Printed circuit board with embedded chip capacitor and chip capacitor embedment method

Abstract

A printed circuit board having an embedded chip capacitor is disclosed. According to an embodiment of the present invention, a printed circuit board having an embedded chip capacitor can include a first conductive layer; a second conductive layer, placed away from the first conductive layer; a chip capacitor, placed between the first conductive layer and the second conductive layer and having a second electrode, connected to the second conductive layer; and a via, connecting the first conductive layer to a first electrode of the chip capacitor. With the present invention, a problem mixed signals can be solved in the printed circuit board including an analog circuit and a digital circuit board by using the chip capacitor embedded in the printed circuit board as an electromagnetic bandgap structure. Here, various electrical devices or elements are mounted in the printed circuit board.

Description

CROSS-REFERENCE TO RELATED PATENT APPLICATIONS[0001]This application claims the benefit of Korean Patent Application No. 10-2007-0097722, filed on Sep. 28, 2007, in the Korean Intellectual Property Office, the disclosure of which is incorporated herein in its entirety by referenceBACKGROUND OF THE INVENTION[0002]1. Field of the Invention[0003]The present invention relates to a printed circuit board, more specifically to a printed circuit board having an embedded chip capacitor and a chip capacitor embedding method that can use a series connection structure between a chip capacitor and a via as an electromagnetic bandgap structure.[0004]2. Background Art[0005]Various apparatuses such as mobile communication terminals, personal digital assistants (PDA), laptop computers and digital multimedia broadcasting (DMB) devices have been launched in order to meet today's trend that mobility is considered as one of the most important issues.[0006]Such apparatuses include a printed circuit board...

AI Technical Summary

Benefits of technology

The present invention provides a printed circuit board with an embedded chip capacitor that uses a series connection structure between the chip capacitor and a via as an electromagnetic bandgap structure to solve the problem of mixed signals and prevent noise. The chip capacitor can be easily fabricated and can have a high capacity and efficiency. The printed circuit board is compact, thin, and light-weighted. The invention also provides a method for embedding a chip capacitor in a printed circuit board. The chip capacitor includes a first electrode, a dielectric member, and a second electrode. The chip capacitor can be connected to the first conductive layer through a via or can be connected to the second conductive layer through a cavity formed between the first and second conductive layers. The invention can be used in a printed circuit board with a digital circuit and an analog circuit. The chip capacitor can be stacked on the via or can be placed on the dielectric layer. The invention also includes an etched pattern in the form of an open-curved line shape or a spiral shape.

Problems solved by technology

This problem results in obstructing the accurate operation of the RF circuit 140.

For example, when the RF circuit 140 receives a signal having a certain frequency band, transferring the EM wave 150 including the signals having the certain frequency band from the digital circuit 130 may make it difficult to accurately receive the signal having the certain frequency band.

Solving the problem mixed signals becomes more difficult due to the higher operation frequency of the digital circuit 130 according to the increased complexity of electronic apparatuses.

The decoupling capacitor method, which is a typical solution for power noise, is not adequate for high frequencies.

However, the foregoing electromagnetic bandgap structure may not satisfy the two conditions needed to solve the mixed signal problem simultaneously.

However, this may have a bad influence on signal integrity.

Also, in the case of having the complex line structure in which the digital circuit and the RF circuit are realized on the same board like the main board of a mobile phone or mounting a lot of active elements and passive elements in the same small-sized board as a system in package (SiP) board, a lot of design limitations are required to be recovered to realize the electromagnetic bandgap structure by the conventional mushroom type structure.

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