37 results about "Power planes" patented technology

Technologies for cooling conformal power delivery structures are disclosed. In one embodiment, an integrated circuit component has a die with a backside power plane mated to it. A lid of the integrated circuit component is mated with the backside power plane, forming a sealed cavity. The lid has an inlet and an outlet, and a channel is defined in the lid for liquid coolant to flow from the inlet, across the backside power plane, and to the outlet. The liquid coolant directly contacts the backside power plane, efficiently removing heat from the backside power plane.

The semiconductor device includes a first metal layer, a second metal layer, a metal plane, a third dielectric layer and a fourth dielectric layer. The first metal layer comprises a first dielectric layer with a first plurality of signal track and a first plurality of power rails. The second metal layer comprises a second dielectric layer with a second plurality of signal tracks and a second plurality of power rails. The metal plane is between the first metal layer and the second metal layer. The third dielectric layer is between the first metal layer and the metal plane. The fourth dielectric layer is between the second metal layer and the metal plane.

A motor assembly for driving a pump or rotary device features a power plane with a circular geometry to be mounted inside a space envelope having a similar circular geometry formed on an end-plate between an inner hub portion and a peripheral portion that extends circumferentially around the space envelope of the end-plate. The power plane is a multi-layer circuit board or assembly having: a power layer with higher temperature power modules for providing power to a motor, a control layer with lower temperature control electronics modules for controlling the power provided to the motor, and a thermal barrier and printed circuit board layer between the power layer and the control layer that provides electrical connection paths between the power modules of the power plane and the control electronics modules of the control layer, and also provides insulation between the power layer and the control layer.

A semiconductor structure includes a first transistor including a first set of one or more channels, a second transistor vertically stacked over the first transistor, the second transistor including a second set of one or more channels, the second set of channels of the second transistor being horizontally offset from the first set of channels of the first transistor. The semiconductor structure also includes a power plane at a first side of the semiconductor structure, and a contact extending from the first side of the semiconductor structure, through the power plane, to a source / drain region of the second transistor.

A motor assembly for driving a pump or rotary device features a power plane with a circular geometry to be mounted inside a space envelope having a similar circular geometry formed on an end-plate between an inner hub portion and a peripheral portion that extends circumferentially around the space envelope of the end-plate. The power plane is a multi-layer circuit board or assembly having: a power layer with higher temperature power modules for providing power to a motor, a control layer with lower temperature control electronics modules for controlling the power provided to the motor, and a thermal barrier and printed circuit board layer between the power layer and the control layer that provides electrical connection paths between the power modules of the power plane and the control electronics modules of the control layer, and also provides insulation between the power layer and the control layer.

A multi-phase power converter includes a printed circuit board having a plurality of conductive layers in a spaced apart and parallel relationship. The plurality of conductive layers includes a plurality of power planes in an interleaved configuration with alternating positive and negative voltages and configured to conduct a relatively high current for supplying to a load. The multi-phase power converter also includes a plurality of switching transistors disposed on an upper surface of the printed circuit board and configured to selectively conduct the relatively high current. The conductive layers include at least one signal plane disposed between the plurality of power planes and a surface of the printed circuit board, the at least one signal plane transmitting signals for controlling operation of the plurality of switching transistors. A power converter phase includes a high-side transistor, a low-side transistor, and a driver circuit disposed adjacent to the transistors.

Embodiments herein relate to systems, apparatuses, or processes for creating packages that include one or more memory modules with electrically conductive strips on the side of the memory module to route power or provide a ground to multiple BGA contacts on a side of the memory module coupled with a substrate. Providing power and / or ground in this manner enables fewer layers to be used in a substrate that are no longer needed to be routed in the power plane on the substrate, thus reducing a Z-height of the package. Other embodiments may be described and / or claimed.

