44results about How to "Small thermal mass" patented technology

A voltage regulator. The voltage regulator includes an interposer having, on a first side, a plurality of electrical connections suitable for coupling to a printed circuit board (PCB). The interposer also includes at least one power plane and at least one ground plane, wherein each of the power and ground planes is coupled to one or more of the electrical connections. The voltage regulator further includes a DC-DC converter that is electro-mechanically attachable to and detachable from the interposer. The interposer includes a socket, on a second side, that is suitable to receive two or more electro-mechanical connecting members of the DC-DC converter. When the DC-DC converter is attached to the interposer, at least one of the electromechanical connecting members is electrically coupled to a power plane of the interposer, while at least one other one of the electromechanical connecting members is electrically coupled to the ground plane.

An apparatus for supplying hot water to at least one brewing unit (1) operating with pre-packaged pods or capsules (23) containing one or more doses of ground coffee for the preparation of coffee-based beverages, the brewing unit being provided with a brewing chamber (22) and a discharge duct (36) from the brewing chamber for the supply of the prepared beverage, the apparatus comprising a water heat exchanger (4) with a first opening (5) for the introduction of cold water, a second opening (6) for the supply of heated water, a third opening (7) in the vicinity of the first opening (5), and a cold water supply pump (8) connected between a source (9) of cold water and the first opening (5) of the heat exchanger. The apparatus comprises a water distribution unit (3) provided internally with a chamber (14) stably connected to the second heated water supply opening (6) and to the third opening (7) of the heating member (4) disposed in the vicinity of the cold water inlet opening (5) by means of respective ducts (15. 16) creating a circulation of thermo-siphon type in the water, the chamber (14) being provided with at least one outlet (19) connected to the chamber (22) of the brewing device (1), which may be opened and closed, with the interposition of a valve (20) which may be controlled to open and close the outlet (19).

This invention relates to a chip structure of a microstructure gas sensing sensor array and a preparation method. Said chip is composed of a silicon chip, a heating electrode, a measuring electrode and a gas sensitive film, among which, more than one independent through-holes are set at the center of the base silicon chip and are covered with a supporting film and an insulation film, a heating electrode is set in the supporting film center, the insulation film center has a measuring electrode covered with the gas sensitive film, the insulation film is set between the heating electrode and measuring electrode, the heating electrodes and the gas sensitive films are set opposite to the through-holes. This invention produces large quantities of microstructure gas sensitive sensor arrays with MEMS technology taking metal film as the heating electrode and measuring electrode to greatly increase its stability.

A headphone assembly for generating an audio output with distortion-free loudness limiting and dynamic equalization feature includes a voltage divider comprising a positive temperature coefficient resistor and a headphone driver, and two audio signal input terminals in each audio channel connected to the voltage divider arranged for connecting to an audio device, wherein a large portion of the voltage of the audio signal to the two audio signal input terminals to appear across the headphone driver in response to the audio signal received through the two audio signal input terminals below a preset low amplitude level; and increasing a resistance of the positive temperature coefficient resistor in a preset non-linear manner and decreasing a voltage drop across the headphone driver accordingly in response to the audio signal received through the two audio signal input terminals which is higher than the preset low amplitude level.

The invention discloses a short wave optical thermal detector and a focal plane array device thereof. The short wave optical thermal detector includes an electrode, an electric contact, a photo-thermal detection structure and a substrate. Two ends of the electrode are connected with the electric contact and the photo-thermal detection structure respectively. The photo-thermal detection structure includes heat reactive lines and conducting Na particles capable of generating local surface Plasmon resonance. When electromagnetic radiation of a specific wavelength acts on the conducting Na particles, local surface Plasmon resonance is generated, os that hot spots are formed. Therefore, temperature rise of the heat reactive lines is caused and electric parameter change is caused, and detection of specific electromagnetic radiation by the detector is realized. Through adjusting geometric parameters of the conducting Na particles and combining the conducting Na particles of different parameters, selective spectrum radiation detection and multi-waveband radiation detection are realized. The optical thermal detector provided by the invention is simple in structure and the low cost short wave optical (ultraviolet, visible light and near infrared) waveband detector and the focal plane array device thereof are realized.

Known infrared surface emitters comprise a carrier with a heating surface and with a conductor track applied to a conductor track covering surface of the carrier and consisting of an electroconductiveresistive material that generates heat as a current flows through, the conductor track comprising a first conductor track section for producing a first surface output and a second conductor track section for producing a second surface output different from the first surface output. The aim of the invention is to provide an infrared surface emitter with a high level of irradiation, designed to emit radiation with an irradiation strength that is as homogeneous as possible. To this end, the carrier contains a composite material comprising an amorphous matrix component and an additional componentin the form of a semiconductor material, and the first conductor track section and the second conductor track section are connected in series and differ from each other in terms of the covering density thereof and / or the conductor cross-section thereof.

