Light emitting diode package and fabrication method thereof

Abstract

An LED package and a fabrication method therefor. The LED package includes first and second lead frames made of heat and electric conductors, each of the lead frames comprising a planar base and extensions extending in opposed directions and upward directions from the base. The package also includes a package body made of a resin and configured to surround the extensions of the first and second lead frames to fix the first and second lead frames while exposing underside surfaces of the first and second lead frames. The LED package further includes a light emitting diode chip disposed on an upper surface of the base of the first lead frame and electrically connected to the bases of the first and second lead frames, and a transparent encapsulant for encapsulating the light emitting diode chip.

Description

CLAIM OF PRIORITY[0001]This application claims the benefit of Korean Patent Application No. 2006-0034706 filed on Apr. 17, 2006, in the Korean Intellectual Property Office, the disclosure of which is incorporated herein by reference.BACKGROUND OF THE INVENTION[0002]1. Field of the Invention[0003]The present invention relates to a Light Emitting Diode (LED) and, more particularly, to an LED package having a simple configuration with superior heat radiation efficiency, and a fabrication method thereof.[0004]2. Description of the Related Art[0005]A light emitting diode (LED) is a semiconductor device for generating various colors of light in response to current application. The colors generated from the LED are determined by the chemical substances constituting the semiconductor of the LED. Such an LED has various merits such as a long lifetime, low power, excellent initial driving characteristics, high resistance for vibration and high tolerance for frequent power on / off compared to a...

AI Technical Summary

Benefits of technology

[0015]The present invention has been made to solve the foregoing problems of the prior art and therefore an aspect of the present invention is to provide an LED package which can achieve superior heat radiation efficiency with a simple configuration.

[0016]Another aspect of the invention is to provide a method of fabricating an LED package which can achieve superior heat radiation efficiency.

Problems solved by technology

However, this conventional heat radiation structure is complicated and requires many components.

Therefore, it is difficult to automate the manufacturing process of the LED package with assembly of many components, thus increasing the manufacturing time and costs.

However, the heat generated from the LED chip 4 is transferred to a circuit board 10 (not shown in FIG. 3, see FIG. 2) via a heat radiation path H, thus resulting in low heat radiation efficiency.

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