5725results about How to "Increase cooling area" patented technology

The invention discloses an LED (Light Emitting Diode) lamp tube, which comprises a glass tube, lamp caps arranged at two ends of the glass tube as well as an LED lamp strip arranged in the glass tube, wherein the inner wall of the glass tube is coated with a light increasing and heat radiating film; and the LED lamp strip is fixedly adhered to the inner wall of the glass tube through a high heat conduction bonding adhesive. The light increasing and heat radiating film is an aluminum-coated layer, or a frosted heat conduction light increasing adhesive layer or a nano adhesive layer capable of increasing light and radiating heat. The LED lamp strip comprises a substrate, wherein a plurality of LED light sources are welded on the substrate, or an integrated light source consisting of an LED chip is packaged on the substrate; and a driving power supply module is also arranged on the LED lamp strip. According to the LED lamp tube disclosed by the invention, the light emitting efficiency, the light emitting angle and the illumination area of the LED lamp tube are increased; the problems of glare and point light existing in the LED lamp tube are solved; heat generated by an LED is transmitted to the whole glass tube through the substrate of the LED, so that the heat radiating area is greatly increased and the heat increasing speed of the LED lamp tube is increased; the LED lamp tube can be applied to a lamp holder of a traditional fluorescent lamp, and thus the generality of the LED lamp tube is greatly improved; and the replacement and use costs are reduced.

The present invention relates to an improved heat radiating device for lamp, comprising an exhaust space configured around the periphery of lamp stand, an exhaust fan disposed at the top of exhaust space, and simultaneously a radiator and a plurality of heat conductors at the back of the printed circuit board of a light emitting diode (LED) lamp set where the heat conductors extend to the peripheral inner wall of lamp stand in the exhaust space. Through such a radiating device, high heat generated by the LED lamp set can be dissipated through the radiator and through the plurality of heat conductors to the periphery of lamp stand in the exhaust space, thereby enlarging the heat dissipation area. In addition, through the exhaust fan disposed at the top of the exhaust space, ventilation can take place continuously to let the heat in the exhaust space be vented rapidly, thereby achieving fast heat dissipation and prolonging the service life of LED lamp.

The present invention is a symmetrical heat sink module with a heat pipe for spreading of heat, comprising a first and a second sets of fins each with a first and a second heat dissipation areas where the first and the second heat dissipation areas each comprises corresponding concave parts; a curved heat pipe between the concave parts with the bottom being convex out of the bottom of the first and the second sets of fins; and a base at the convex bottom of the curved heat pipe. Accordingly, the first and the second sets of fins are corresponding to each other so that the heat sink module obtains larger heat dissipation area and the function of two-side dissipation to achieve better heat dissipation efficiency.

An arrangement of radiators (2–6) for a utility vehicle, e.g., an agricultural tractor, comprising three or more cooling radiators which together define a chamber (7), optionally with some of the walls formed by perforated plates instead of radiator elements. One of the radiator elements may be pivotally mounted with respect to the others to provide access to the chamber. The arrangement of radiators may be mounted on a common support (1).

The present invention discloses an LED streetlight structure, which comprises: a heat-conduction pipe frame, an upper casing, a lower casing, a light concentration plate, and a transparent cover. The upper and lower casings are made of a plastic material and pivotally coupled to each other. The heat-conduction pipe frame has a heat-dissipation seat with main heat-dissipation fins. Two stabilizer boxes with fins are respectively arranged at two sides of the heat-dissipation seat. Heat-dissipation lamp sets insert through the bottom of the heat-dissipation seat. The present invention installs the main heat-dissipation fins on heat-conduction pipe frame and installs the fins on the stabilizer boxes to increase heat-dissipation area. Further, an auxiliary heat-dissipation ventilation device is arranged above the heat-conduction pipe frame and made of aluminum, and aluminum itself benefits heat dissipation. Furthermore, air can be compulsively conducted to the main heat-dissipation fins, then can enhance the dissipation effect.

