The utility model relates to the technical field of light-emitting
diode (LED) lighting, and discloses a surface-mounted
LED lamp bead substrate heat dissipation mechanism which comprises a stepped
metal substrate, heat dissipation fin sets are evenly and fixedly installed at the lower end of the side wall of the stepped
metal substrate, and the stepped
metal substrate comprises an aluminum
alloy heat dissipation base body. The side wall of the aluminum
alloy heat dissipation base body is fixedly connected with the outer wall of the heat dissipation fin set, the top of the aluminum
alloy heat dissipation base body is evenly provided with step boss assemblies, the top of each step boss
assembly is fixedly provided with an insulating layer, and the top of each insulating layer is fixedly provided with a
copper circuit layer. The heat dissipation area is increased, the heat dissipation efficiency is effectively improved, the heat accumulation problem is avoided, stable operation of the high-power-density LED is ensured, meanwhile, due to the design of the stepped
metal substrate, the heat dissipation fin sets can be attached more tightly, interface
thermal resistance is reduced, and the heat dissipation performance is further improved.