42results about How to "Small thermal mass" patented technology

A voltage regulator. The voltage regulator includes an interposer having, on a first side, a plurality of electrical connections suitable for coupling to a printed circuit board (PCB). The interposer also includes at least one power plane and at least one ground plane, wherein each of the power and ground planes is coupled to one or more of the electrical connections. The voltage regulator further includes a DC-DC converter that is electro-mechanically attachable to and detachable from the interposer. The interposer includes a socket, on a second side, that is suitable to receive two or more electro-mechanical connecting members of the DC-DC converter. When the DC-DC converter is attached to the interposer, at least one of the electromechanical connecting members is electrically coupled to a power plane of the interposer, while at least one other one of the electromechanical connecting members is electrically coupled to the ground plane.

An apparatus for supplying hot water to at least one brewing unit (1) operating with pre-packaged pods or capsules (23) containing one or more doses of ground coffee for the preparation of coffee-based beverages, the brewing unit being provided with a brewing chamber (22) and a discharge duct (36) from the brewing chamber for the supply of the prepared beverage, the apparatus comprising a water heat exchanger (4) with a first opening (5) for the introduction of cold water, a second opening (6) for the supply of heated water, a third opening (7) in the vicinity of the first opening (5), and a cold water supply pump (8) connected between a source (9) of cold water and the first opening (5) of the heat exchanger. The apparatus comprises a water distribution unit (3) provided internally with a chamber (14) stably connected to the second heated water supply opening (6) and to the third opening (7) of the heating member (4) disposed in the vicinity of the cold water inlet opening (5) by means of respective ducts (15. 16) creating a circulation of thermo-siphon type in the water, the chamber (14) being provided with at least one outlet (19) connected to the chamber (22) of the brewing device (1), which may be opened and closed, with the interposition of a valve (20) which may be controlled to open and close the outlet (19).

This invention relates to a chip structure of a microstructure gas sensing sensor array and a preparation method. Said chip is composed of a silicon chip, a heating electrode, a measuring electrode and a gas sensitive film, among which, more than one independent through-holes are set at the center of the base silicon chip and are covered with a supporting film and an insulation film, a heating electrode is set in the supporting film center, the insulation film center has a measuring electrode covered with the gas sensitive film, the insulation film is set between the heating electrode and measuring electrode, the heating electrodes and the gas sensitive films are set opposite to the through-holes. This invention produces large quantities of microstructure gas sensitive sensor arrays with MEMS technology taking metal film as the heating electrode and measuring electrode to greatly increase its stability.

A simplified desktop book binder method and apparatus wherein the sheets to be bound are accurately aligned by the binder tape itself. In particular, the conventional binder tape is formed into an L-shape. Alignment is achieved since the inside corner of the L and the edge of the bundle of sheets of paper are in contact. The tape is dropped into a correspondingly shaped slot in the binder apparatus and the paper bundle is placed on top of the tape, the edge of the bundle being automatically aligned against the corner of the tape. The free end of the long leg is wrapped tightly around the paper bundle. In an alternative arrangement, a form is substituted for the bundle of paper, the form being covered with Teflon tape. Since the glue will not adhere to the Teflon, the form may be removed after binding leaving the covers and binding tape with glue inside the spine, thus allowing the user to make folders as desired.

A headphone assembly for generating an audio output with distortion-free loudness limiting and dynamic equalization feature includes a voltage divider comprising a positive temperature coefficient resistor and a headphone driver, and two audio signal input terminals in each audio channel connected to the voltage divider arranged for connecting to an audio device, wherein a large portion of the voltage of the audio signal to the two audio signal input terminals to appear across the headphone driver in response to the audio signal received through the two audio signal input terminals below a preset low amplitude level; and increasing a resistance of the positive temperature coefficient resistor in a preset non-linear manner and decreasing a voltage drop across the headphone driver accordingly in response to the audio signal received through the two audio signal input terminals which is higher than the preset low amplitude level.

