12 results about "Pre-preg" patented technology

The objective of the present invention is to obtain a carbon fiber substrate having high levels of both heat resistance and moldability, and to provide a prepreg and a porous structure having high heat resistance by using said carbon fiber substrate. The present invention is a carbon fiber substrate which includes a carbon fiber (A) and a resin composition (B) covering the surface of the carbon fiber (A), wherein the carbon fiber (A) forms a non-woven fabric. The tensile strength of the carbon fiber substrate after heating at 300° C. for 5 minutes is at least 110% of the tensile strength of the carbon fiber substrate before the heating.

The invention relates to a prepreg, a laminate, and a molded article. The purpose of the present invention is to provide: a prepreg for producing a laminate suitable as a structural material, said prepreg having excellent compressive strength and interlayer fracture toughness value, and being capable of being firmly integrated with another structural member by means of welding; this prepreg contains the following constituent elements [A] reinforcing fibers, [B] a thermosetting resin, and [C] a thermoplastic resin, the rubbery elastic modulus of [B] being 10 MPa or more at a temperature obtained by adding 50 DEG C to the glass transition temperature in a state in which the degree of curing is 90% or more, and [C] being present on the surface of the prepreg, reinforcing fibers [A] are present in the resin region [B] and the resin region [C] across a boundary surface between the resin region [B] and the resin region [C].

The present application provides a laminated body having excellent thermal conductivity, lightness and rigidity, and an integrated molded body in which the laminated body is integrated with other components. The integrated molded body of the present application is an integrated molded body in which a structure formed of a thermoplastic resin and a reinforcing fiber is arranged on the outer peripheral portion of a laminated body in which at least a prepreg formed of a continuous carbon fiber and a resin is laminated, and the thermal conductivity λ1A in the fiber direction of the continuous carbon fiber of the first prepreg constituting the outermost layer of the laminated body is 100 [W / (m·K)] or more and 800 [W / (m·K)] or less. It is preferably used for an electronic device housing.

Disclosed are: a resin composition which contains (A) a siloxane-modified maleimide resin that includes a structure derived from a maleimide resin (A1) which has one or more N-substituted maleimide groups and a structure derived from a siloxane compound (A2) which has two or more primary amino groups, (B) a polyphenylene ether-based resin that has a functional group which contains an ethylenically unsaturated bond, and (C) a phosphorus-based flame retardant that has a phosphorus atom content of 12 mass% or more; and a prepreg, a laminate, a resin film, a printed wiring board, and a semiconductor package, each of which uses the resin composition.

A fiber arranging device includes first guides, a first moving mechanism, second guides, a second moving mechanism and a roller. The first guides guide a first feeding of first tapes in a first feeding direction. The first tapes are first fibers or prepregs. The first moving mechanism changes an interval between the first guides, for the first feeding of the first tapes with a first interval. The second guides guide a second feeding of second tapes in a second feeding direction. The second tapes are second fibers or prepregs. The second moving mechanism changes an interval between the second guides, for the second feeding of the second tapes with a second interval. The roller feeds the first tapes and the second tapes in a same feeding direction by disposing the first tapes and the second tapes alternately.

Through-thickness permeable prepregs comprise a fiber bed and a plurality of discrete resin regions on a surface of the fiber bed separated by exposed fiber bed surface regions. Prepreg assemblies for processing such prepregs comprise an air permeable resin barrier material disposed over a surface of the prepreg opposite a forming tool. The air permeable resin barrier material is permeable to air or gas passing from the prepreg and is impermeable to resin passing from the prepreg. During processing, the prepreg assembly is subjected to a vacuum and elevated temperature to cure the resin and form a composite part. During processing, the air permeable resin barrier material prevents unwanted resin bleed from the prepreg, causing resin pressure in the prepreg to be maintained that reduces or eliminates unwanted formation or growth of internal voids to provide a composite part having a reduced degree of internal voids and pores.

The present invention relates to the technical field of composites. In particular, the invention pertains to a prepreg (0) comprising at least one, preferably more than one, fiber (1) and a resin (3) comprising a filler material (4), wherein the filler material (4) comprises or consists of micronized biochar (5).

This prepreg is obtained by impregnating a fiber base material with a thermosetting resin composition, and contains a component (a) specified by the following procedure in an amount of 72 mass% or less. (Procedure) The prepreg is cut into 10 cm squares to prepare a test piece, and then the mass x (g) is measured. Next, the test piece is stirred together with 400 ml of methanol in a 500 ml resin container at 20°C for 20 hours, and is subsequently taken out. Thereafter, the test piece is dried under reduced pressure for 24 hours, and then the mass y (g) is measured. Subsequently, the test piece is fired at 500°C for 4 hours, and then the mass z (g) is measured. The ratio (mass%) of the component a is calculated by formula (1) below.　(1): Component a = {(mass y - mass z) / (mass x - mass z)} × 100

This method for molding an annular frame comprises the following procedures. A plurality of prepregs each formed of reinforcing fibers and a thermoplastic resin are laminated to form an annular or generally annular preform having an opening. In an inner circumferential edge region delimiting the opening of the preform, a restraining process for limiting movement of the laminated prepregs in a direction orthogonal to the lamination direction is performed. In a state in which the restraining process is performed, the preform is shaped by application of heat and pressure.

The in-mold coating compositions comprising a low energy can be applied over a mold release coating applied to a surface of a mold cavity. A prepreg can be applied over the in-mold coating and the in-mold coating and the prepreg simultaneously cured. The in-mold coating compositions and methods provide a finished part having a smooth pinhole-free surface coating.

To provide a resin composition configured to produce a molded body which is excellent in lightness in weight and in which a deterioration in physical properties is suppressed, and a prepreg and a molded body each produced by use of the resin composition. A resin composition comprising hollow particles and a matrix resin, wherein the hollow particles comprise a shell containing a resin and a hollow portion surrounded by the shell; the hollow particles have a void ratio of 50% or more; the hollow particles have a volume average particle diameter of more than 1.0 µm and 20.0 µm or less; and the hollow particles have an epoxy group amount per unit area of 1.0 µmol / m2 or more, which is obtained from an epoxy value and specific surface area of the hollow particles, and wherein the matrix resin comprises a matrix resin containing a functional group which is reactive with an epoxy group.

To provide a resin varnish from which a resin composition excellent in moldability can be obtained even if a drying temperature is increased, and a prepreg, a resin film, a laminate, a printed wiring board and a semiconductor package manufacturing method, each of which is obtained using the resin varnish.SOLUTION: A resin varnish is provided, containing (A) one or more kinds selected from the group consisting of a maleimide resin having one or more N-substituted maleimide groups and a derivative of the maleimide resin, (B) a polyphenylene ether-based resin having a functional group containing an ethylenic unsaturated bond, (C) a styrenic thermoplastic resin having a weight average molecular weight (Mw) of more than 10,000 and less than 100,000, (D) an organic peroxide, and (E) an organic solvent. A prepreg, a resin film, a laminate, a printed wiring board and a semiconductor package manufacturing method are also provided each of which is obtained using the resin varnish.SELECTED DRAWING: None