A cooling device includes a cooling panel wherein a passage is formed by bonding together a bottom heat radiation plate having a groove formed therein and a top heat radiation plate, and a circulation pump circulating refrigerant within the passage. The top heat radiation plate is provided with an outlet port through which the refrigerant flows out from the passage to the circulation pump and an inlet port through which the refrigerant flows in from the circulation pump to the passage. The circulation pump is fixed onto the top heat radiation plate of the cooling panel so that the suction port and discharge port are aligned with the outlet port and inlet port, respectively.

An LED illumination device includes a lampshade and a light engine arranged on the lampshade. The lampshade defines a room therein. The light engine includes a heat dissipation member, and a plurality of LEDs arranged on the heat dissipation member and received in the room of the lampshade. The heat dissipation member includes a heat pipe and a heat sink. The heat pipe forms a planar absorbing surface and a dissipating surface opposite to the absorbing surface. The absorbing surface of the heat pipe attaches to the LEDs to absorb heat therefrom. The heat sink includes a base attaching to the dissipating surface of the heat pipe to absorb heat of the heat pipe, and a plurality of fins extending from the base for dissipating heat absorbed from the heat pipe.

A LED lamp includes at least one LED unit, a thermally-conductive post, a heat-dissipating module, at least one metal base, at least one cover member, at least one light reflection member, a sheath, a foundation, and a printed circuit board (PCB). The heat-dissipating module is provided with a plurality of heat sinks, each of which has one end serially connected to each other and radially arranged on an outer periphery of the thermally-conductive post, and the other end apart from each other, so as to constitute the heat-dissipating module. The sheath is used to surround and position the heat sinks, so that the heat sinks are confined. The LED unit is mounted on the metal base, which is received in a step portion formed on a central portion of each of the heat sinks. The light reflection member is provided with a curved focusing portion for focusing a light source projected by the LED unit following by outputting the light source via the cover member. The heat generated by the LED unit can be dissipated to the thermally-conductive post via the metal base, and then the heat will be dissipated from the thermally-conductive post to the heat-dissipating module constructed from the heat sinks that are in contact with the thermally-conductive post, so as to dissipate the heat to the atmosphere.

A heat dissipation system includes a heat sink, a heat pipe, and a cooling assembly. The heat sink includes a substrate and a number of fins extending therefrom. The heat sink has a receiving portion. The heat pipe includes a shell, a wick, and a working fluid contained in the shell. The heat pipe has an evaporation section and a condensation section. The evaporation section is inserted into the receiving portion of the substrate while the condensation section is equipped with the cooling assembly. A hydrophilic layer is formed on the wick so that the capillarity of the wick is enhanced. The heat dissipation system has two mechanisms by which to dissipate heat from a heat-generating component, i.e., via the heat sink and the heat pipe. Therefore, an efficiency of heat dissipation of the heat dissipation system is improved.

An LED lamp includes a post (10), a heat sink (20) enclosing the post, an LED module (30) mounted on the post, a holder (40) secured on the LED module, and a lens (50) covering the holder. The heat sink is formed by a plurality of separated fins assembled together. Each fin comprises an outer portion (22) and an inner portion (24). An inner edge of the outer portion abuts interferingly against a periphery of the post, and a bottom of the inner portion contacts a top surface of the post. Heat generated by the LED module is conducted through the post to the plurality of fins, which dissipate the heat to the ambient air.

The present invention provides a heat sink device for the package device to improve the heat dissipating efficiency. The heat sink device includes a first heat sink assembly and a second heat sink assembly. The first heat sink assembly has a first heat dissipating structure, a second heat dissipating structure positioned above first the heat dissipating structure, at least two thermal supports on the backside of the first heat sink assembly and a thermal block on the backside of the first heat sink assembly. The second heat sink assembly has a protruding structure and at least the openings. The first heat sink assembly is fixed with the second heat sink assembly to form a heat sink device by the combination of the thermal supports and the openings. The first heat sink assembly and the second heat sink assembly are attached to the integrated circuit device separately by the thermal block and the protruding structure. This heat sink device provides several heat dissipating pathes by the second heat dissipating structure, the thermal supports, the thermal block, and protruding structure. Therefore, the heat dissipation efficiency of the heat sink device is improved.