The invention provides a chip and electronic equipment, the chip provided by the invention comprises a packaging substrate, a logic layer and an intermediate layer, and the intermediate layer is arranged between the packaging substrate and the logic layer; wherein the packaging substrate comprises a first power supply module, the logic layer comprises a second power supply module, the interposer comprises a plurality of through silicon vias, and the through silicon vias are connected with the first power supply module and the second power supply module; wherein the first power supply module comprises a power supply plane layer, and the second power supply module comprises power supply wires which are arranged in parallel. Therefore, through the three-dimensional power supply module, the power supply design can be optimized, the voltage drop can be reduced, the power supply distribution efficiency and stability can be improved, and the power requirements of different modules can be met.

A system including a power bus configured to supply power to a plurality of server racks arranged within a space of a building, a first power source connection positioned at a first side of the building and configured to supply power from a first power source to the power bus, a second power source positioned at a second side of the building different from the first side and configured to supply power from a second power source to the power bus, and a plurality of diverter switches arranged within the power bus. Each diverter switch may be configured to receive a respective control signal and, responsive to the respective control signal, redirect power within the power bus.

The invention discloses a semiconductor packaging device and a packaging substrate thereof. The packaging substrate comprises a solder mask layer, a composite layer, a grounding layer and a signal layer. The solder mask layer is provided with a plurality of power contacts, a plurality of grounding contacts, a plurality of first signal contacts and a plurality of second signal contacts. The composite layer is provided with a plurality of power supply planes and a plurality of first signal winding wires. The plurality of power supply planes are correspondingly coupled with the plurality of power supply contacts. The plurality of first signal winding wires are correspondingly coupled with the plurality of first signal contacts. And a grounding line is arranged on the grounding layer. The ground line is coupled to a plurality of ground contacts. And a plurality of second signal winding wires are arranged on the signal layer. The plurality of second signal winding wires are correspondingly coupled with the plurality of second signal contacts. Therefore, the influence of the noise on the power supply quality in the wafer operation can be reduced.

According to embodiments of the present disclosure, a printed circuit and manufacturing method thereof are provided. The printed circuit board comprises: a signal plane portion comprising a plurality of metal layers for transmitting a signal; a power plane portion overlaid with the signal plane portion through a connection layer and comprising a plurality of metal layers for providing power; a plurality of power vias each extending from a surface of the signal plane portion facing away from the power plane portion, through the signal plane portion, the connection layer, and the power plane portion, to a surface of the power plane portion facing away from the signal plane portion; and a plurality of signal vias each extending from a surface of the signal plane portion facing away from the power plane portion into the signal plane portion and not into the power plane portion.

The invention discloses a printed circuit board laminated structure of a driving mode selection controller and a design method of the printed circuit board laminated structure. The laminated structure sequentially comprises a top layer, a grounding layer, a power signal layer and a bottom layer from top to bottom, wherein the top layer is used for laying circuit devices; the grounding layer is used for providing a reference ground signal; the power supply signal layer is used for laying a key power supply plane and key signal wires, and the bottom layer is used for laying a common power supply plane and common signal wires; a grounding pin of the circuit device in the top layer is connected to the grounding layer through a via hole, and a signal pin and a power supply pin of the circuit device are connected to the power supply signal layer and the bottom layer through via holes. According to the invention, through lamination planning of the power supply layer, the signal layer and the ground layer, mixed wiring of the signal lines on the power supply layer is realized, and the ground layer provides a reference plane for the device layer and the power supply signal layer, so that the number of laminated layers of the printed circuit board is effectively reduced, and the development cost can be saved.

The invention relates to the technical field of electric tools, and particularly provides a brushless spray gun control circuit and a control panel comprising the control circuit, the control circuit comprises a power supply module, an MCU module, a detection module, a driving module and a feedback module, the MCU module adopts a microcontroller chip U2, and the detection module adopts a HALL signal interface unit and a WSH signal interface unit; the driving module adopts a three-phase six-arm integrated MOSFET (Metal-Oxide-Semiconductor Field Effect Transistor); the feedback module adopts two operational amplifiers OP0 and OP1; the control panel comprises a grounding plane, a power supply plane, a PCB layer and a surface layer which are sequentially arranged from bottom to top; the feedback module and the driving module are integrated, the size of a circuit and the size of a control panel are greatly reduced, and the requirement for miniaturization of a handheld spray gun is met; meanwhile, a targeted efficient heat dissipation structure is designed, and the operation stability is prevented from being affected by local high temperature.