Known infrared surface emitters comprise a carrier with a heating surface and with a conductor track applied to a conductor track covering surface of the carrier and consisting of an electroconductiveresistive material that generates heat as a current flows through, the conductor track comprising a first conductor track section for producing a first surface output and a second conductor track section for producing a second surface output different from the first surface output. The aim of the invention is to provide an infrared surface emitter with a high level of irradiation, designed to emit radiation with an irradiation strength that is as homogeneous as possible. To this end, the carrier contains a composite material comprising an amorphous matrix component and an additional componentin the form of a semiconductor material, and the first conductor track section and the second conductor track section are connected in series and differ from each other in terms of the covering density thereof and/or the conductor cross-section thereof.

A system and method for isothermally distributing a temperature across a semiconductor device. A furnace assembly is provided, which includes a processing tube configured to removably receive a wafer carrier having a full compliment of semiconductor wafers. A heating assembly is provided which can include a heating element positioned to heat air or other gases allowed to enter the process tube. The furnace assembly and process tube are capable of being vertically raised and lowered into a position enclosing the heating assembly within the process tube. Once the heating assembly forms a seal with the process tube, the process tube is exhausted and purged of air. Gas is then allowed to flow into the process tube and exchange heat with the heating element. The heated gas circulates through the process tube to convectively change the temperature of the wafers.

The invention discloses an uncooled infrared detection pixel unit with a nanostructure photosensitive unit and adopting a backlighting mode and a planar array infrared imaging detector chip formed by the pixel unit. The detector chip is formed by bonding a silicon-based active sheet with a photosensitive unit array and a passive substrate sheet playing a supporting role. A large amount of two-dimensional arrays formed by the pixel units are arranged on the active sheet, and each pixel unit is composed of a central infrared transmission channel on the front surface of the silicon substrate, an ROIC readout circuit on the periphery of the transmission channel, a nanostructure photosensitive unit in the pixel center, a surface dielectric layer and a focused micro optic unit on the back surface of the silicon substrate. The infrared light is incident from one side of a micro lens on the back surface of the silicon substrate, the light is converged by the micro lens and is then focused on the nanostructure photosensitive unit on the front surface of the silicon substrate via the light transmission channel to be absorbed and detected. The backlighting nanostructure infrared detector has the advantages of high fill factors and quick response, the device structure and the manufacturing process are simple, and the backlighting nanostructure infrared detector can be used for manufacturing a low-cost infrared thermal imager.

This invention relates to the field of heat-driven cooling devices, heat pumps or thermal transformers, in particular to those devices, known as sorption devices, which employ an ad- or absorbent material as a chemical compressor to raise the pressure of a refrigerant gas. This invention is particularly concerned with a heat exchanger suitable for use as a generator in a sorption device. Embodiments of the invention provide a heat exchanger comprising: a plurality of stacked plate members each plate member being provided with at least one fluid channel therein, each plate member having a channel inlet and a channel outlet associated with each channel of the plate member; a plurality of chambers, the chambers being provided between opposed major faces of respective adjacent plate members, the chambers containing a sorbent material; a thermal fluid inlet in communication with a plurality of the channel inlets and a thermal fluid outlet in communication with a plurality of the channel outlets; and a sorbate inlet and a sorbate outlet in communication with each of the chambers, the fluid channels being provided in fluid isolation from the chambers.