The invention discloses a lithium-ion battery with high rate discharge performance. The lithium-ion battery comprises a cover, a battery core in the cover, an upper cover plate, and a lower cover plate, wherein the battery core is prepared either by winding or laminating a positive pole piece with a positive pole ear, a negative pole piece with a negative pole ear and a diaphragm. The lithium-ion battery is characterized in that a positive pole piece clamping mechanism and a negative pole piece clamping mechanism are also arranged; the positive pole ear is packed and fixed inside of the positive pole piece clamping mechanism and a positive pole stud is arranged on the outside of the positive pole piece clamping mechanism and is in detachable connection with the upper cover plate; the negative pole ear is packed and fixed inside of the negative pole piece clamping mechanism and a negative pole stud is arranged on the outside of the negative pole piece clamping mechanism and is in detachable connection with the lower cover plate. The lithium-ion battery is particularly applicable to the fields of electrical motorcycles, electrical taxies and electrical buses, and the like, and can meet the requirements for high rate discharge performance of batteries when the vehicles are in the bad circumstances such as climbing, instantaneous starting and instantaneous accelerating.

An LED lamp includes at least an LED unit, a heat-dissipating module, a substrate, a power module, a base, and a thermally insulating panel. The heat-dissipating module includes a plurality of cooling fins arranged radially, spaced apart from each other, and connected annularly. The LED unit is disposed on and coupled to the substrate. The substrate is disposed above the heat-dissipating module. The base is a hollow casing for accommodating the power module and the thermally insulating panel, and is coupled to the heat-dissipating module. The thermally insulating panel is inserted into a groove disposed on an inner edge of the base and positioned between the heat-dissipating module and the power module. The thermally insulating panel is spaced apart from the heat-dissipating module by an air-filled gap of a preset distance to insulate the heat generated by the LED unit and further protect the power module.

An LED lighting apparatus dissipating heat by fanless ventilation including a heat radiation housing that has a heat radiation frame provided around the body of the heat radiation housing and spaced apart from the body and also has linear heat radiation fins configured to minimize interference to air flow and to maximize the heat radiation area, thereby expanding the heat radiation area significantly and thus dissipating heat much more effectively through ventilation by natural convection without a blowing fan, and consequently, extending the life span of the LED lighting apparatus and improving its quality. The LED lighting apparatus comprises a light source part including at least one LED and a PCB used to mount the LED; and a heat radiation housing provided at the upper portion thereof with a terminal part, receiving and supporting the light source part and dissipating heat.

A heat dissipating module embedded into an LED lamp house for dissipating heat of an LED light emitting element includes two flat heat pipes, a heat dissipating body and a conducting base. The heat dissipating body includes a cylindrical pillar, heat sinks radially formed around the cylindrical pillar, two longitudinal through grooves at the cylindrical pillar for passing a condensation section of the flat heat pipe. The conducting base includes corresponding first and second surfaces, and the first surface is attached to an evaporation section of the flat heat pipe, and the second surface is attached to the LED light emitting element. The conducting base perpendicular to an axis of the cylindrical pillar includes an embedding slot for embedding the heat dissipating module into an internal wall of the lamp house, such that the heat dissipating module can quickly dissipate the heat generated by the LED light emitting element.

