460 results about "Wire resistance" patented technology

The present invention provides a semiconductor device which can prevent a current from flowing into a display element at a signal writing operation, without increasing power consumption and without changing a potential of a power supply for supplying a current to a load in each row. When a predetermined current is supplied to a transistor to set a gate-source voltage of the transistor, a potential of a gate terminal of the transistor is adjusted so as to prevent a current from flowing into a load which is connected to a source terminal of the transistor. Thus, a potential of a wire connected to the gate terminal of the transistor is made different from that of a wire connected to a drain terminal of the transistor. At that time, an operation of a transistor is shifted so as to allow a large amount of current to flow, and influences by intersection capacitance parasitic to a wire or the like or wire resistance are hardly caused, and a set operation is conducted quickly.

A semiconductor package includes a wiring substrate, a semiconductor chip, and a conductor plate in order to reduce a voltage drop at the central portion of a chip caused by wiring resistance from a peripheral connection pad disposed on the periphery of the chip in the semiconductor package. Central electrode pads for use in ground/power-supply are disposed on the central portion of the chip. The conductor plate for use in ground/power-supply is disposed on the chip such that an insulating layer is disposed therebetween. The central electrode pads on the chip and the conductor plate are connected together by wire bonding through an opening formed in the insulating layer and the conductor plate. An extraction portion of the conductor plate is connected to a power-supply wiring pad on the wiring substrate. The central electrode pads and the conductor plate may also be connected together using gold stud bumps. Preferably, the conductor plate is composed of a multilayer structure of two or more layers, and each conductor plate is used in power-supply wiring or ground wiring.

An antitheft sensor system includes a covering which is placed around an object to be protected (such as a cable). Sensor wires are located in the covering. Signals are sent through the sensor wires and the wires are monitored for changes in the signals (such as changes in wire resistance) that may indicate theft or tampering. The system allows determination of theft or tampering of objects which may be operated only infrequently, such as conductors bridging rails.

A high-reliability power composite integrated semiconductor device uses thick copper electrodes as current collecting electrodes of a power device portion to resist wire resistance needed for reducing ON-resistance. Furthermore, wire bonding connection of the copper electrodes is secured, and also the time-lapse degradation under high temperature which causes diffusion of copper and corrosion of copper is suppressed. Still furthermore, direct bonding connection can be established to current collecting electrodes in the power device portion, and also established to a bonding pad formed on the control circuit portion in the control circuit portion. A pad area at the device peripheral portion which has been hitherto needed is reduced, so that the area of the device is saved, and the manufacturing cost is reduced.

Methods and apparatuses for transient analyses of a circuit using a hierarchical approach. In one embodiment, the cells are grouped locally on the power supply network according to average power dissipation. A time varying current of each cell group is estimated using a probabilistic approach to represent the cell group so that the probability of a more severe waveform for the current of the cell group is under a certain level. For example, the cells in a group are partitioned as switching cells and non-switching cells using cell toggle rates for the determination of the time varying current. The circuit model of the power supply network includes the current sources according to the estimated time varying currents for the cell groups, the power supply wire resistance, the power supply to ground wire capacitance, well capacitance and the de-coupling capacitance from non-switching cells.

A conductivity detector detects the electrical conductivity of a fluid under analysis for determining chemical or physical properties of the fluid that are related its electrical properties. Such conductivity detectors may find use in, for example, hemodialysis systems for analyzing the effectiveness of the hemodialysis treatment. In an aspect, to improve accuracy of the conductivity measurements, the detector utilizes four-wire resistance measurement methods. In another aspect, to avoid fouling or contamination of the electrodes, the detector utilizes capacitively-coupled contactless conductivity detection (C4D) methods so that the electrodes are physically unconnected to the fluid contained in a fluid chamber. In a possible further aspect, the fluid chamber may be a disposable component removable from the electrodes. The conductivity detector can include other features such as calibration circuits and features for electrically isolating the fluid under detection from the fluid in the rest of the system.

A work-table is described, comprising a frame (2) which is especially adjustable with respect to its height and for whose adjustment there is provided at least one electric motor (4) with a control device (6) acting upon an actuating drive (5). In order to provide advantageous constructional conditions it is proposed that at least one load-dissipating part (13) of the frame (2) is provided with a wire resistance strain gauge (12) or is supported on a force transducer (11), and that the wire resistance strain gauge (12) or the force transducer (11) triggers the control device (6) for the motor (4) depending on the loading of the load-dissipating part (13).