The utility model provides a power supply separation type six-layer circuit board which sequentially comprises a first signal layer, a second signal layer, a ground plane layer, a power supply plane layer, a third signal layer and a fourth signal layer from top to bottom, and a honeycomb-shaped ceramic substrate layer is arranged between a core plate of the second signal layer and the ground plane layer. A copper block layer is embedded in the position, corresponding to the high heat conduction area of the power supply plane layer, of the honeycomb-shaped ceramic substrate layer. A plurality of heat dissipation bonding pads are arranged on the lower surface of the fourth signal layer, and blind holes are formed between the power plane layer and the heat dissipation bonding pads; a plurality of ceramic heat conduction rods are arranged between the power supply plane layer and the fourth signal layer in a penetrating manner; the surface of the copper block layer is coated with a nickel layer. And a high heat dissipation function is realized.

A semiconductor device includes a package substrate below a chip, the package substrate including upper build-up layer including a first plurality of power planes (VDD) and ground planes (GND) and a plurality of vias stacked vertically, a core layer, and lower build-up layers including a second plurality of VDD and GND, and a heat spreader layer over the chip. The heat spreader contacts the package substrate on both ends of the package substrate.

This includes electronic devices with wiring substrates having lower inductance paths for capacitors and related manufacturing methods. In an exemplary aspect, to provide lower interconnect inductance for capacitors coupled to a power distribution network in the wiring substrate, an additional metal layer providing an additional second power plane is provided in a dielectric layer between adjacent metal layers in adjacent metallization layers. This additional second power plane is adjacent to a first power plane disposed in a first metal layer of one of these adjacent metallization layers. This placement of the additional metal layer in the dielectric layer of the metallization layer reduces the thickness of the dielectric material between the first power plane and the second power plane coupled to the capacitor, which is part of the power distribution network. This reduced dielectric thickness between the first power plane and the second power plane coupled to the capacitor reduces the interconnect inductance for the capacitor.

Disclosed in the present application are a communication module and a switch. The communication module comprises: a TSN switch chip module and a communication interface group, wherein the communication interface group is connected to the TSN switch chip module. A printed circuit of the communication module comprises a top layer, a first power / ground plane layer, a signal layer, a power plane, a second power / ground plane layer and a bottom layer which are arranged in sequence. A TSN switch chip is provided on the top layer; the communication interface is provided on the bottom layer; the TSN switch chip module is used for adjusting the clock frequency of a slave port in real time on the basis of the times at which a master port sends two consecutive synchronization messages and the time when the slave port receives the synchronization messages, so that the slave port resonates consistently with the master port; and the communication interface group is used for connecting to different external devices by means of different types of communication interfaces, so as to realize communication transmission between the TSN switch chip module and each external device.

A multi-layer printed circuit board (PCB), includes a first plurality of layers, each having a plurality of signal traces disposed thereon, a second plurality of layers, each having a voltage plane disposed thereon, and a plurality of plated-through-hole vias disposed between a first surface of the multi-layer PCB and a second surface of the multi-layer PCB, wherein each plated-through-hole via includes a conductive barrel, wherein a first layer of the first plurality of layers includes a backdrill clearance region around a first plated-through-hole via in which no signal traces are disposed, and a first voltage plane on a first layer of the second plurality of layers is in contact with the conductive barrel of the first plated-through-hole via. In various embodiments, portions of the barrel of a plated-through-hole via are removed by, for example, backdrilling. Various embodiments advantageously provide improvements to signal-to-reference overlap, and to power plane current-carrying capacity.

A motor assembly for driving a pump or rotary device features a power plane with a circular geometry to be mounted inside a space envelope having a similar circular geometry formed on an end-plate between an inner hub portion and a peripheral portion that extends circumferentially around the space envelope of the end-plate. The power plane is a multi-layer circuit board or assembly having: a power layer with higher temperature power modules for providing power to a motor, a control layer with lower temperature control electronics modules for controlling the power provided to the motor, and a thermal barrier and printed circuit board layer between the power layer and the control layer that provides electrical connection paths between the power modules of the power plane and the control electronics modules of the control layer, and also provides insulation between the power layer and the control layer.

