1452results about How to "Improve radiation efficiency" patented technology

Provided are Circular Polarized Helical Radiation element and its Array Antenna operable in TX band and RX band. The circular polarized helical radiation element and its array antenna and the antenna with double reflection boards using that array can operate at TX/RX dual band which is high frequency such as Ka band by operating the helical antenna in axial mode and implementing dual feeding structure. The array antenna having a number of radiation elements operable in the both of TX band and RX band, wherein the radiation elements are arrayed on predetermined column lines, each radiation element comprising: a helix for radiating orthogonal circular polarized waves in the different frequency bands wherein the helix is fed at its beginning point and its terminating point; and a wave guide for accommodating the helix.

An antenna having at least one reflector for improving radiation efficiency, gain, and directivity is disclosed. The antenna may be formed on a substrate or be a standalone conductive material that is designed to operate in at least one band of frequency. The antenna includes a reflector for each band of frequency the antenna is designed to operate in. The reflector is positioned relative to the antenna to redirect electromagnetic radiation of the antenna away from surrounding materials or objects that affect, i.e., reflect, refract, diffract, absorb and scatter the antenna's electromagnetic radiation.

A light emitting device package and a back light unit for liquid crystal display using the same wherein a fan is used to forcibly cool an LED package and a back light unit for LCD to increase the heat radiation efficiency and to prevent the degradation of the device.

Separate leads and a common lead are provided on the upper and lower surfaces of a substrate. A plurality of LED elements are disposed in an array on the common lead on the upper surface of the substrate. The common lead provided on the upper surface of the substrate is connected to the common lead provided on the lower surface of the substrate through through-hole plating. Heat generated from the plurality of LED elements is transferred through the common lead provided on the upper surface of the substrate and the through-hole plating to the common lead provided on the lower surface of the substrate and is released therefrom into the air. By virtue of this construction, an light emitting device can be realized in which heat radiating properties are homogenized, heat radiation efficiency is improved, and a compact structure is obtained and, thus, the color balance is improved and unfavorable phenomena such as lowering in the output of light emitting elements and shortening of the service life are avoided.

It is an objective of the present invention to provide an antenna construction that allows the thickness of an antenna structure be lower than that of planar antennas according to prior art without sacrificing the radiation efficiency at the desired RF-bands as 900 MHz GSM and 1800 MHz/1900 MHz DCS/PCS. A further object of the invention is to provide an antenna construction that is insensitive to changes in positions of electrically conductive objects in the vicinity. The objectives of the invention are achieved by a loop antenna structure equipped with an electrically conductive parasitic radiator that is electro-magnetically coupled with the antenna loop. Performance at the DCS/PCS bands can be further improved by using an electrically conductive tuner element that provides a stronger electromagnetic coupling between the antenna loop and the parasitic radiator.

An LED package and a fabrication method therefor. The LED package includes first and second lead frames made of heat and electric conductors, each of the lead frames comprising a planar base and extensions extending in opposed directions and upward directions from the base. The package also includes a package body made of a resin and configured to surround the extensions of the first and second lead frames to fix the first and second lead frames while exposing underside surfaces of the first and second lead frames. The LED package further includes a light emitting diode chip disposed on an upper surface of the base of the first lead frame and electrically connected to the bases of the first and second lead frames, and a transparent encapsulant for encapsulating the light emitting diode chip.

A safe and high-brightness LED lamp consists of a lampshade, a bulb mounting base, an LED module and a circuit board. The lampshade and bulb mounting base construct an inner space, which is allowable to store said LED module; the LED module consists of a heat-radiating block, an LED lamp panel and a reflective wall, where such LED lamp panel can be flat nestled up against the heat-radiating block at one end. Moreover, such reflective wall can be coupled with the LED lamp so that the said inner space can be partitioned into one light source refractive space and one flowing space for airflow thereof. Furthermore, an electrical fan is installed outside the heat-radiating block. Thereby, while light is being refracted and diffused via reflective wall into the light source refractive space in lampshade, it will then be refracted and diffused once more, and under this circumstance, not only the light will become more uniform with higher brightness, but also it will improve the heat radiation efficiency, and thus, resulting in a longer service life for such LED lamp while utilizing the said flowing space for airflow to guide the air blown by the fan.

