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2 results about "Pre-preg" patented technology
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Pre-preg is "pre-impregnated" composite fibers where a thermoset polymer matrix material, such as epoxy, or a thermoplastic resin is already present. The fibers often take the form of a weave and the matrix is used to bond them together and to other components during manufacture. The thermoset matrix is only partially cured to allow easy handling; this B-Stage material requires cold storage to prevent complete curing. B-Stage pre-preg is always stored in cooled areas since heat accelerates complete polymerization. Hence, composite structures built of pre-pregs will mostly require an oven or autoclave to cure.
Integrated molded body and electronic device housing
The present application provides a laminated body having excellent thermal conductivity, lightness and rigidity, and an integrated molded body in which the laminated body is integrated with other components. The integrated molded body of the present application is an integrated molded body in which a structure formed of a thermoplastic resin and a reinforcing fiber is arranged on the outer peripheral portion of a laminated body in which at least a prepreg formed of a continuous carbon fiber and a resin is laminated, and the thermal conductivity λ1A in the fiber direction of the continuous carbon fiber of the first prepreg constituting the outermost layer of the laminated body is 100 [W / (m·K)] or more and 800 [W / (m·K)] or less. It is preferably used for an electronic device housing.
Owner:TORAY INDUSTRIES INC
Resin composition, prepreg, and molded object
To provide a resin composition configured to produce a molded body which is excellent in lightness in weight and in which a deterioration in physical properties is suppressed, and a prepreg and a molded body each produced by use of the resin composition. A resin composition comprising hollow particles and a matrix resin, wherein the hollow particles comprise a shell containing a resin and a hollow portion surrounded by the shell; the hollow particles have a void ratio of 50% or more; the hollow particles have a volume average particle diameter of more than 1.0 µm and 20.0 µm or less; and the hollow particles have an epoxy group amount per unit area of 1.0 µmol / m2 or more, which is obtained from an epoxy value and specific surface area of the hollow particles, and wherein the matrix resin comprises a matrix resin containing a functional group which is reactive with an epoxy group.
Owner:ZEON CORP