Preparation method of PTFE (Polytetrafluoroethylene) copper clad laminate

A technology of PTFE and copper-clad laminates, which is applied in the field of preparation of PTFE copper-clad laminates, can solve the problems of affecting the performance and uniformity of the board, poor mechanical properties, and fluororesin cannot fill the gaps of glass cloth, etc., to achieve improved heat resistance and low dielectric loss , Improve the effect of dimensional stability

Inactive Publication Date: 2019-07-23
CHINA ELECTRONICS TECH GRP NO 46 RES INST
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] Chinese Patent Application Publication No. CN106494036A proposes a method of directly laminating PTFE film and glass cloth to make PTFE copper-clad laminates, but this method c

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0025] Step (1): In parts by weight, ceramic powder TiO with a particle size of 5 μm 2 (Titanium dioxide) 65 parts, 0.5 parts of silane coupling agent, 30 parts of deionized water, 233 parts of PTFE emulsion with a solid content of 15%, mix well to form PTFE glue. The PTFE emulsion is a dispersed concentrate in the presence of a non-ionic surfactant after tetrafluoroethylene is polymerized. When the temperature of the PTFE emulsion is 20°C, the viscosity is 25mPa·s.

[0026] Step (2): Soak glass fiber cloth with a thickness of 0.1mm in PTFE glue at a uniform speed, and dry it at 250°C for 15 minutes. In this step, the glass fiber cloth is dipped and dried twice to obtain Pretreated cloth with 60% glue content.

[0027] Step (3): Lay the obtained pretreated cloth and PTFE resin film alternately and symmetrically into a green substrate with a specified thickness, cover both sides of the green substrate with copper foil and then sinter. The outermost layer in contact with the co...

Embodiment 2

[0030] Step (1): In parts by weight, ceramic powder SiO with a particle size of 15 μm 2 (Silicon dioxide) 55 parts, 0.8 parts of silane coupling agent, 40 parts of deionized water, 300 parts of PTFE emulsion with a solid content of 15%, mix well to form PTFE glue. The PTFE emulsion is a dispersed concentrate in the presence of a non-ionic surfactant after tetrafluoroethylene is polymerized. When the temperature of the PTFE emulsion is 20°C, the viscosity is 25mPa·s.

[0031] Step (2): Soak glass fiber cloth with a thickness of 0.1mm in PTFE glue at a uniform speed, and dry it at 250°C for 15 minutes. In this step, the glass fiber cloth is dipped and dried twice to obtain Pretreated cloth with 60% glue content.

[0032] Step (3): Lay the obtained pretreated cloth and PTFE resin film alternately and symmetrically into a green substrate with a specified thickness, cover both sides of the green substrate with copper foil and then sinter. The outermost layer in contact with the co...

Embodiment 3

[0035] Step (1): In parts by weight, ceramic powder SiO with a particle size of 20 μm 2 (Silicon dioxide) 50 parts, 0.8 parts of silane coupling agent, 40 parts of deionized water, 78 parts of PTFE emulsion with a solid content of 45%, mix well to form PTFE glue. The PTFE emulsion is a dispersed concentrate in the presence of a non-ionic surfactant after tetrafluoroethylene is polymerized. When the temperature of the PTFE emulsion is 20°C, the viscosity is 25mPa·s.

[0036] Step (2): Soak glass fiber cloth with a thickness of 0.1mm in PTFE glue at a uniform speed, and dry it at 220°C for 20 minutes. Pretreated cloth with 70% glue content.

[0037] Step (3): Lay the obtained pretreated cloth and PTFE resin film alternately and symmetrically into a green substrate with a specified thickness, cover both sides of the green substrate with copper foil and then sinter. The outermost layer in contact with the copper foil is PTFE resin film; the thickness of the PTFE resin film is 0....

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Abstract

The invention discloses a preparation method of PTFE (Polytetrafluoroethylene) copper clad laminate. The method comprises the following steps: 1, uniformly mixing raw material components of ceramic powder, silane coupling agents, deionized water and PTFE emulsion to form a PTFE glue solution; 2, soaking glass fiber cloth in the PTFE glue solution at a constant speed, and drying to obtain pretreated cloth; 3, superimposing the obtained pretreated cloth and a fluorine resin membrane into a raw substrate with specified thickness, covering the two sides of the raw substrate with copper foil, thenperforming sintering, maintaining pressure and then cooling to room temperature to prepare the PTFE copper clad laminate. The preparation method disclosed by the invention is simple, easy to operate,good in filler dispersion effect, uniform in mixing and good in product size stability. Through reasonable proportion, the prepared PTFE copper clad laminate has different dielectric constants within2.6-8.6 MHz; the dielectric loss factor is smaller than or equal to 0.003; the peeling strength is greater than or equal to 2.2 kN/m, and the comprehensive property meets use requirements and industrialized mass production requirements.

Description

technical field [0001] The invention relates to the preparation technology of copper-clad laminates, in particular to a preparation method of PTFE copper-clad laminates. It is a high-frequency microwave copper-clad laminate, and the prepared PTFE copper-clad laminate meets the requirements of high-frequency microwave circuit boards. Background technique [0002] Polytetrafluoroethylene (PTFE for short) material has excellent dielectric properties (lower dielectric constant and dielectric loss, etc.), as well as good chemical stability and thermal stability. With the development in the direction of globalization, the market demand for PTFE copper clad laminates is growing rapidly, and it is widely used in manufacturing industries such as communication equipment, computers, automotive electronics, and household appliances. In the high-frequency substrate industry, the dielectric constant, dielectric loss, water absorption and frequency characteristics of PTFE copper clad lami...

Claims

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Application Information

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IPC IPC(8): B32B15/20B32B15/085B32B15/082B32B27/32B32B27/30B32B17/02B32B17/10B32B37/06B32B37/10B32B37/08C08L27/18C08K7/14C08K3/22C08K3/36H05K3/02
CPCB32B15/082B32B15/085B32B15/20B32B17/02B32B17/064B32B27/304B32B27/322B32B37/06B32B37/08B32B37/1018B32B2260/021B32B2260/046B32B2262/101B32B2307/204B32B2307/306B32B2307/734B32B2457/00C08K3/22C08K3/36C08K7/14C08K2003/2241H05K3/022C08L27/18
Inventor 高枢健王丽倩庞子博张伟武聪
Owner CHINA ELECTRONICS TECH GRP NO 46 RES INST
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