The present invention discloses an infrared detector with a high-efficiency resonant cavity and a preparation method thereof. In order to improve the integration degree of the chip, the resonant cavity of the detector is arranged inside the silicon wafer, and compared with the conventional infrared detecting device, the vacuum chamber of the sensitive film is only a few micrometers in height, thecavity space is greatly reduced, a high vacuum is formed and maintained in an easier manner, and the heat loss of the sensitive layer caused by air convection can be avoided. The sensitive layer filmis arranged in the middle of the resonant cavity, and the upper reflective layer is a thin metal layer which is half-transflected on the back surface of the upper substrate; and the lower reflective layer is a thick metal layer which is totally reflected on the upper surface of the lower substrate, and the light reflects in a round trip in the resonant cavity to pass through the sensitive layer film for two times, so that the number of times of passing through the sensitive layer film is increased, and the light absorption rate is increased. The preparation method for the resonant cavity reflective layer is a conventional photolithography, coating and etching process, the process is simple and easy to implement, the metal pillars are respectively fabricated on the two substrates and finally assembled into a resonant cavity by flip chip bonding, and a skillful process, a low cost and high precision are achieved.

The invention relates to a substrate carrier for mounting substrates, comprising a carrying frame (1) and at least one substrate receptacle (2). The carrying frame (1) has a self-supporting and flexurally rigid frame structure made of longitudinal ribs (6) and transverse ribs (7), which are disposed at an angle to each other and made of a material that is dimensionally stable up to 800 C. The substrate receptacle (2) rests on the carrying frame (1) and has a plate-like design such that the solar cell wafers (5) can be positioned on the upper side of the substrate receptacle (2). Thermally insulating elements (9) are present between the carrying frame (1) and the substrate receptacle (2). The elements of the carrying frame (1) and the substrate receptacle (2) are made of steel, titanium, aluminum, ceramic, CFC (CFC = carbon fiber reinforced carbon) or composites made thereof.

The invention discloses extrusion forming equipment for laminating a flexible material. The equipment comprises a forming die with heat conductivity, a pressure member with elasticity and heat resistance, a vacuum press, a heating device, a cooling device and a control system, wherein the forming die is provide with a concave part for accommodating the flexible material layer and determining the three-dimensional shape of a product to be formed; an air-tight chamber enclosing the material layer can be formed by covering the pressure member on the forming die; the vacuum press is coupled to the air-tight chamber and used for making the coverage area of the pressure member tend to conform to the deformation of the concave part under the vacuum draw action so as to extrude the material layer; the heating device is thermally coupled to the forming die and used for heating the forming die; the cooling device is thermally coupled to the forming die and used for cooling the forming die; and the control system is used for controlling the operation of the vacuum press, the heating device and the cooling device. Through the equipment and the method, the coverage area of the pressure member tends to conform to the deformation of the concave part under the vacuum draw action so as to extrude the material layer, and the material layer is heated at the same time, so that a three-dimensional shape of the material layer taking the forming die as a substrate is obtained.

The present invention relates to a device for receiving plate-shaped substrates (3) for treating them in a treatment appliance in the form of a plasma CVD appliance (PECVD), wherein each substrate hasa front face and a rear face opposite the front face, comprising at least one receiving device (5, 5') for receiving and fixing the substrates (3, 3'), wherein the receiving device has at least two receiving areas (7), in particular a multiplicity of receiving areas (7), wherein at least two substrates (3, 3') are or can be arranged in each receiving area, wherein a rear face of a first substrate(3) is directly in contact with or can be brought directly into contact with a rear face of a second substrate (3'), and wherein at least two receiving areas (5) are arranged parallel, in particularalmost parallel, to each other and are connected to each other by means of insulating connection elements (19), and wherein the parallel receiving areas (5) are connected or connectable in alternationto the outputs of different polarity of a high-frequency generator.

The invention belongs to the field of infrared light sources, and particularly relates to an MEMS infrared light source and a manufacturing method thereof. According to the MEMS infrared light source, a reflecting layer with high reflectivity to infrared radiation is introduced into a heating electrode layer and the back of a supporting material (located in a cavity area of a substrate), so that infrared radiation energy radiated by the heating electrode layer to the cavity part of the substrate through a supporting film is reflected back and is radiated upwards through the heating electrode layer; infrared radiation energy capable of being utilized by the infrared sensor is enhanced, the photoelectric conversion efficiency of the MEMS infrared light source is greatly improved, and the heating power consumption is reduced; meanwhile, the ultrathin (the thickness is not greater than 1 micron) infrared emission layer is introduced, so that the thermal quality of the heating electrode layer is greatly reduced while the high infrared emission capability of the MEMS infrared light source is ensured, the modulation frequency of the MEMS infrared light source is improved, and the heating power consumption is further reduced.