An LED light bulb includes a heat conductive post coupled with a plurality of LED circuit boards. The LED circuit boards are electrically connected to a first current converged board and a second current converged board. The first and second current converged boards also are connected respectively to a first conductive wire and a second conductive wire to converge current of the LED circuit boards. The heat conductive post further is connected to a heat sink which has a wiring aperture threaded through by the first and second conductive wires and a coupling portion coupled with a lampshade. The invention also includes an electric connection structure coupled with the heat sink in an insulation manner. The electric connection structure is electrically connected to the first and second conductive wires and connected to a power source to supply electric power through the first and second conductive wires.

An LED illumination device includes a lamp housing, a heat sink, a cooling fan, and a light source. The heat sink, the cooling fan and the light source are received in the lamp housing. The heat sink includes a base and a plurality of fins extending from the base. The light source is attached to the base of the heat sink. The cooling fan causes ambient air to enter into the lamp housing and flow through the heat sink. A plurality of air-disturbing plates extends from the lamp housing towards the heat sink. The air-disturbing plates disturb the air in the lamp housing and guide the disturbed air into air passageways defined between adjacent fins of the heat sink.

A heat conductive plate includes a hollow case and a plurality of grooves respectively formed on the inner top wall and the inner bottom wall of the case. In addition, a plurality of supporting members are positioned in the case by way of powder sintering, wherein each surface of the supporting members has a porous wick structure formed thereon. Thus, the case can be sustained by the supports with each wick structure firmly mounted in the grooves of the inner walls thereof. When performing heat transferring, the working fluid is heated to be formed as vapor by the electronic element mounted on the outer bottom surface so as to flow toward the inner top surface of the case. The working fluid is then cooled to be liquid again to be absorbed by the wick structures of the supporting members and be transported toward the inner bottom of the case.

The instant disclosure relates to a light bulb, which includes a base, a conducting cap arranged on one end of the base, a heat-dissipating member disposed on the opposite end of the base, and a lamp cover. The heat-dissipating member has a wedged structure, and a plurality of inclined surfaces are formed adjacently thereon. A plurality of LEDs is disposed on the inclined surfaces, and the lamp cover is arranged over the wedged structure and the LEDs. The instant disclosure uses the LEDs to replace tungsten filament as the light sources, and arranging the LEDs on the wedged structure of the heat-dissipating member. Thereby, the light bulb can have higher heat-dissipating rate.

An LED illumination device includes a lamp housing, a heat sink, a cooling fan, and a light source. The heat sink, the cooling fan and the light source are received in the lamp housing. The heat sink includes a base and a plurality of fins extending from the base. The light source is attached to the base of the heat sink. The cooling fan causes ambient air to enter into the lamp housing and flow through the heat sink. A plurality of air-disturbing plates extends from the lamp housing towards the heat sink. The air-disturbing plates disturb the air in the lamp housing and guide the disturbed air into air passageways defined between adjacent fins of the heat sink.

A heat dissipating device assembly includes a heat receiver, a heat sink defining two opposite ends and a plurality of channels formed between the two opposite ends, a fin member cooperating with the heat receiver to enclose the heat sink except the two opposite ends, a plurality of heat pipes connecting the heat receiver with the fin member, and a fan provided adjacent one of the two opposite ends for creating airflow to flow through the channels of the heat sink. The fin member includes a plurality of fins formed at the outer surface thereof for increasing heat dissipating surface of the heat dissipating device assembly.

A heat sink assembly includes a heat sink (10), a mounting frame (20) for mounting the heat sink to an electronic component (60), and a grease cover (40). The heat sink includes a base (12) on which thermal grease (16) is spread. The mounting frame includes a body (22) defining an opening (24) for extension of the electronic component therethrough to contact the base. The body includes longitudinal and lateral beams (25, 27) surrounding the electronic component. A plurality of fasteners (26) is formed on the longitudinal beams and engaged in cutouts (16) defined in the base, respectively. The grease cover is detachably attached to the mounting frame, and includes a main portion (42) covering the opening of the mounting frame and the thermal grease, and an ear (44) extending from the main portion beyond one border of the mounting frame for facilitating operation of the grease cover.