The invention provides a packaging structure. In the packaging structure, a lead frame comprises a base island and a plurality of pins located on the outer side of the base island, chips are attached to the upper portion of the base island, the back faces of the chips face the base island, the front faces of the chips are opposite to the base island, a plurality of power supply bonding pads are arranged on the front faces of the chips, switching pieces are arranged above at least one chip, the base island is grounded, and the switching pieces are connected with the power supply bonding pads. The plurality of power supply bonding pads are connected with the switching sheets through the first bonding wires, and the switching sheets are connected with the corresponding pins through the second bonding wires. Therefore, through switching of the switching sheet, the number of led-out power supply bonding pads is not limited, multiple or even all the power supply bonding pads on the front face of the chip can be led out to the pins, then electrostatic charges can be preferentially discharged through the power supply circuit, the electrostatic discharge protection performance of the packaging structure is enhanced, and the packaging structure is simple in structure and convenient to use. And the creepage distance between the power supply plane and the grounding plane is also increased.

A circuit board is suitable for mounting an electronic package. The circuit board includes a power layer and a circuit board surface which includes a package region corresponding to the electronic package. The package region is rectangular and includes four sides. The power layer includes a first power plane, a second power plane, a third power plane, and the forth power plane. An orthographic projection of the second power plane on the circuit board surface extends from outside into the package region and extending through at least three of the sides. An area of the orthogonal projection of the second power plane on the circuit board surface in the package region is greater than areas of the orthogonal projections of the other power planes on the circuit board surface in the package region. In addition, an electronic assembly including the circuit board and the electronic package is also provided.

The utility model discloses a circuit board structure for power supply far-end feedback in the field of circuit board design, which comprises a power supply copper sheet and a feedback line which are arranged on a power supply plane of a circuit board, the power supply copper sheet comprises a power supply end and a power utilization end, one end of the feedback line is connected with the power supply end, and the other end of the feedback line is connected with the power utilization end. According to the utility model, the problems that the overall thickness of the circuit board is increased and the accuracy and response speed of feedback signals are influenced because the power supply copper sheet and the feedback line are respectively arranged on different wiring layers in the prior art are solved, and the number of wiring lamination layers required by the circuit board can be reduced, so that the production cost is reduced, the overall thickness of the circuit board is reduced, and the production efficiency is improved. Therefore, the circuit board is lighter and thinner, the requirements of modern electronic equipment for miniaturization and light weight can be met, the accuracy of sampling signals is improved, and the stability and response speed of a system are improved.

A computing device includes a printed circuit board (PCB) having a ground plane and a power plane. The ground plane has a length L1 that extends between a first ground edge and a second ground edge. The power plane has a length L2 that extends between a first power edge and a second power edge. The ground plane is parallel to and separated from the power plane by a distance H. The computing device further includes a heat sink integrated with the PCB. The heat sink is parallel to and coupled to the power plane. The heat sink has a length L3 that extends between a first sink edge and a second sink edge. The length L3 of the heat sink is greater than at least one of the length L1 of the ground plane or the length L2 of the power plane.

A motor assembly for driving a pump or rotary device features a power plane with a circular geometry to be mounted inside a space envelope having a similar circular geometry formed on an end-plate between an inner hub portion and a peripheral portion that extends circumferentially around the space envelope of the end-plate. The power plane is a multi-layer circuit board or assembly having: a power layer with higher temperature power modules for providing power to a motor, a control layer with lower temperature control electronics modules for controlling the power provided to the motor, and a thermal barrier and printed circuit board layer between the power layer and the control layer that provides electrical connection paths between the power modules of the power plane and the control electronics modules of the control layer, and also provides insulation between the power layer and the control layer.

