197 results about "Electromagnetic bandgap" patented technology

According to an embodiment of the present invention, an electromagnetic bandgap structure can include: at least three conductive plates; a first stitching via, configured to electrically connect any one of the conductive plates to another conductive plate; and a second stitching via, configured to electrically connect the one conductive plate to yet another conductive plate. In the electromagnetic bandgap structure of the present invetion, the first stitching via can electrically connect the one conductive plate to another conductive plate by allowing a part of the first stitching via to be connected through a planar surface above the one conductive plate, and the second stitching via can electrically connect the one conductive plate to yet another conductive plate by allowing a part of the second stitching via to be connected through a planar surface below the one conductive plate.

By configuring a high impedance frequency selective surface (HZ-FSS) structure for the appropriate values of surface impedance (surface resistance and surface reactance), a high frequency artificial ferrite metamaterial can be synthesized with almost any desired value of real and imaginary permeability. Materials with these properties have not previously been physically realizable at frequencies above 1 GHz.

Electromagnetic Bandgap (EBG) structures are embedded between adjacent power planes in a multi-layer PCB to decrease the emanation of Electromagnetic radiation induced by power buses, signal layers, as well as to suppress the switching noise. EBG stages with different stop bands are cascaded to create rejection over a wider frequency region. The cascading can be performed in series, or may be formed in a variety of arrangements such as a checkerboard design or concentric ribbons positioned along the perimeter of the PCB. Each EBG stage is composed of conductive patches and via posts extending from each patch, which are positioned at a predetermined distance from each other. By surrounding the source of the noise with EBG stages, a sufficient suppression of electromagnetic noise over specific frequency bands of interest is achieved.

A hybrid assembly having improved cross talk characteristics includes an electromagnetic band gap (EBG) layer on a substrate having an upper surface and a lower surface and a semiconductor structure (MMIC) mounted above the EBG layer. A plurality of stars made of an EBG material are preferably printed, or deposited, on the upper surface. The EBG material has slow wave characteristics. The plurality of stars tessellates the upper surface between conductive paths. Each of the stars has a center section formed from a regular polygon, the center section having projections extending from the center section. The projections and the center section form a periphery. The periphery engages adjacent stars along the periphery. Stars are separated from adjacent stars by an interspace. Each of the stars is connected to a conductive via, in turn connected to ground potential. A conductive layer at ground potential is electrically continuous with vias used to interconnect all stars forming the EBG layer.

An electromagnetic bandgap material is electrically attached to an edge, and enables high isolation between antennas due to the attenuation of surface waves. The disclosed embodiments further provide narrow reactive edge treatments in the form of artificial magnetic conductors (AMCs) whose physical width is less than 1 / 10 of a free space wavelength for the frequency of surface currents intended to be suppressed. These embodiments still further provide several AMCs suitable for this purpose, along with several exemplary manufacturing techniques for the AMCs.

An EBG (Electromagnetic Bandgap) structure includes a magnetic material portion at least in part. It is preferable to arrange the magnetic material portion close to or, if possible, in contact with a conductor forming the EBG structure, for example, at least a portion of a ground conductor, a conductor producing a capacitance, and / or a conductor producing an inductance, such as a via. Examples of the magnetic material portion include a ferrite plating film, a composite magnetic material layer including magnetic powder and resin binder, and the like.

Electrically tunable electromagnetic bandgap (“TEBG”) structures using a ferroelectric thin film on a semiconductor substrate, tunable devices that include such a TEBG structure, such as a monolithic microwave integrated circuit (“MMIC”), and a method producing such a TEBG structure are disclosed. The present invention provides a semiconductive substrate having an oxide layer, a first conductive layer positioned on the oxide layer, a ferroelectric layer covering the first conductive layer, and a second conductive layer positioned on a surface of the tunable ferroelectric layer. The use of the ferroelectric layer, which have a DC electric field dependent permittivity, enables a small size, tunable EBG structure.