Methods are disclosed for producing highly doped semiconductor materials. Using the invention, one can achieve doping densities that exceed traditional, established carrier saturation limits without deleterious side effects. Additionally, highly doped semiconductor materials are disclosed, as well as improved electronic and optoelectronic devices/components using said materials. The innovative materials and processes enabled by the invention yield significant performance improvements and/or cost reductions for a wide variety of semiconductor-based microelectronic and optoelectronic devices/systems. Materials are grown in an anion-rich environment, which, in the preferred embodiment, are produced by moderate substrate temperatures during growth in an oxygen-poor environment. The materials exhibit fewer non-radiative recombination centers at higher doping concentrations than prior art materials, and the highly doped state of matter can exhibit a minority carrier lifetime dominated by radiative recombination at higher doping levels and higher majority carrier concentrations than achieved in prior art materials. Important applications enabled by these novel materials include high performance electronic or optoelectronic devices, which can be smaller and faster, yet still capture or emit light efficiently, and high performance electronics, such as transistors, which can be smaller and faster, yet cooler.

Various planar inverted-F antenna configurations may include an antenna element formed on the top of a PCB and a ground element formed on the bottom of the PCB. Two or more slots may be included in the antenna element for reducing the antenna area while maintaining a suitable impedance bandwidth. A slot may be included in the ground element for reducing the ground area while increasing radiation efficiency. A folded ground may be formed on the top of the PCB for reducing system area while maintaining suitable performance. By moving the folded ground closer to the antenna element and increasing the PCB thickness, significant reductions in system area may be achieved, while maintaining or improving performance in terms of radiation pattern, radiation efficiency and impedance bandwidth.

An antenna device includes a feed coil and a sheet conductor. The feed coil includes a magnetic core and a coil-shaped conductor, which is provided around the magnetic core. An RFIC is connected to the feed coil. The sheet conductor has a larger area than the feed coil. A slit that extends from a portion of the edge of the sheet conductor toward the inner side of the sheet conductor is provided in the sheet conductor. The feed coil is arranged such that the direction of the axis around which the feed coil is disposed is parallel or substantially parallel to the directions in which the sheet conductor extends. The feed coil is arranged such that the feed coil is close to the slit and one of coil openings at the ends of the feed coil faces the slit.

The present invention discloses an antenna device and an electronic device. The antenna device comprises a metal housing with a slit structure, wherein the metal housing is divided into an antenna arm portion and a main area portion; the antenna arm portion comprises a first fracture and a second fracture, and the antenna arm portion is at least divided by the first fracture and the second fracture into: a first antenna arm located between the first fracture and the second fracture, the first antenna arm being separating from the main area portion, a second antenna arm located at the first side of the first antenna arm, the first end and the second end of the second antenna arm being connected with the main area portion, a first matching circuit, one end of the first matching circuit being connected with the first antenna arm through a first metal connection piece, the other end of the first matching circuit being earthed at least through a first feed source; and a second matching circuit, one end of the second matching circuit being connected with the second antenna arm through a second metal connection piece, and the other end thereof being earthed through a second feed source. The antenna device and the electronic device is low in contour and high isolation, satisfy carrier aggregation, and facilitate improving antenna radiation efficiency and partial space multi-antenna design.

The antenna includes a Litz wire loop having a plurality of individually insulated wires braided together and a plurality of splices therein to define distributed capacitors. A magnetically coupled feed loop is provided within the electrically conductive loop, and a feed structure, such as a coaxial feed line, feeds the magnetically coupled feed loop.