A system and method for isothermally distributing a temperature across a semiconductor device. A furnace assembly is provided, which includes a processing tube configured to removably receive a wafer carrier having a full compliment of semiconductor wafers. A heating assembly is provided which can include a heating element positioned to heat air or other gases allowed to enter the process tube. The furnace assembly and process tube are capable of being vertically raised and lowered into a position enclosing the heating assembly within the process tube. Once the heating assembly forms a seal with the process tube, the process tube is exhausted and purged of air. Gas is then allowed to flow into the process tube and exchange heat with the heating element. The heated gas circulates through the process tube to convectively change the temperature of the wafers.

The invention discloses an uncooled infrared detection pixel unit with a nanostructure photosensitive unit and adopting a backlighting mode and a planar array infrared imaging detector chip formed by the pixel unit. The detector chip is formed by bonding a silicon-based active sheet with a photosensitive unit array and a passive substrate sheet playing a supporting role. A large amount of two-dimensional arrays formed by the pixel units are arranged on the active sheet, and each pixel unit is composed of a central infrared transmission channel on the front surface of the silicon substrate, an ROIC readout circuit on the periphery of the transmission channel, a nanostructure photosensitive unit in the pixel center, a surface dielectric layer and a focused micro optic unit on the back surface of the silicon substrate. The infrared light is incident from one side of a micro lens on the back surface of the silicon substrate, the light is converged by the micro lens and is then focused on the nanostructure photosensitive unit on the front surface of the silicon substrate via the light transmission channel to be absorbed and detected. The backlighting nanostructure infrared detector has the advantages of high fill factors and quick response, the device structure and the manufacturing process are simple, and the backlighting nanostructure infrared detector can be used for manufacturing a low-cost infrared thermal imager.

There is provided a tool roll with a cylindrical base and a first ribbon having an inner face, an outer face, and first and second major sides located therebetween. The outer face of the first ribbon includes a plurality of depressions or holes formed therein and the first ribbon is wound in helical coils around the base roll such that the inner face is proximate the base roll. The plurality of depressions or holes in the outer face of the first ribbon form a plurality of discrete mold cavities with each of the discrete mold cavities including a mold opening at the outer face of the first ribbon.

This invention relates to the field of heat-driven cooling devices, heat pumps or thermal transformers, in particular to those devices, known as sorption devices, which employ an ad- or absorbent material as a chemical compressor to raise the pressure of a refrigerant gas. This invention is particularly concerned with a heat exchanger suitable for use as a generator in a sorption device. Embodiments of the invention provide a heat exchanger comprising: a plurality of stacked plate members each plate member being provided with at least one fluid channel therein, each plate member having a channel inlet and a channel outlet associated with each channel of the plate member; a plurality of chambers, the chambers being provided between opposed major faces of respective adjacent plate members, the chambers containing a sorbent material; a thermal fluid inlet in communication with a plurality of the channel inlets and a thermal fluid outlet in communication with a plurality of the channel outlets; and a sorbate inlet and a sorbate outlet in communication with each of the chambers, the fluid channels being provided in fluid isolation from the chambers.

The present invention discloses an infrared detector with a high-efficiency resonant cavity and a preparation method thereof. In order to improve the integration degree of the chip, the resonant cavity of the detector is arranged inside the silicon wafer, and compared with the conventional infrared detecting device, the vacuum chamber of the sensitive film is only a few micrometers in height, thecavity space is greatly reduced, a high vacuum is formed and maintained in an easier manner, and the heat loss of the sensitive layer caused by air convection can be avoided. The sensitive layer filmis arranged in the middle of the resonant cavity, and the upper reflective layer is a thin metal layer which is half-transflected on the back surface of the upper substrate; and the lower reflective layer is a thick metal layer which is totally reflected on the upper surface of the lower substrate, and the light reflects in a round trip in the resonant cavity to pass through the sensitive layer film for two times, so that the number of times of passing through the sensitive layer film is increased, and the light absorption rate is increased. The preparation method for the resonant cavity reflective layer is a conventional photolithography, coating and etching process, the process is simple and easy to implement, the metal pillars are respectively fabricated on the two substrates and finally assembled into a resonant cavity by flip chip bonding, and a skillful process, a low cost and high precision are achieved.