A wire load estimating method comprises (1) reading a netlist; (2) generating connection information including the names of signals, the identification names and the names of pins of instances which include cells, macro blocks and synthesized blocks as described in the netlist; (3) dividing an area of a chip into two or more regions and determining connection point coordinates for each of the regions by the use of the connection information and locations of the instances as placed; (4) determining a wiring path by the use of the connection point coordinates; and (5) estimating a wire capacitance value and a wire resistance value with reference to the wiring path.

The invention discloses a three-dimensional fluid stress sensor based on a flexible MEMS (microelectromechanical system) technology and an array thereof. The three-dimensional fluid stress sensor based on the flexible MEMS technology comprises a capacitive pressure stress sensor and a hot shearing stress sensor, wherein the capacitive pressure stress sensor comprises an upper electrode plate in an upper electrode layer, a pressure stress-sensitive film, and a lower electrode plate in a lower electrode layer; a cavity structure of the pressure stress sensor is formed in a supporting structurallayer; the hot shearing stress sensor consists of four groups of double hot-wire resistors which are in a square arrangement; and a hot-wire resistance signal is led from a flexible substrate into a detection circuit through a wire leading post. The three-dimensional fluid stress sensor is based on a flexible substrate technology and a back wire leading technology, and adopts an MEMS processing technology and a bonding technology; the magnitude of the pressure stress of a fluid is measured through the change of a capacitive signal; the magnitude and the direction of a two-dimensional shearingstress within a plane are measured through the change of the double hot-wire resistance; the capacitive signal and a shearing stress signal are led into the detection circuit and do not interfere with each other; and the three-dimensional fluid stress sensor based on the flexible MEMS technology has the advantages of relatively high resolution, small volume, and batch processing at low cost.

An object is to reduce degradation of display quality due to variation in luminance of light-emitting elements, which is caused by variation in voltage because of wiring resistance of current supply lines, and to improve the display quality. In a voltage program period, a terminal serving as a source of a transistor for driving an EL element is electrically connected to a first wiring to which a first potential is supplied. In a light-emitting period, the terminal serving as the source of the driving transistor is electrically connected to a second wiring to which a second potential is supplied. Accordingly, voltage between a gate terminal and the source terminal of the driving transistor can be held without being adversely affected by wiring resistance of the current supply lines.

The instant invention describes a resistant-type device, adaptable for use in exercise, utilizing a resistance cable constructed of multiple layers of resistance and protection. The resistance cable has a resilient inner core having a plurality of elastic members arranged in a substantially parallel manner. The plurality of elastic members are interlaced together to form a unitary stretchable main body unit, a first elastic looped portion positioned at a first end, and a second elastic looped portion positioned at a second end. In addition to the inner resilient core, resistance cable also contains at least one outer member and a protective layer coaxially aligned with the inner core. The outer member length is substantially coextensive with the length of the elastic inner core unitary stretchable main body unit. The device therefore, provides for the extension of the unitary stretchable main body unit from a first resting position to a second extended position upon application of a pulling force, whereby resistance to stretching of the unitary stretchable main body unit when extended from the first resting position to the second extended position upon application of the pulling force is greater than the resistance of each of the plurality of elastic members individually.

The invention discloses a self-verification automatic test system, a device and a method for on-resistance. The system comprises program-controlled multi-channel selectors, a connecting cable, a self-verification component, a digital multimeter and a control module, wherein the program-controlled multi-channel selectors are used for controlling opening or closing of channels by turning on or off a switch; the connecting cable comprises an A end, a B end and a C end; the self-verification component is used for verifying the on-resistance of a tooling; the digital multimeter is used for sending a measured value of the on-resistance of the tooling and a measured value of the on-resistance of tested equipment to the control module; the digital multimeter is set in a four-wire resistance measurement mode by the control module; the control module controls the program-controlled multi-channel selectors to change the channels, starts testing the on-resistance of the tooling and receives the measured value of the on-resistance of the tooling sent by the digital multimeter; the control module controls the program-controlled multi-channel selectors to change the channels, starts testing the on-resistance of the tested equipment, and receives the measured value of the on-resistance of the tested equipment sent by the digital multimeter; and finally a true value of the on-resistance of the tested equipment is obtained.

