The present invention relates to a method for preparing a large-angle light-emitting
light source, a surface
light source module and a light-emitting
light source, wherein the large-angle light-emitting light source comprises an LED
chip, the LED
chip is a flip-
chip structure, the LED chip comprises a P-GaN layer, a light-emitting layer, an N-GaN layer and a substrate arranged in sequence from bottom to top, and a lower reflection layer is arranged on the bottom surface of the LED chip, a
blue light re-excitation layer is arranged on the top surface and the side surface of the LED chip, an upper reflection layer is arranged on the top surface of the
blue light re-excitation layer, the four sides of the
blue light re-excitation layer are full light-emitting areas, and the top surface of the upper reflection layer is a full reflection or
partial reflection area. The advantages of the present invention are: in the present invention, the reflection layer is directly arranged on the top and bottom of the flip-chip LED chip, the light emitted by the LED chip is reflected by the upper reflection layer and the lower reflection layer, so that the light is emitted from the four sides of the LED chip, and large-angle
light emission is achieved; in addition, since the large-angle light-emitting light source of the present invention is a separate
monomer, rather than making the reflection layer on the substrate as a whole, it can be applied to different substrates.