Light-emitting diode (LED) packaging method, packaging device and light adjusting method and system
A technology of LED packaging and LED chips, which is applied to electric solid devices, semiconductor devices, electrical components, etc., can solve the problems of low light conversion rate, lack of light elements, and inability to adjust the brightness, color rendering and color temperature of LED packaging devices.
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[0039] figure 1 For the schematic diagram of the LED packaging device of the embodiment of the present invention, please refer to figure 1 , it can be known that the LED packaging device of the embodiment of the present invention includes: a wafer 1 used as a substrate, an LED chip 2 and an LED chip 3 for generating different light emitting wavelengths when an electric current is applied, and the LED chip 2 and the LED chip 3 The lens layer 4 packaged in the same cavity is used to flip-chip the LED chip 2 and the LED chip 3 onto the flip-chip bump 5 of the wafer 1 .
[0040] figure 2 For the flow chart of the LED packaging method in the embodiment of the present invention, please refer to figure 2 :
[0041] S01, making flip-chip bumps 5 on wafer 1, LED chip 2, and LED chip 3, and flip-chip welding LED chip 2 and LED chip 3 on wafer 1;
[0042] S02 , the lens layer 4 made by molding method encapsulates the LED chips 2 and the LED chips 3 in the same cavity, and fixes the...
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