A detection module and remote load voltage sensor determine a location of a parallel arc for a power circuit between a power source and a load in real time. The detection module provides a value of voltage from the power source. A current sensor measures a value of current flowing in the power circuit to or from the power source. The remote load voltage sensor measures a value of voltage at the load. A microprocessor determines the parallel arc location from the value of voltage from the power source, the value of current, the value of voltage at the load, and a wire resistance or conductance per unit length of the power circuit. In one case, connector resistance is accounted for. In another case, the load voltage is encoded at a predetermined frequency using a switched precision resistor near the load, thereby providing a power line carrier type communication.

The invention provides low-temperature polymer conductive paste and a preparation method thereof. The low-temperature polymer conductive paste comprises conductive filler and carrier adhesives for carrying the conductive filler, wherein the carrier adhesives comprise functional resin including phenoxy resin and fluorine resin. The low-temperature polymer conductive paste has the advantages that a mixed resin system is adopted, wherein the phenoxy resin has excellent carrying capacity for the conductive filler and is good in adhesion force, and the fluorine resin is excellent in conductive filler dispersing performance, has low surface energy and is good in base material wetting performance and high in flexibility, therefore, high filling for conductive powder can be achieved, wetting and dispersing the conductive powder are also benefited, and further, achievement of high conductivity, low wire resistance, low contact resistance, good adhesion force and high weatherability after the paste is cured are facilitated.

A high temperature sensor allowing for accurate measurement including wires running through an oxygen ion conductor and connecting to electrodes sandwiching an oxygen ion conductor substrate having an electrical resistance far smaller than the combined resistance (Rpvs) appearing across the lead wires, where Rpvs is determined by way of a pulse voltage sensing method applied across the electrodes. In the case of a two cavity sensor for NOx measurement, Rpvs is not less than 2.6 times greater, or more preferably 4 times greater than the resistance of the wires. In another embodiment, a common internal oxygen reference source cavity is formed inside the oxygen ion conductor so as to provide the same oxygen partial pressure base for other cavities.

The invention discloses a screen positioning algorithm of a four-wire resistance type touch screen, comprising the steps of S1, initial generation of matching proportional factors in fixed point calibration; S2, dynamic modification of the matching proportional factors in the use process of a user; S3, coordinate transformation from touch point to display pixel point; and S4, software code realization of the algorithm. The invention realizes a specific software algorithm that a click point for clicking the touch screen and a display area on a display screen can correctly and correlatively match.

Immediately after formation of, for example, power supply lines formed on a same substrate and set to a same potential, defect examination is applied and a repair line is formed connecting deficient defect (disconnection) portion of the power supply line, directly covering the power supply line. The repair line can be formed through a drawing process by scanning with a laser beam within a gas atomospshere of a conductive material such as, for example, tungsten, to connect ends of the disconnection. By repairing the power supply line by directly covering the power supply line, an increase in a line resistance is inhibited and flatness above the repair line is further improved.

A semiconductor integrated circuit is provided, which has an improved withstanding voltage for electrostatic breakdown at the time of electrostatic discharge by the charged device model, in the case of protecting a MOS capacitor provided at the input side of the internal circuit. The semiconductor integrated circuit comprises an internal circuit 20 for inputting an external signal, an internal circuit MOS capacitor 16, one end of which is connected to a power source wire 10 for supplying the source voltage and the other end of which is connected to a ground potential wire 12 for supplying the ground potential; a ground terminal 14 to which one end of the ground potential wire is connected; an electrostatic protection element 18 connected in parallel with the MOS capacitor 16 between the ground terminal 14 and the MOS capacitor, wherein the MOS capacitor and the electrostatic protection element are connected between the power source wire and the ground potential wire such that the wire resistance R1 of the ground potential wire between the ground terminal and the connection point with one end of the electrostatic protection element is larger than the wire resistance R2 of the ground potential wire between the connection point with one end of the electrostatic protection element and the connection point with one end of the MOS capacitor.

An ink jet head circuit board is provided which has heaters to generate thermal energy for ejecting ink as they are energized. This circuit board is so constructed as to reduce wire resistances for the heaters while at the same time preventing an increase in the size of the board and realizing a high-density integration of the heaters required for high resolution printing. This construction is made possible by forming electrode wires of first and second electrode wire layers to reduce an area that the wire patterns for the heater occupy on the circuit board. In reducing the effective thickness of protective insulation layer formed on the heater to prevent a possible degradation of thermal efficiency, one of the protective insulation layers over the electrode wires is removed from the heater, depending on the thickness of the electrode wires.