This invention provides a lateral double-diffused field-effect
transistor, its fabrication method,
chip, and circuit, relating to the field of
semiconductor technology. The
transistor includes: a base substrate; a first
transistor and a second transistor having the same
carrier type, the first transistor being formed downwards on the back side of the base substrate, and the second transistor being formed upwards on the front side of the base substrate; and an intermediate sandwich structure formed laterally between a first
body region and a first drift region and vertically between the first transistor and the second transistor. The intermediate sandwich structure, from bottom to top, includes a first
oxide layer, an intermediate polysilicon layer, and a second
oxide layer. The intermediate sandwich structure includes a first sandwich structure formed between the two
body regions and part of the drift region, and a second sandwich structure formed between the remaining drift regions. The second sandwich structure serves as a third field plate for the first transistor and a fourth field plate for the second transistor. This invention can improve the transistor's operating current, reduce the transistor area, and improve the
breakdown voltage.