The invention relates to a substrate carrier for mounting substrates, comprising a carrying frame (1) and at least one substrate receptacle (2). The carrying frame (1) has a self-supporting and flexurally rigid frame structure made of longitudinal ribs (6) and transverse ribs (7), which are disposed at an angle to each other and made of a material that is dimensionally stable up to 800 C. The substrate receptacle (2) rests on the carrying frame (1) and has a plate-like design such that the solar cell wafers (5) can be positioned on the upper side of the substrate receptacle (2). Thermally insulating elements (9) are present between the carrying frame (1) and the substrate receptacle (2). The elements of the carrying frame (1) and the substrate receptacle (2) are made of steel, titanium, aluminum, ceramic, CFC (CFC = carbon fiber reinforced carbon) or composites made thereof.

The invention discloses extrusion forming equipment for laminating a flexible material. The equipment comprises a forming die with heat conductivity, a pressure member with elasticity and heat resistance, a vacuum press, a heating device, a cooling device and a control system, wherein the forming die is provide with a concave part for accommodating the flexible material layer and determining the three-dimensional shape of a product to be formed; an air-tight chamber enclosing the material layer can be formed by covering the pressure member on the forming die; the vacuum press is coupled to the air-tight chamber and used for making the coverage area of the pressure member tend to conform to the deformation of the concave part under the vacuum draw action so as to extrude the material layer; the heating device is thermally coupled to the forming die and used for heating the forming die; the cooling device is thermally coupled to the forming die and used for cooling the forming die; and the control system is used for controlling the operation of the vacuum press, the heating device and the cooling device. Through the equipment and the method, the coverage area of the pressure member tends to conform to the deformation of the concave part under the vacuum draw action so as to extrude the material layer, and the material layer is heated at the same time, so that a three-dimensional shape of the material layer taking the forming die as a substrate is obtained.

The present invention relates to a device for receiving plate-shaped substrates (3) for treating them in a treatment appliance in the form of a plasma CVD appliance (PECVD), wherein each substrate hasa front face and a rear face opposite the front face, comprising at least one receiving device (5, 5') for receiving and fixing the substrates (3, 3'), wherein the receiving device has at least two receiving areas (7), in particular a multiplicity of receiving areas (7), wherein at least two substrates (3, 3') are or can be arranged in each receiving area, wherein a rear face of a first substrate(3) is directly in contact with or can be brought directly into contact with a rear face of a second substrate (3'), and wherein at least two receiving areas (5) are arranged parallel, in particularalmost parallel, to each other and are connected to each other by means of insulating connection elements (19), and wherein the parallel receiving areas (5) are connected or connectable in alternationto the outputs of different polarity of a high-frequency generator.

The invention belongs to the field of infrared light sources, and particularly relates to an MEMS infrared light source and a manufacturing method thereof. According to the MEMS infrared light source, a reflecting layer with high reflectivity to infrared radiation is introduced into a heating electrode layer and the back of a supporting material (located in a cavity area of a substrate), so that infrared radiation energy radiated by the heating electrode layer to the cavity part of the substrate through a supporting film is reflected back and is radiated upwards through the heating electrode layer; infrared radiation energy capable of being utilized by the infrared sensor is enhanced, the photoelectric conversion efficiency of the MEMS infrared light source is greatly improved, and the heating power consumption is reduced; meanwhile, the ultrathin (the thickness is not greater than 1 micron) infrared emission layer is introduced, so that the thermal quality of the heating electrode layer is greatly reduced while the high infrared emission capability of the MEMS infrared light source is ensured, the modulation frequency of the MEMS infrared light source is improved, and the heating power consumption is further reduced.

The embodiment of the invention discloses an MEMS gas sensor, an array thereof, a gas detection method and a preparation method. The gas sensor comprises a first substrate provided with a cavity on afirst surface and a gas detection assembly which is arranged at the opening of the cavity and comprises a supporting suspension bridge erected on the opening of the cavity and a gas detection part arranged on the supporting suspension bridge; the gas detection part comprises a strip-shaped heating electrode part, an insulating layer, a strip-shaped detection electrode part and a gas sensitive material part which are stacked in sequence; the strip-shaped detection electrode part comprises a first detection electrode part and a second detection electrode part; a first opening is formed between the first detection electrode part and the second detection electrode part; the gas sensitive material part is arranged at the first opening, the first end of the gas sensitive material part is connected with the first detection electrode part, and the second end of the gas sensitive material part is connected with the second detection electrode part. According to the scheme of the embodiment, thesupporting suspension bridge serves as a sensing part of the gas sensor, the thermal mass is small, and power consumption is low.