An electromagnetic bandgap structure and a printed circuit board having the same are disclosed. In accordance with an embodiment of the present invention, the electromagnetic bandgap structure can include a plurality of conductive layers, placed between two conductive layers; and a stitching via, configured to make an electrical connection between any two conductive layers of the conductive layers. Here, the stitching via can include a first via, one end part of the first via configured to any one of the two conductive plates; a second via, one end part of the second via configured to the other of the two conductive plates; and a connection pattern, placed on a planar surface that is different from the conductive plates, between the two conductive layers and configured to make an electrical connection between the other end part of the first via and the other end part of the second via. Any one of the first via and the second via can be formed to penetrate a same planar surface as at least one of the two conductive layers.

Disclosed is a ridge guide waveguide including a conductive base, a conductive ridge protruding upward from the conductive base and extending along a predetermined wave transmission direction, an upper conductive wall located over the conductive base and the conductive ridge and spaced apart from the conductive ridge by a gap, and an electromagnetic bandgap structure arranged adjacent to the conductive ridge between the conductive base and the upper conductive wall.

Disclosed are an electromagnetic bandgap structure and a printed circuit board including the same. In accordance with an embodiment of the present invention, the printed circuit board can include a dielectric layer, a plurality of conductive plates, and a stitching via, which is configured to electrically connect the conductive plates to each other. The stitching via can pass through the dielectric layer, and a part of the stitching via can be placed in a planar surface that is different from a planar surface in which the conductive plates are placed. With the present invention, the electromagnetic bandgap structure can prevent a signal of a predetermined frequency band from being transferred.

An electromagnetic bandgap structure and a printed circuit board that can solve a mixed signal problem between an analog circuit and a digital circuit are disclosed. In accordance with an embodiment of the present invention, the electromagnetic bandgap structure can include a metal layer; and a plurality of mushroom type structures including a metal plate and a via. Here, the plurality of mushroom type structures can be formed on the metal layer in a stacked structure. With the present invention, the small sized electromagnetic bandgap structure can have a lower bandgap frequency.

An electromagnetic bandgap structure and a printed circuit board having the electromagnetic bandgap that intercepts the transfer of a signal ranging a frequency band are disclosed. The electromagnetic bandgap structure includes a metal layer; a dielectric layer, stacked on the metal layer; at least two metal plates, stacked on the same planar surface of the dielectric layer; and a stitching via, connecting the adjacent metal plates. The stitching via passes through the dielectric layer, and a part of the stitching via is placed on the same planar surface of the metal layer. With the present invention, the electromagnetic bandgap can decrease the noise of a particular frequency by having a compact size and a low bandgap frequency.

The present invention relates to a tunable microwave / millimeter-wave arrangement comprising a tunable impedance surface. It comprises an Electromagnetic Bandgap Structure (EBG) (Photonic Bandgap Structure) comprising at least one tunable ferroelectric layer (3), at least one first, top, metal layer (1) and at least one second metal layer (2A, 2B). Said first (1) and second metal layers (2A) are disposed on opposite sides of the / a ferroelectric layer (3), and at least the first, top, metal layer (1) is patterned and the dielectric permittivity of the at least one ferroelectric layer (3) is dependent on a DC biasing voltage directly or indirectly applied to first (1) and / or second (2A, 2B) metal layers disposed on different sides of the / a ferroelectric layer.

A heatsink including an electromagnetic bandgap structure reduces electromagnetic interference caused by an integrated circuit in an electronic device. One embodiment provides a heatsink having a base with an array of electrically-conductive, thermally-conductive patches spaced apart in two dimensions of a reference plane and having a thickness perpendicular to the reference plane. The patches are interconnected by a plurality of branches. Each branch connects adjacent patches and has a width in the reference plane of less than a width of each adjacent patch. A plurality of thermally conductive cooling fins coupled to a surface of the base and extend normal to the reference plane. The cooling fins may be formed of a thermally-conductive, electrically non-conductive material or may be coupled to the base by a thermally-conductive, electrically non-conductive material. The periodically patterned structure of the base, together with a solid metal layer of a circuit board, form an electromagnetic bandgap structure that reduces certain frequencies of electromagnetic noise caused by the integrated circuit.

An electromagnetic wave reverberation chamber includes: an electromagnetic wave absorbing apparatus installed in an intended space of the electromagnetic wave reverberation chamber for adjusting a reflection characteristic of an inside of the electromagnetic wave reverberation chamber, wherein the electromagnetic wave absorbing apparatus have an electromagnetic bandgap structure including a plurality of unit cells arranged periodically.