A semiconductor device is provided, which is capable of improving mounting flexibility relatively and increasing general versatility, as well as realizing heat radiation characteristics and low on-resistance. Moreover, the semiconductor device is provided, which is capable of improving reliability, performing processing in manufacturing processes easily and reducing manufacturing costs. Also, the semiconductor device capable of decreasing the mounting area is provided. A semiconductor chip in which an IGBT is formed and a semiconductor chip in which a diode is formed are mounted over a die pad. Then, the semiconductor chip and the semiconductor chip are connected by using a clip. The clip is arranged so as not to overlap with bonding pads formed at the semiconductor chip in a flat state. The bonding pads formed at the semiconductor chip are connected to electrodes by using wires.

A high power LED package, in which substantially planar first and second lead frames made of high reflectivity metal are spaced from each other for a predetermined gap. An LED chip is seated on at least one of the lead frames, and having terminals electrically connected to the lead frames, respectively. A package body made of resin seals the LED chip therein while fixedly securing the lead frame in the bottom thereof. The encapsulant preferably fills up the gap between the first and second lead frames. The LED package is structured to raise thermal radiation efficiency thereby reducing the size and thickness thereof.

There is provided a heat conductive portion for conducting heat generated by an LED light source to cooling liquid at a rear side of each LED light source. Each heat conductive portion is connected one another with a pipe, and the cooling liquid flowing in the pipe is sequentially circulated through each heat conductive portion. A heat generation amount of an LED light source for red light is the smallest, the heat generation amount of an LED light source for green light is the largest, and the heat generation amount of an LED light source for blue light is the middle of the two. The cooling liquid cooled by passing through a radiation fin is firstly supplied to the heat conductive portion for the LED light source for red light, secondly supplied to the heat conductive portion for the LED light source for blue light, and lastly supplied to the heat conductive portion for the LED light source for green light. The cooling liquid discharged from a pump is supplied to the heat conductive portion for the heat conductive portion for the LED light source for green light. Then, the cooling liquid from this heat conductive portion passes through the pipe to be supplied to the radiation fin (radiator).

A photo-semiconductor device comprises a photoconductive semiconductor film provided with electrodes and formed on a second substrate, the semiconductor film being formed by epitaxial growth on a first semiconductor substrate different from the second substrate, the second substrate being also provided with electrodes, the electrodes of the second substrate and the electrodes of the photoconductive semiconductor film being held in contact with each other.

According to the general concept disclosed herein, a circuit for adaptive matching of a load impedance to a predetermined load-line impedance of a load-line connected to a power amplifier output includes a fixed matching network between the power transistor and an adaptive matching network, whereby the fixed matching network acts as an impedance inverter which results in a relatively low insertion loss at high power. Results indicate that the impedance-inverting network can be used over more than a factor of 10 in impedance variation. Further, the usage of the fixed matching network, close to the power transistor, allows for the implementation of transmission zeros and/or for a well defined load impedance at a predetermined harmonic frequency, independent of the (variable) load impedance at the fundamental frequency.

The invention provides an AOG antenna system and a mobile terminal. The AOG antenna system includes an encapsulation antenna disposed between a main board and a 3D glass rear cover and electrically connected with the main board and a metal antenna formed on a surface of the 3D glass rear cover, the metal antenna includes a first antenna attached to an inner surface of the 3D glass rear cover and asecond antenna attached to an outer surface of the 3D glass rear cover, the first antenna corresponds to a position of an encapsulated antenna and is fed by coupling of the encapsulated antenna, andthe second antenna corresponds to a position of the first antenna and is fed by coupling of the first antenna. Compared with the related art, the AOG antenna system provided by the invention greatly reduces the influence of the 3D glass back cover on the internal encapsulated antenna of the mobile terminal by arranging the metal antenna on the surface of the 3D glass back cover, and has high antenna radiation efficiency, small gain reduction and dual-frequency coverage.