The invention relates to a cold plate for a refrigeration detector, and the cold plate comprises a cold plate body, wherein the middle part of the cold plate body is provided with a cold finger part mounting area, the cold plate body is a square plate, at least one edge part is provided with a notch, and the notch is sunken from the corresponding edge part to the side where the cold finger part mounting area is located. In addition, the invention further relates to a refrigeration detector adopting the cold plate. According to the invention, the square cold plate body is adopted, and the edgepart of the cold plate body is emptied to a certain extent; the constraint effect on the stress and strain of the detector chip is increased through the corners of the cold plate, so the stress and strain generated by the detector chip under a huge temperature difference can be effectively reduced, the internal stress borne by the detector chip is reduced, the photoelectric performance of the detector chip is ensured, and the startup and shutdown reliability of the refrigeration detector is improved; meanwhile, the heat mass of the cold plate can be reduced, the working load of the refrigerator is reduced, the refrigeration time of the refrigeration detector is shortened, and the working performance of the refrigeration detector is correspondingly improved.

The invention relates to friction disks of a clutch. The friction disks are used for transmitting a pressing force to one or two adjacent friction discs in a friction fitting manner, wherein the friction disks have one center, an inner edge provided with an inner diameter, an outer edge provided with an outer diameter and two lateral functional surfaces. The friction disks are characterized in that at least one friction disk is provided with a channel between the two lateral functional surfaces; the channel can allow flow fluid to pass through. With the described friction disks and the clutch with the described friction disks, problems in a conventional technology can be solved maximally. Particularly, the friction disk make it possible to construct the clutch with less heat mass, wherein power loss is reduced and structure size can be minimized.

Tool rolls and methods of using the tool rolls to manufacture articles with one or more structured surfaces are disclosed. The tool rolls include an outer surface that, when used in connection with materials of the proper viscosity or formability, can form a structured surface on an article. Because the tools are manufactured in roll-form, they can be advantageously used in continuous manufacturing processes. Alternatively, discrete articles may be processed using the tool rolls. The tool rolls are constructed of a cylindrical base roll and are wrapped with one or more continuous wires in a helical pattern. The wires are used, in essence, to form a structured surface on the tool roll that is the negative of the structured surface to be formed on the articles processed using the tool roll. One of the wires wound around the base roll may include depressions formed therein that, when wound in helical coils about the base roll, form cavities on the outer surface of the tool roll. Alternatively, the helical pattern of one or more wound wires may be used to form a continuous helical structured surface, e.g., a helical groove or grooves.

The invention relates to a wide-response-band particle vibration velocity sensor, which comprises a sensitive element, and is characterized in that the sensitive element (2) comprises a substrate (21)on which a bridge opening (211) is formed, and a plurality of sensitive wires (20) which are arranged on the bridge opening (211) in parallel; and each sensitive wire (20) sequentially comprises a sensitive material layer (206) and a supporting layer (205) from top to bottom, and the sensitive material layer (206) is of a hollow structure. By adopting the sensitive wires with the hollow structures, the equivalent density of the sensitive wires is reduced, so that the heat mass of the sensitive wires is reduced, the heat exchange rate of the structure is improved, the upper limit of the response frequency of the sensor is effectively improved, the response frequency band of the sensor is expanded, and the mass point vibration velocity of a broadband sound signal can be detected without distortion.

The invention provides a preparation method of a calibration blackbody light source. The preparation method comprises the following steps of providing a thin substrate and producing a first insulating layer on the surface of the substrate; producing a heating source on the surface of one side, far away from the substrate, of the first insulating layer, wherein the heating source comprises a lead wire region which can be electrically connected with an external circuit; producing a second insulating layer on the surface of one side, far away from the first insulating layer, of the heating source; producing a temperature sensor on the surface of one side, far away from the substrate, of the first insulating layer or the second insulating layer; forming a lead wire channel on one side, far away from the substrate, of the temperature sensor and forming a lead wire channel on one side, far away from the substrate, of the lead wire region, wherein each lead wire channel is exposed outwards and is electrically connected with the external circuit; and producing a blackbody film on the surface of one side, far away from the heating source, of the second insulating layer. The calibration blackbody light source is fast in warming and cooling rates; the required temperature stabilization time is just 5-10 min; the power consumption is just less than 50W for a light source chip with an area of 5 square centimeters when the radiation temperature is up to 500 DEG C; and the calibration blackbody light source is small in volume and is easily integrated at the interior of an imaging system.