An electromagnetic bandgap structure and a printed circuit board that intercepts to transfer a signal having a predetermined frequency band are disclosed. In particularly, the electromagnetic bandgap structure includes a first metal layer and a second metal layer; a metal plate, placed between the first metal layer and a second metal layer; a multi-via, penetrating the first metal layer, passing through the same planar surface as an outer metal layer and turning toward the first metal layer to connect the metal plate and the first metal layer; and a dielectric layer, stacked in between the first metal layer and the metal plate, between the metal plate and the second metal layer and between the first metal layer and the outer metal layer. With the present invention, a bandgap frequency can be decreased without increasing the size of the metal plate.

The invention discloses a multiple-input multiple-output antenna and a mobile terminal. The multiple-input multiple-output antenna comprises an antenna substrate, a plurality of antenna units, an electromagnetic bandgap structure and a floor, wherein the antenna units are pasted on the surface of the antenna substrate at intervals; the antenna substrate is overlapped with the floor; the electromagnetic bandgap structure is arranged at a position between two of the antenna units on the antenna substrate and is connected to the floor. According to the multiple-input multiple-output antenna, due to the arrangement of the electromagnetic bandgap structure, the isolation of the MIMO (multiple-input multiple-output) antenna can be enhanced, so that the radiation efficiency of each antenna unit can be improved, and the communication data transmission rate is increased.

According to the present invention, the board can include a dielectric layer; a plurality of conductive plates; and a stitching via, to electrically connect two of the conductive plates to each other. Here, the stitching via can include a first via and a second via, respectively, passing through the dielectric layer and having one end part being placed on a same planar surface as each of the two conductive plates; a connection pattern, having each end part being connected to the other end part of the first via and the second via, respectively; and a first extension pattern, placed on the same planar surface as one of the conductive plates and having one end part being connected to the one end part of the first via and the end part being connected to one of the conductive plates.

Improved noise isolation for high-speed digital systems on packages and printed circuit boards is provided by the use of mixed alternating impedance electromagnetic bandgap (AI-EBG) structures and a power island configured to provide ultimate noise isolation. A power island is surrounded by a plurality of mixed AI-EBG structures to provide a power distribution network. In this structure, the gap around the power island provides excellent isolation from DC to the first cavity resonant frequency which is determined by the size of the structure and dielectric material. One AI-EBG structure provides excellent isolation from the first cavity resonant frequency of around 1.5 GHz to 5 GHz. The other AI-EBG structure provides excellent noise isolation from 5 GHz to 10 GHz. Through use of this novel configuration of AI-EBG structures, a combination effect of the hybrid AI-EBG structure provides excellent isolation far in excess of 10 GHz. The AI-EBG structure is a metallic-dielectric EBG structure that comprises two metal layers separated by a thin dielectric material (similar to power / ground planes in packages and PCBs). However, in the AI-EBG structure, only one of the metal layers has a periodic pattern which is preferably a two-dimensional rectangular lattice with each element consisting of a metal patch with four connecting metal branches.

A method for improving EBG (electromagnetic bandgap) structures is provided. First, a multi-layer board having at least one EBG unit is provided. Then, a maximum input impedance of the EBG unit under a predetermined frequency band is measured, in which a frequency corresponding to the maximum input impedance is a resonance frequency, and a capacitance is determined based on the resonance frequency. Besides, a minimum input impedance of the EBG unit is measured, and a logarithmic value corresponding to the maximum input impedance and a logarithmic value corresponding to the minimum input impedance are obtained so as to determine a resistance. Finally, an electronic device having the capacitance and the resistance is coupled to the EBG unit in parallel.

Disclosed is a printed circuit board including an electromagnetic bandgap structure. The electromagnetic bandgap structure for blocking a noise is inserted into the printed circuit board. The electromagnetic bandgap structure can include a first conductive plate; a second conductive plate arranged on a planar surface that is different from that of the first conductive plate; a third conductive plate arranged on a planar surface that is different from that of the second conductive plate; and a stitching via unit configured to connect the first conductive plate and the third conductive plate by bypassing the planar surface on which the second conductive plate is arranged and including a first inductor element.

