197 results about "Electromagnetic bandgap" patented technology

By configuring a high impedance frequency selective surface (HZ-FSS) structure for the appropriate values of surface impedance (surface resistance and surface reactance), a high frequency artificial ferrite metamaterial can be synthesized with almost any desired value of real and imaginary permeability. Materials with these properties have not previously been physically realizable at frequencies above 1 GHz.

An electromagnetic bandgap material is electrically attached to an edge, and enables high isolation between antennas due to the attenuation of surface waves. The disclosed embodiments further provide narrow reactive edge treatments in the form of artificial magnetic conductors (AMCs) whose physical width is less than 1 / 10 of a free space wavelength for the frequency of surface currents intended to be suppressed. These embodiments still further provide several AMCs suitable for this purpose, along with several exemplary manufacturing techniques for the AMCs.

An antenna system includes an antenna element and an electromagnetic bandgap element proximate the antenna element wherein the electromagnetic bandgap element is optimized for narrow bandwidth operation thereby providing radiofrequency selectivity to the antenna system. Preferably the electromagnetic bandgap element is tunable such as through use of a bias-alterable dielectric substrate or other tuning mechanism. The design approach also provides a means of creating an ultra-thin low-profile narrowband tunable channel selective antenna system suitable for low frequency applications.

Disclosed is a ridge guide waveguide including a conductive base, a conductive ridge protruding upward from the conductive base and extending along a predetermined wave transmission direction, an upper conductive wall located over the conductive base and the conductive ridge and spaced apart from the conductive ridge by a gap, and an electromagnetic bandgap structure arranged adjacent to the conductive ridge between the conductive base and the upper conductive wall.

A high-frequency Electromagnetic Bandgap (EBG) device, and a method for making the device are provided. The device includes a first substrate including multiple conducting vias forming a periodic lattice. The vias of the first substrate extend from the lower surface of the first substrate to the upper surface of the first substrate. The device also includes a second substrate having multiple conducting vias forming a periodic lattice. The vias of the second substrate extend from the lower surface of the second substrate to the upper surface of the second substrate. The second substrate is positioned adjacent to, and overlapping, the first substrate, such that the lower surface of the second substrate is in contact with the upper surface of the first substrate, and such that a plurality of vias of the second substrate are in contact with a corresponding plurality of vias of the first substrate.

The present invention relates to a tunable microwave / millimeter-wave arrangement comprising a tunable impedance surface. It comprises an Electromagnetic Bandgap Structure (EBG) (Photonic Bandgap Structure) comprising at least one tunable ferroelectric layer (3), at least one first, top, metal layer (1) and at least one second metal layer (2A, 2B). Said first (1) and second metal layers (2A) are disposed on opposite sides of the / a ferroelectric layer (3), and at least the first, top, metal layer (1) is patterned and the dielectric permittivity of the at least one ferroelectric layer (3) is dependent on a DC biasing voltage directly or indirectly applied to first (1) and / or second (2A, 2B) metal layers disposed on different sides of the / a ferroelectric layer.

Improved noise isolation for high-speed digital systems on packages and printed circuit boards is provided by the use of mixed alternating impedance electromagnetic bandgap (AI-EBG) structures and a power island configured to provide ultimate noise isolation. A power island is surrounded by a plurality of mixed AI-EBG structures to provide a power distribution network. In this structure, the gap around the power island provides excellent isolation from DC to the first cavity resonant frequency which is determined by the size of the structure and dielectric material. One AI-EBG structure provides excellent isolation from the first cavity resonant frequency of around 1.5 GHz to 5 GHz. The other AI-EBG structure provides excellent noise isolation from 5 GHz to 10 GHz. Through use of this novel configuration of AI-EBG structures, a combination effect of the hybrid AI-EBG structure provides excellent isolation far in excess of 10 GHz. The AI-EBG structure is a metallic-dielectric EBG structure that comprises two metal layers separated by a thin dielectric material (similar to power / ground planes in packages and PCBs). However, in the AI-EBG structure, only one of the metal layers has a periodic pattern which is preferably a two-dimensional rectangular lattice with each element consisting of a metal patch with four connecting metal branches.

Disclosed is a printed circuit board including an electromagnetic bandgap structure. The electromagnetic bandgap structure for blocking a noise is inserted into the printed circuit board. The electromagnetic bandgap structure can include a first conductive plate; a second conductive plate arranged on a planar surface that is different from that of the first conductive plate; a third conductive plate arranged on a planar surface that is different from that of the second conductive plate; and a stitching via unit configured to connect the first conductive plate and the third conductive plate by bypassing the planar surface on which the second conductive plate is arranged and including a first inductor element.

A printed circuit board having an embedded chip capacitor is disclosed. According to an embodiment of the present invention, a printed circuit board having an embedded chip capacitor can include a first conductive layer; a second conductive layer, placed away from the first conductive layer; a chip capacitor, placed between the first conductive layer and the second conductive layer and having a second electrode, connected to the second conductive layer; and a via, connecting the first conductive layer to a first electrode of the chip capacitor. With the present invention, a problem mixed signals can be solved in the printed circuit board including an analog circuit and a digital circuit board by using the chip capacitor embedded in the printed circuit board as an electromagnetic bandgap structure. Here, various electrical devices or elements are mounted in the printed circuit board.