The invention discloses a direct illumination-type backlight module using the LED light source. The direct illumination-type backlight module comprises a backplate; a plurality of LED light sources adhesive to the backplate; a printed circuit board above the backplate and electrically connected with the LED light source and provided with an opening for the LED light source at the corresponding position of the LED light source; a reflection piece above the printed circuit board and provided with an opening for the LED light source at the corresponding position of the LED light source; a guide light device comprising a bottom and a light extraction face on the reflection piece and provided with a column groove at the corresponding position of the LED light source at the bottom, wherein the groove bottom of the column groove is of conoid and is coated with the reflection material. The direct illumination-type backlight module is favourable to the ultra thinning processe of the liquid crystal display device with good heat emission effect.

The embodiment of the invention discloses an LED (light emitting diode) fluorescent lamp which comprises a fluorescent lamp tube, fluorescent lamp end covers and a constant current source circuit, wherein the fluorescent lamp end covers are installed at two ends of the fluorescent lamp tube; the constant current source circuit is connected between an LED lamp bank in the fluorescent lamp tube and the metal needles of the end covers, and is used for supplying electricity for the LED lamp bank. The LED fluorescent lamp is characterized in that the fluorescent lamp tube comprises a tube body; the tube body is composed of an arc-shaped metal sectional material and a transmitting lamp cover which is arranged above the metal sectional material; the part, which is positioned at the inner side of the tube body, of the metal sectional material is provided with a clamping groove; a flexible PCB (printed circuit board) which has bending radian same as that of the metal sectional material is buckled on the clamping groove; and the LED lamp bank is welded on the flexible PCB. The LED fluorescent lamp has good radiation performance, and the secondary grading effect of the LED is good.

A heat dissipating structure of an LED circuit board and a device applied in an LED tube which comprises an LED circuit board having a plurality of soldering points. The soldering points of the LED circuit board are covered a coating layer including Nanoparticles and a bonding agent. Accommodating the LED circuit board covering the coating layer in an LED lamp tube to accelerate dissipating the heat of the LED circuit board by the coating layer having the characters of high emitting rate, temperature resistance, and conductivity insulation. On the other hand, for the coating layer can increase the contacting areas of the soldering points with the air to enlarge the heat dissipation area of the LED circuit board to accelerate dissipating the heat.

The invention discloses a production method of a fine-denier porous POY black yarn. The method comprises the following steps of: drying semi-dull slices, drying black masterbatch, adding the slices and the black masterbatch material into a screw extruder, fusing the added materials in the screw extruder, respectively processing the fused materials in a metering pump and a spinning beam, spinning on a pack, cooling the materials by lateral blowing, applying oil on strands, processing the strands in draw-off godets GR1 and GR2, winding and shaping, and inspecting products. The method is characterized in that the step of drying the black masterbatch comprises the following sub-steps of: based on a continuous drying mode, firstly, adding the black masterbatch into a crystallization and drying tank, introducing heated dry air from the lower part of the crystallization and drying tank, and blowing out the heated dry air from the top of the crystallization and drying tank so as to dry the black masterbatch, wherein the drying time is 2 hours, the dried black masterbatch falls into an intermediate material storage bin for storage under the crystallization and drying tank, and the black masterbatch is further injected by a masterbatch injector under the intermediate material storage bin. The production method of the fine-denier porous POY black yarn has high masterbatch spinnability and better cooling effect, and can improve the oil application uniformity of spinning cakes and the productivity.

A heat sink includes a base and a plurality of spaced parallel fins arranged on the base. Adjacent fins define a plurality of passages there between. Each passage includes an inlet and at least one outlet. The base and the fins made separately, and the fins is thin, such that amount of the fins arranged on the base increases. And the fins are disposed on the base alternately or / and staggered such that the inlet and the outlet are wider than a middle part of the passage to lower airflow resistance thereat. Thus, the heat sink has large heat dissipating area and low airflow resistance synchronously.