An electromagnetic bandgap structure and a printed circuit board that can solve a mixed signal problem between an analog circuit and a digital circuit are disclosed. In accordance with an embodiment of the present invention, the electromagnetic bandgap structure can include a first metal layer; a first dielectric layer, stacked in the first metal layer; a metal plate, stacked in the first dielectric layer; a via, connecting the first metal layer to the metal plate; a second dielectric layer, stacked in the metal plate and the first dielectric layer; and a second metal layer, stacked in the second dielectric layer. Here, a hole can be formed on the metal plate. With the present invention, the electromagnetic bandgap structure can lower a noise level more within the same frequency band as compared with other structures having the same size.

The invention disclose an electromagnetic bandgap structure and printed circuit board euipped with the electromagnetic bandgap structure. According to the present invention, the board can include a dielectric layer; a plurality of conductive plates; and a stitching via, to electrically connect two of the conductive plates to each other. Here, the stitching via can include a first via and a second via, respectively, passing through the dielectric layer and having one end part being placed on a same planar surface as each of the two conductive plates; a connection pattern, having each end part being connected to the other end part of the first via and the second via, respectively; and a first extension pattern, placed on the same planar surface as one of the conductive plates and having one end part being connected to the one end part of the first via and the end part being connected to one of the conductive plates.

An electromagnetic bandgap structure and a printed circuit board including it as well as a method of manufacturing thereof that can solve a mixed signal problem between an analog circuit and a digital circuit are disclosed. The electromagnetic bandgap structure in accordance with an embodiment of the present invention can include: a first metal layer; a first dielectric layer, stacked on the first metal layer; a metal plate, stacked on the first dielectric layer; a second dielectric layer, stacked on the metal plate and the first dielectric layer; a second metal layer, stacked on the second dielectric layer; and a via, directed from the metal plate to the first metal layer and the second metal layer. The via can be connected to the first metal layer and is not connected the second metal layer.

The invention provides a high-gain dielectric resonator antenna applied to a 60 GHz millimeter wave communication system, belongs to the technical field of electromagnetic propagation and receiving and provides a high-gain dielectric resonator antenna based on an H-shaped slot fractal uniplanar compact electromagnetic bandgap (HSF-UC-EBG) structure. The specific implementation is that a circle of HSF-UC-EBG structure is loaded around a radiating main body of a dielectric resonator antenna; and the high-gain dielectric resonator antenna is characterized in that the gain in a working frequency range of the antenna is effectively improved under the conditions of keeping size and section of the dielectric resonator antenna unchanged. The designed high-gain HSF-UC-EBG dielectric resonator antenna can be used in the 60 GHz millimeter wave communication system and provides guidance for designing a high-gain antenna which works in a high-frequency system.

A circuit board includes a plurality of differential signal line pairs, and a plurality of electromagnetic bandgap (EBG) patterns, each configured to be disposed to overlap the plurality of differential signal line pairs, wherein the EBG patterns are electrically insulated from the differential signal line pairs.

The present invention relates to a tunable microwave / millimeter-wave arrangement comprising a tunable impedance surface. It comprises an Electromagnetic Bandgap Structure (EBG) (Photonic Bandgap Structure) comprising at least one tunable ferroelectric layer (3), at least one first, top, metal layer (1) and at least one second metal layer (2A, 2B). Said first (1) and second metal layers (2A) are disposed on opposite sides of the / a ferroelectric layer (3), and at least the first, top, metal layer (1) is patterned and the dielectric permittivity of the at least one ferroelectric layer (3) is dependent on a DC biasing voltage directly or indirectly applied to first (1) and / or second (2A, 2B) metal layers disposed on different sides of the / a ferroelectric layer.

A printed circuit board having an embedded chip capacitor is disclosed. According to an embodiment of the present invention, a printed circuit board having an embedded chip capacitor can include a first conductive layer; a second conductive layer, placed away from the first conductive layer; a chip capacitor, placed between the first conductive layer and the second conductive layer and having a second electrode, connected to the second conductive layer; and a via, connecting the first conductive layer to a first electrode of the chip capacitor. With the present invention, a problem mixed signals can be solved in the printed circuit board including an analog circuit and a digital circuit board by using the chip capacitor embedded in the printed circuit board as an electromagnetic bandgap structure. Here, various electrical devices or elements are mounted in the printed circuit board.