The invention relates to a packaging substrate optimization method, computer equipment and a storage medium, and the method comprises the steps: providing an initial packaging substrate which comprises a layer-adding wiring layer and a semiconductor chip electrically connected with the layer-adding wiring layer, the layer-adding wiring layer comprises a signal layer, and a power supply plane layer and a ground plane layer which are respectively positioned on two opposite side surfaces of the signal layer, the signal layer comprises a plurality of signal lines, the power supply plane layer comprises a plurality of reference power supply planes, the ground plane layer comprises a reference ground plane, and the semiconductor chip is electrically connected with the corresponding signal lines in the layer-adding wiring layer; obtaining a target power supply plane, wherein the target power supply plane is at least one reference power supply plane which has the greatest influence on the signal far-end crosstalk resonance; replacing a part of the target power supply plane with a reconstructed ground plane, and electrically connecting the reconstructed ground plane with a reference ground plane in the layer-adding wiring layer through a backflow ground hole to form the packaging substrate. Far-end crosstalk is reduced, and signal integrity is improved.

A motor assembly for driving a pump or rotary device features a power plane with a circular geometry to be mounted inside a space envelope having a similar circular geometry formed on an end-plate between an inner hub portion and a peripheral portion that extends circumferentially around the space envelope of the end-plate. The power plane is a multi-layer circuit board or assembly having: a power layer with higher temperature power modules for providing power to a motor, a control layer with lower temperature control electronics modules for controlling the power provided to the motor, and a thermal barrier and printed circuit board layer between the power layer and the control layer that provides electrical connection paths between the power modules of the power plane and the control electronics modules of the control layer, and also provides insulation between the power layer and the control layer.

A radio-frequency (RF) antenna and method for using the same are disclosed. In some embodiments, an antenna includes an array of RF radiating antenna elements, a plurality of RF antenna element driving circuits coupled to the array of RF radiating antenna elements to supply tuning voltages to the RF radiating antenna elements, and one or more metal power planes, each of the one or more metal power planes coupled to supply a common voltage to two or more of the plurality of RF antenna driving circuits.

This invention discloses a method for symmetrical loss-of-excitation protection of variable-speed pumped-storage units based on a downward-throwing impedance circle, belonging to the field of generator relay protection. The method includes: real-time acquisition of the measured voltage and current at the generator terminals of the variable-speed pumped-storage unit, and calculation of the measured impedance at the generator terminals; constructing a symmetrical loss-of-excitation power circle criterion on the operating power plane of the variable-speed pumped-storage unit; further transforming the symmetrical loss-of-excitation power circle criterion onto the impedance plane to obtain the downward-throwing impedance circle criterion; if the measured impedance at the generator terminals enters the downward-throwing impedance circle and remains within the circle for a time greater than t, then initiating an emergency shutdown of the unit. This invention can quickly detect and judge symmetrical loss-of-excitation faults on the generator side, such as three-phase winding open circuits and complete loss of pulses in the generator-side converter, and can also schedule timely shutdowns for maintenance of the variable-speed pumped-storage unit. Furthermore, this method has high reliability and can effectively ensure the safe operation of the power grid and the variable-speed pumped-storage unit, possessing significant engineering application value.

Embodiments of the present invention include a semiconductor device having stacked transistors, the stacked transistors having a bottom transistor below a top transistor, the bottom transistor having a first bottom source / drain region and a second bottom source / drain region. A first back-side contact is connected to the first bottom source / drain region and a front-side wiring. A second back-side contact is connected to the second bottom source / drain region and a back-side power plane. A via is formed through the back-side power plane to connect the top source / drain region of the top transistor to a back-side power rail.

A circuit system includes an integrated circuit package mounted on a first side of a printed circuit board and a power regulator connected to power terminals of the integrated circuit package through a cutout in the printed circuit board. The power regulator draws power from the printed circuit board by way of connections on a shelf region extending beyond an area of the cutout. A method of manufacturing a printed circuit board includes forming a cutout in the printed circuit board, the cutout having an area less than a footprint of an integrated circuit package, mounting the integrated circuit package over the cutout on a first side of the printed circuit board, coupling a power regulator to power terminals of the integrated circuit package through the cutout, and interfacing the power regulator to a power plane of the printed circuit board by way of a shelf region extending beyond the area of the cutout on a second side of the printed circuit board.