The embodiment of the invention discloses an MEMS gas sensor, an array thereof, a gas detection method and a preparation method. The gas sensor comprises a first substrate provided with a cavity on afirst surface and a gas detection assembly which is arranged at the opening of the cavity and comprises a supporting suspension bridge erected on the opening of the cavity and a gas detection part arranged on the supporting suspension bridge; the gas detection part comprises a strip-shaped heating electrode part, an insulating layer, a strip-shaped detection electrode part and a gas sensitive material part which are stacked in sequence; the strip-shaped detection electrode part comprises a first detection electrode part and a second detection electrode part; a first opening is formed between the first detection electrode part and the second detection electrode part; the gas sensitive material part is arranged at the first opening, the first end of the gas sensitive material part is connected with the first detection electrode part, and the second end of the gas sensitive material part is connected with the second detection electrode part. According to the scheme of the embodiment, thesupporting suspension bridge serves as a sensing part of the gas sensor, the thermal mass is small, and power consumption is low.

The invention relates to friction disks of a clutch. The friction disks are used for transmitting a pressing force to one or two adjacent friction discs in a friction fitting manner, wherein the friction disks have one center, an inner edge provided with an inner diameter, an outer edge provided with an outer diameter and two lateral functional surfaces. The friction disks are characterized in that at least one friction disk is provided with a channel between the two lateral functional surfaces; the channel can allow flow fluid to pass through. With the described friction disks and the clutch with the described friction disks, problems in a conventional technology can be solved maximally. Particularly, the friction disk make it possible to construct the clutch with less heat mass, wherein power loss is reduced and structure size can be minimized.

The invention relates to a wide-response-band particle vibration velocity sensor, which comprises a sensitive element, and is characterized in that the sensitive element (2) comprises a substrate (21)on which a bridge opening (211) is formed, and a plurality of sensitive wires (20) which are arranged on the bridge opening (211) in parallel; and each sensitive wire (20) sequentially comprises a sensitive material layer (206) and a supporting layer (205) from top to bottom, and the sensitive material layer (206) is of a hollow structure. By adopting the sensitive wires with the hollow structures, the equivalent density of the sensitive wires is reduced, so that the heat mass of the sensitive wires is reduced, the heat exchange rate of the structure is improved, the upper limit of the response frequency of the sensor is effectively improved, the response frequency band of the sensor is expanded, and the mass point vibration velocity of a broadband sound signal can be detected without distortion.

The invention provides a preparation method of a calibration blackbody light source. The preparation method comprises the following steps of providing a thin substrate and producing a first insulating layer on the surface of the substrate; producing a heating source on the surface of one side, far away from the substrate, of the first insulating layer, wherein the heating source comprises a lead wire region which can be electrically connected with an external circuit; producing a second insulating layer on the surface of one side, far away from the first insulating layer, of the heating source; producing a temperature sensor on the surface of one side, far away from the substrate, of the first insulating layer or the second insulating layer; forming a lead wire channel on one side, far away from the substrate, of the temperature sensor and forming a lead wire channel on one side, far away from the substrate, of the lead wire region, wherein each lead wire channel is exposed outwards and is electrically connected with the external circuit; and producing a blackbody film on the surface of one side, far away from the heating source, of the second insulating layer. The calibration blackbody light source is fast in warming and cooling rates; the required temperature stabilization time is just 5-10 min; the power consumption is just less than 50W for a light source chip with an area of 5 square centimeters when the radiation temperature is up to 500 DEG C; and the calibration blackbody light source is small in volume and is easily integrated at the interior of an imaging system.