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Resin composition and use thereof

A technology of resin composition and mixture, applied in other household appliances, synthetic resin layered products, applications, etc., can solve the problem of increasing the water absorption rate of the substrate, reducing the heat resistance and interlayer adhesion of the board, and the deterioration of the dielectric properties. and other problems, to achieve the effect of high crosslinking density, high interlayer adhesion, and improved reliability.

Active Publication Date: 2013-03-27
GUANGDONG SHENGYI SCI TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Although the overall performance of the board is excellent, polybutadiene or butadiene and styrene copolymers reduce the heat resistance and interlayer adhesion of the board
Moreover, there are polar groups on the molecular chain, which leads to the increase of water absorption and the deterioration of dielectric properties of the substrate.

Method used

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  • Resin composition and use thereof
  • Resin composition and use thereof
  • Resin composition and use thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0089] Dissolve 90 parts by weight of modified polyphenylene ether resin powder MX9000, 10 parts by weight of organosilicon compound WD-V4 containing unsaturated double bonds, and 1.0 parts by weight of free radical initiator dicumyl peroxide (DCP). In toluene solvent, and adjust to a suitable viscosity. Use 2116 glass fiber cloth to impregnate the resin glue solution, pass the nip shaft to control the suitable single weight, and dry it in an oven to remove the toluene solvent to obtain 2116 prepreg. Overlap 4 sheets of 2116 prepreg, with copper foil of 1OZ thickness on the upper and lower sides, vacuum lamination and curing in a press for 90min, curing pressure 50kg / cm 2 , the curing temperature is 200°C, and a high-frequency circuit substrate is prepared. The physical properties are shown in Table 2.

Embodiment 2

[0091] 80 parts by weight of modified polyphenylene ether resin powder MX9000, 20 parts by weight of organosilicon compound WD-V4 containing unsaturated double bonds, 3.0 parts by weight of free radical initiator DCP, 60 parts by weight of fused silica 525 , 30 parts by weight of flame retardant BT-93W mixed, dissolved in toluene solvent, and adjusted to a suitable viscosity. The emulsifier is used for emulsification, so that the powder filler and the flame retardant are evenly dispersed in the mixed liquid, and the resin glue is prepared. Use 2116 glass fiber cloth to impregnate the resin glue solution, pass the nip shaft to control the suitable single weight, and dry it in an oven to remove the toluene solvent to obtain 2116 prepreg. Overlap 4 sheets of 2116 prepreg, with copper foil of 1OZ thickness on the upper and lower sides, vacuum lamination and curing in a press for 90min, curing pressure 50kg / cm 2 , the curing temperature is 200°C, and a high-frequency circuit subst...

Embodiment 3

[0093] 60 parts by weight of modified polyphenylene ether resin powder MX9000, 40 parts by weight of organosilicon compound WD-V4 containing unsaturated double bonds, 1.0 parts by weight of free radical initiator dicumyl peroxide (DCP), 2.0 The free radical initiator benzoyl peroxide (BPO) in parts by weight, the spherical silica SJS-0020 of 170 parts by weight, and the flame retardant Exolit OP935 in 15 parts by weight are mixed, dissolved in toluene solvent, and adjusted to a suitable viscosity . The emulsifier is used for emulsification, so that the powder filler and flame retardant are evenly dispersed in the mixed liquid to prepare the resin glue. Use 2116 glass fiber cloth to impregnate the resin glue solution, pass the nip shaft to control the suitable single weight, and dry it in an oven to remove the toluene solvent to obtain 2116 prepreg. Overlap 4 sheets of 2116 prepreg, with copper foil of 1OZ thickness on the upper and lower sides, vacuum lamination and curing in...

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Abstract

The invention discloses a resin composition and a use thereof. The resin composition comprises modified polyphenyl ether and organic silicon compound containing an unsaturated double bond. The invention further discloses a manufacturing method for a high frequency circuit base plate by the resin composition and a high frequency circuit base plate manufactured by the manufacturing method. The high frequency circuit base plate has a high glass transition temperature, a high thermal decomposition temperature, high interlayer bonding force, a low dielectric constant and tangent low-medium loss, and is very suitable for being used as a circuit base plate of a high frequency electronic device.

Description

technical field [0001] The present invention relates to a resin composition, in particular, the present invention relates to a resin composition and its application in high-frequency circuit substrates. Background technique [0002] In recent years, with the development of electronic information technology, the miniaturization and high density of electronic equipment installation, the large capacity and high frequency of information, the heat resistance, water absorption, chemical resistance, mechanical properties, Dimensional stability, dielectric properties and other comprehensive properties put forward higher requirements. [0003] In terms of dielectric properties, in high-frequency circuits, the transmission rate of the signal is related to the dielectric constant D of the insulating material k The relationship is: insulating material dielectric constant D k The lower the value, the faster the signal transmission rate. Therefore, in order to realize high-speed signal...

Claims

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Application Information

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IPC IPC(8): C08L71/12C08L83/07C08K5/5425C08K5/549C08J5/24B32B27/04B32B15/08H05K1/03H05K3/00
CPCC08K5/5425H05K1/03B32B15/08H05K3/00B32B27/04C08L71/12C08J5/24C08K5/549C08G77/20C08L83/04B32B15/14B32B2260/021B32B2260/046B32B2262/101B32B2305/076H05K1/0373H05K3/022H05K2201/012H05K2201/0209C08L71/126H05K1/0366C08G65/485C08K5/3417C08K5/53C08J5/244C08J5/249B32B15/20B32B2307/204B32B2307/3065B32B2457/08C08L71/00
Inventor 陈广兵曾宪平
Owner GUANGDONG SHENGYI SCI TECH
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