Carrier for electrical component

A technology of electrical components and carriers, applied in the direction of electrical equipment structural parts, electrical components, electrical equipment shells/cabinets/drawers, etc., can solve problems such as high investment costs, high development costs of module shells, long manufacturing process time, etc., to achieve The effect of simplifying components, simplifying manufacturing, and reducing complexity

Pending Publication Date: 2022-05-17
SIEMENS AG
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The bonding process and soft potting require multiple heating processes for pre-drying and hardening the adhesive and potting, which results in long manufacturing process times
Furthermore, the development of the module housing requires relatively high development effort
In addition, high investment costs arise for the injection mold and for the machine for automatic plug-in assembly of electronic modules

Method used

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  • Carrier for electrical component
  • Carrier for electrical component
  • Carrier for electrical component

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0028] attached figure 1 And attached figure 2 ( figure 1 with figure 2 ) respectively show a perspective view of a first embodiment of the electronic module 1 according to the invention. here, figure 1 shows the electronics module 1 without the cover 2 and figure 2 Electronics module 1 with cover 2 is shown. Electronics module 1 comprises a carrier 3 according to the invention, electrical components 5 to 7 and a potting compound 9 .

[0029] The carrier 3 comprises a cover 2 , a heat sink 11 , two sealing blocks 13 , a carrier structure 15 , connecting webs 17 and pin-shaped connecting contacts 19 .

[0030] attached image 3 ( image 3) shows a cross-sectional view of the heat sink 11 . The heat sink 11 has a base body 21 with a planar base body surface 23 on the upper side and two opposite side walls 25 protruding from the base body surface 23 and a plurality of cooling fins 27 on the lower side. The base body surface 23 is coated with a heat dissipation layer ...

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PUM

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Abstract

The invention relates to a carrier (3) for at least one electrical component (5 to 7). The carrier (3) comprises: a heat sink (11) having a heat sink surface (31) and two opposite side walls (25) protruding from the heat sink surface (31); two sealing blocks (13) which lie flat on the cooling body surface (31) and are spaced apart from each other, each of which extends between the two side walls (25) and abuts against each of the two side walls (25); and a carrier structure (15) for at least one electrical component (5 to 7), which is arranged on the cooling surface (31) between the two sealing blocks (13).

Description

technical field [0001] The invention relates to a carrier for at least one electrical component, a method for producing such a carrier, and an electronic module. Background technique [0002] Manufacturing of electronic modules with power semiconductors such as IGBTs (bipolar transistors with insulated gates, English: insulated-gatebipolar transistors) or MOSFETs (metal-oxide-semiconductor field-effect transistors, English: metal-oxide-semiconductor field-effect transistors) is complex and expensive. In order to meet the high insulation requirements in such electronic modules, the semiconductor chip and the bonding wires are covered with a potting compound (eg silicon-based soft potting compound). The potting compound additionally prevents the ingress of moisture and corrosion of the components. During infusion, the infusate is very thin. In order to achieve good wetting and avoid foaming, the infusion is performed at a small low pressure. The outflow of potting compound...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K5/06H05K7/20
CPCH05K5/064H05K7/209H05K7/20409
Inventor 丹尼尔·卡保夫卢茨·纳米斯洛
Owner SIEMENS AG
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