This invention discloses a thick-film power
discharge resistor for automotive applications and its
processing equipment, relating to the field of
resistor processing technology. The
resistor comprises an insulating substrate, a thick-film
electrode layer, a thick-film resistor layer, an insulating pad, leads, a
silicone layer, a shell, and an encapsulation layer. The thick-film
electrode layer is printed on the upper surface of the insulating substrate and consists of input and output electrodes. The thick-film resistor layer is also printed on the upper surface of the insulating substrate and connects the two ends of the thick-film
electrode layer. A thick-film protective layer is printed on the upper surface of the insulating substrate, covering the resistor layer. The insulating pad is bonded to the surface of the insulating substrate. Using thick-film power resistor technology, a
ceramic substrate is directly used as the bottom surface. Because the resistor element is printed on the
ceramic surface, the resistor generates a large amount of heat during operation. The
ceramic substrate directly contacts the
heat sink, which can quickly conduct away the heat generated during operation, allowing the resistor to achieve greater continuous power.