The invention relates to the technical field of infrared detection, in particular to an ultra-miniature MEMS throttling refrigeration infrared detector which comprises an MEMS refrigerator and a packaging Dewar. The MEMS refrigerator comprises a refrigerator heat exchange channel, the packaging Dewar comprises a shell and a ceramic substrate sealed in the shell in a vacuum manner, one face of the ceramic substrate is bonded with the refrigeration heat exchange channel through low-temperature glue, and the other face of the ceramic substrate is fixedly provided with a cold shield and a chip; and the refrigerator heat exchange channel comprises a throttling element, a cold fluid channel and a hot fluid channel, one end of the hot fluid channel is provided with a gas inlet connected with a high-pressure gas source, the other end of the hot fluid channel is communicated with one end of the cold fluid channel after passing through the throttling element, and the other end of the cold fluid channel is provided with a gas outlet which flows to the atmosphere through a channel of the shell. According to the chip-level ultra-miniature refrigerator, a micro-flow channel is prepared through the MEMS technology to replace a mechanically-wound capillary tube, and the advantages that the technology is novel, and the refrigerator is low in heat mass, small in size, low in vibration, free of magnetism and the like are achieved.

A ferromagnetic layer is bonded to, or coated on, or in other manner applied to, the surface of a heatable fuser member for fusing dry toner in an image forming device. The ferromagnetic layer promotes inductive heating of the heatable fuser member based on high hysteresis loss exhibited when the ferromagnetic layer is exposed to a magnetic field created by the current flowing through an induction coil or other like device. Suitable materials for the ferromagnetic layer are those which exhibit a high coupling efficiency to the imposed magnetic field. A result is substantially controllable, consistent heating of the heatable fuser member to fuse dry toner onto or into the image bearing surface of an image receiving medium.

The invention relates to a carrier (3) for at least one electrical component (5 to 7). The carrier (3) comprises: a heat sink (11) having a heat sink surface (31) and two opposite side walls (25) protruding from the heat sink surface (31); two sealing blocks (13) which lie flat on the cooling body surface (31) and are spaced apart from each other, each of which extends between the two side walls (25) and abuts against each of the two side walls (25); and a carrier structure (15) for at least one electrical component (5 to 7), which is arranged on the cooling surface (31) between the two sealing blocks (13).

The invention discloses a method for preparing loosened polyimide infrared absorption film, which includes steps that: a piece of polyimide film is prepared by coating photosensitive polyimide resin on the surface of a substrate in rotating mode and then performing imine processing; imine processing leads the polyimide film to be well adhered to the substrate; photo-etching and developing processes are adopted to lead the polyimide film to form on surfaces of image elements; loosening is conducted, and the polyimide film is corroded to remove aluminum powder particles mixed in the polyimide film; and the thickness of polyimide film can be controlled with an oxygen plasma etching method, thermal mass can be reduced, and simultaneously surfaces of the aluminum powder particles can be ensured to be partially or totally exposed so that the aluminum powder particles can be totally removed. The loosened polyimide infrared absorption film prepared with the method overcomes defects that black gold absorption film is poor in mechanical strength, not apt to form images and high in thermal mass, improves infrared absorption efficiency compared with thin metal absorption film, is favorable for improving performance of non-refrigerating detectors, and has practical application value.

An assembly for frothing milk includes an air supply assembly including an air channel having an air inlet and a downstream end. The assembly also includes a fluid channel extending from the fluid inlet to the fluid outlet. The fluid channel then comprises an air inlet exit point to which the downstream end of the air channel is connected, a bubbling unit comprising a pump and a flow-through heating unit. The flow-through heating unit defines a heating unit fluid channel that is a portion of the fluid channel and that has a small thermal mass and a steep temperature profile.

The invention relates to a cold plate used for a refrigeration detector, comprising a cold plate body, the middle part of the cold plate body has a cold finger part installation area, the cold plate body is a square plate, and at least one of the sides is designed with a slot, the slot Concave from the corresponding edge to the side where the cold finger component installation area is located. In addition, it also relates to a refrigeration detector using the above-mentioned cold plate. The invention adopts a square cold plate body and hollows out the edges of the cold plate body to a certain extent, and increases the constraint effect on the stress and strain of the detector chip through the corners of the cold plate, which can effectively reduce the temperature difference of the detector chip. The stress and strain generated under the environment can reduce the internal stress of the detector chip, ensure the photoelectric performance of the detector chip, and improve the reliability of the cooling detector switch; at the same time, it can reduce the thermal mass of the cold plate and reduce the work of the refrigerator. load, shorten the cooling time of the cooling detector, and correspondingly improve the working performance of the cooling detector.