a high thermal conductivity circuit board and a high thermal conductivity circuit board. The preparation method comprises: dispersing and curing a liquid metal gallium-indium alloy and a fiber mixture in an inert argon atmosphere, and fusing the mixture with a matrix to obtain an adaptive thermal conductive substrate; performing gradient deposition and etching on the adaptive thermal conductive substrate to obtain a gradient spacing template; performing electrospinning infiltration and heat treatment on the gradient spacing template to obtain a substrate containing a dynamic thermal conductive network; performing a conductive layer pre-pressing treatment on the substrate containing the dynamic thermal conductive network to obtain a pre-assembled plate; performing a staged dynamic lamination treatment on the pre-assembled plate to obtain a molded circuit board; and performing surface spraying and deposition treatment on the molded circuit board to obtain the high thermal conductivity circuit board. The present application solves the problems of poor heat flow path and poor interface bonding in the prior art, significantly improving the thermal management effect and significantly improving the reliability and performance of electronic products.

The invention relates to a copper substrate embedding method for separated special-shaped copper blocks and a circuit board, and the method comprises the following steps: processing a plurality of special-shaped copper blocks with preset shapes on a copper plate, and reserving a plurality of connecting ribs which are not completely cut off between the adjacent special-shaped copper blocks; a gap between every two adjacent special-shaped copper blocks is filled with resin; a heat-conducting insulating layer and a copper foil are sequentially overlaid on the two opposite faces of the copper plate to form a stacked structure, and a substrate is formed through high-temperature pressing; an isolation groove is formed in the position, corresponding to the connecting rib, of the substrate, and the isolation groove cuts off the connecting rib; the isolation groove is filled with resin, and the resin overflowing out of the plate surface is rubbed down; and conducting treatment: forming a continuous conductive copper layer on the surface of the resin filling area. According to the invention, no copper groove needs to be buried, the copper block can be processed into a specific shape, and the distance between two adjacent special-shaped copper blocks is controlled to be 1.0 mm, so that the number and the area of the copper blocks buried in the substrate are greatly increased, and the heat dissipation performance and the electrical performance of the circuit board are improved.

The invention discloses a high-speed copper-clad plate and a copper-clad plate packaging system, and relates to the technical field of copper-clad plate production and processing.The high-speed copper-clad plate comprises a copper-clad plate, the copper-clad plate comprises two copper foil layers, and glass fiber cloth layers are fixedly connected to the side faces, close to each other, of the two copper foil layers; metal substrates are fixedly connected to the side faces, close to each other, of the two glass fiber cloth layers, a core plate is jointly and fixedly connected to the side faces, close to each other, of the two metal substrates, and a packaging mechanism is arranged on the bottom face of the copper-clad plate. And meanwhile, one or more clamped copper-clad plates can be moved to a feeding mechanism of the packaging machine through self movement, so that the one or more copper-clad plates are packaged and fed, the damage to the copper-clad plates can be reduced to the maximum extent due to the fact that the clamping force and mode can be accurately controlled, and the product quality is guaranteed.

The invention relates to the technical field of circuit board manufacturing, and provides a circuit board manufacturing method and a circuit board, and the method comprises the steps: providing a circuit board which comprises a dense hole region and a dense wiring region, and carrying out the thin plating of the dense hole region and the dense wiring region; covering the circuit board with a protective film, wherein the protective film is provided with a first window at a position corresponding to the dense hole area; carrying out selective plating on the dense hole area through the first window; removing the protective film; and resin hole plugging is conducted on the dense hole area, and hole plugging grinding is conducted. According to the circuit board manufacturing method, thin plating and selective plating are carried out firstly, so that the surface copper thickness of the dense hole area is larger than that of the dense wiring area, a certain height difference is formed, only a resin grinding procedure is needed, multiple copper reduction procedures are not needed, the procedures are simplified, and meanwhile the copper thickness range of the outer-layer circuit is reduced. And moreover, when the resin is ground, the dense wiring area is not ground preferentially or excessively, so that the copper thickness uniformity in the grinding process of the outer-layer circuit is ensured, and the problems of incomplete circuit etching and short circuit in the POFV process are solved.

The invention provides a manufacturing method of a high-precision electroplated ceramic substrate and the ceramic substrate, belongs to the technical field of circuit board manufacturing, and solves the problem that a ceramic substrate base body is fragile and easy to damage in the production and manufacturing process. The method comprises the following steps: providing a ceramic substrate; pretreating the ceramic substrate to obtain a substrate with a conductive layer; carrying out pattern electroplating treatment on the substrate with the conductive layer to obtain a substrate subjected to pattern electroplating; processing the substrate after pattern electroplating to obtain a substrate with a circuit; and performing laser forming treatment on the substrate with the circuit to obtain the high-precision electroplated ceramic substrate. According to the scheme, by improving the manufacturing process of the ceramic substrate, the production efficiency and the product quality of the ceramic substrate are improved.

The present invention relates to the field of copper clad laminates, and discloses a copper clad laminate with low dielectric constant and high performance and a preparation method thereof. The specific steps are as follows: taking epoxy resin, phenolic resin, polyphenylene ether modified resin, modified nano-silica, etc. and mixing them to obtain a resin glue solution; impregnating glass fiber cloth in the resin glue solution to obtain a prepreg; taking the prepregs and laminating them and hot pressing them with copper foil; the polyphenylene ether modified resin includes epoxy resin, diallyl cyanate, and a fluorinated polyphenylene ether resin prepared by reacting polyphenylene ether, bisphenol AF, and benzoyl peroxide; the modified nano-silica is prepared by reacting allyl glycidyl ether and vinyltriethoxysilane with phenyltris(dimethylsilyl)silane, and then grafting it with a phosphorus-containing intermediate to form a modified additive, and grafting the modified additive with nano-silica. The phosphorus-containing intermediate is prepared by reacting phenylphosphoryl dichloride and eugenol. A copper clad laminate with high flame retardancy, high peel strength, and heat-resistant low dielectric constant is prepared.

Provided are: a fluororesin sheet having both a low linear expansion coefficient (CTE) and improved adhesion to a copper foil having a smooth surface; and a copper-clad laminate using the fluororesin sheet. A fluororesin sheet containing a fluororesin and silica particles, the fluororesin sheet having an oxygen element ratio of 3.0 at% or more and a linear expansion coefficient (CTE) of 100 ppm / DEG C or less when measured by X-ray photoelectron spectroscopy (XPS) on one or both surfaces thereof.

The invention relates to the technical field of copper-clad plate processing, in particular to a processing technology for a copper-clad plate, which comprises the following steps: S1, preparing semi-finished sizing paper; s2, pressing the copper-clad plate; s3, embrittlement glue coating is carried out; s4, stacking the copper-clad plates; s5, uniformly cutting and drilling the stacked copper-clad plates; s6, performing low-temperature embrittlement separation and vibration separation; and S7, when preparation of a single batch of copper-clad plates is completed, the copper-clad plates are selected for detection, side edge profile curves of the copper-clad plates for detection are obtained, and whether the copper-clad plates are qualified or not is determined based on profile coincidence parameters, determined by the side edge profile curves, of the single copper-clad plates. According to the method, the copper-clad plate is selected to be detected, the parameters of the copper-clad plate are obtained, the parameters comprise the side edge profile curve and the profile difference parameter, the copper-clad plate is judged according to the obtained parameters, when it is determined that the copper-clad plate is unqualified, the machining process of the copper-clad plate is controlled and adjusted in real time according to the specific conditions of the copper-clad plate, and the production efficiency of the copper-clad plate is improved.