60 results about "Thermal grease" patented technology

The invention provides high-temperature-resistant heat-conducting silicone grease. The high-temperature-resistant heat-conducting silicone grease comprises the following components in parts by weight: 100 parts of methyl phenyl silicone oil, 300-1000 parts of modified heat-conducting powder and 0.5-3 parts of a heat-resistant additive, wherein the viscosity of the methyl phenyl silicone oil at 25 DEG C is 50-500 mPa.s, and the phenyl content of the methyl phenyl silicone oil is 25-50%. By adding the combination of the methyl phenyl silicone oil and the heat-resistant additive, molecular chain breakage of an organic silicon-based material in a high-temperature environment can be inhibited, so that the durability of the silicone grease is ensured, the service time in the high-temperature environment is longer, and the high-temperature resistance of conventional heat-conducting silicone grease is improved.

To provide a thermally conductive grease composition which has high thermal conductivity, has excellent coatability, and allows a temperature distribution to be visually recognized.SOLUTION: A thermally conductive grease composition containing a base oil, a thermally conductive filler, and a capsule pigment encapsulating a leuco dye, a developer, and a color change temperature regulator.SELECTED DRAWING: None

The present invention relates to an IGBT junction temperature estimation method, specifically a method for calculating the junction temperature of an IGBT module taking into account a heat sink. From an engineering application perspective, the present invention uses finite element simulation results to determine the coupling of the FWD / IGBT chip in the thermal grease layer under different operating conditions for high-power converter IGBT modules with significantly varying operating conditions, and then obtains its mathematical expression. By comprehensively considering the computational resource overhead and accuracy issues of junction temperature estimation, a thermal network mathematical model is proposed that accounts for the loss coupling of the IGBT chip and FWD chip under different operating conditions. This mathematical model has a simple structure and a small amount of computation, and can achieve more accurate real-time response to dynamic changes in IGBT junction temperature in engineering applications.

This invention provides a liquid metal-based thermal grease, its preparation method, and its application. The liquid metal-based thermal grease comprises the following raw materials in parts by weight: 100 parts liquid metal, 2-5 parts silicone oil, 0.1-20 parts thermally conductive powder filler, and 0.1-3 parts other additives. The high-reliability liquid metal-based thermal grease provided by this invention possesses excellent high thermal conductivity, high processability, and high reliability. It can replace traditional thermal grease to solve the heat dissipation and cooling problem of high-power chips, thereby extending the lifespan of electronic products.

The utility model relates to a heat-conducting consumable, in particular to heat-conducting silicone grease which comprises a body, the body is provided with an upper high filler layer and a lower high filler layer, the upper high filler layer is in a square shape, the inner side of the upper high filler layer is filled with a low filler layer, a containing groove is formed in the bottom of the lower high filler layer, and the lower high filler layer is filled with a heat-conducting material. The containing groove is filled with a protective filler layer, a graphene sheet is arranged on the inner side of the protective filler layer, the graphene sheet is attached to the bottom of a low filler layer, and the low filler layer and the protective filler layer are the same in component. The heat-conducting silicone grease has the advantages of being reasonable in design and high in heat-conducting performance, heat in electronic components can be more efficiently conducted out through the graphene sheets inside the heat-conducting silicone grease, the temperature of the electronic components can be reduced, the heat-conducting silicone grease can be evenly spread on the surfaces of the electronic components, the probability that the heat-conducting silicone grease overflows unevenly is reduced, and the heat dissipation performance is guaranteed.

A heater optimized ball valve is provided that includes one or more heat flux components. A heater optimized ball valve may be a modular ball valve including a plurality of end caps secured to a valve body frame having a ball disposed within the frame between at least two of the end caps, where the modular ball valve includes a thermally conductive grease including a mixture of a vacuum grease and a metal alloy powder, the metal alloy powder being thermally conductive to the ball, and the vacuum grease being thermally conductive to the ball. And at least one seal disposed on the top outer diameter surface of the ball and on the inner proximal facing surface of the top end cap, at least partially filling a top gap separating the two surfaces, and disposed on the bottom outer diameter surface of the ball valve and on the distal facing surface of the bottom end cap, at least partially filling a gap separating the two surfaces.

A capacitor with a protective housing, comprising a capacitor body, characterized in that symmetrically arranged connecting pins are fixedly attached to the upper end of the capacitor body on the left and right, a fixed outer housing is movably attached to the outside of the lower end of the capacitor body, a graphitic thermal interface material is fixedly attached to the inside of the fixed outer housing, a limiting seat is fixedly attached to the upper end of the inner base of the graphitic thermal interface material, in which step recesses are formed, a damping pad is fixedly attached to the lower end of the fixed outer housing, thermal grease is firmly applied to both front and rear ends of the fixed outer housing, cooling fins are fixedly attached outside the thermal grease, and an insertion recess is formed at the upper end of the fixed outer housing.A height-adjustable inner housing is movably arranged in the insertion recess, and adjustment grooves and cooling grooves are formed successively from top to bottom at both left and right ends of the fixed outer housing.

An information handling system includes a processor package having a processor die and a first thermal interface material that is deposited on a surface of the processor die. A second thermal interface material is deposited on the surface of the processor die around a periphery of the first thermal interface material and encloses the first thermal interface material.

This utility model discloses an intelligent human-computer interaction terminal, belonging to the field of intelligent terminals. A bottom frame is installed at the lower end of the blackboard, and a front baffle is provided at the front end of the bottom frame. A chalk compartment is formed between the bottom frame and the front baffle. The wall of the chalk compartment is equipped with a cable management conduit, which facilitates the wiring of the terminal. Multiple through slots are opened at the upper end of the bottom frame. The cable management conduit and metal spring clips form channels within the arc-shaped shell, providing an orderly and convenient arrangement and routing path for the wires, avoiding wire clutter and improving the safety and reliability of the layout. The sealed design of the cable management conduit also prevents dust and moisture intrusion, protecting the wires and internal components. The heat dissipation mechanism efficiently conducts heat through heat dissipation fins, heat-conducting blocks, heat-conducting strips, and thermal grease, rapidly dissipating heat from the terminal's heating components. This not only reduces the operating temperature and improves operational stability and service life, but the metal fasteners also ensure the stability and durability of the heat dissipation effect.

The utility model relates to the technical field of thermal grease smearing, in particular to an automatic thermal grease smearing jig which comprises a bottom plate and a U-shaped plate, the U-shaped plate is arranged above the bottom plate, a threaded rod is rotatably connected to the interior of the U-shaped plate, a connecting block is connected to the exterior of the threaded rod in a threaded mode, a scraping plate is fixedly connected to one side of the connecting block, through holes are formed in the scraping plate at equal intervals, and the through holes are communicated with the bottom plate. A transmission groove is formed in one side of the interior of the U-shaped plate, one end of the threaded rod extends into the transmission groove and is fixedly connected with a first bevel gear, and the bottom of the U-shaped plate is fixedly connected with a first motor. The thermal grease smearing device has the advantages that rotation of the threaded rod is achieved through driving of the first motor, then the connecting block and the scraping plate are driven to move, it is ensured that thermal grease is evenly smeared, local overheating can be avoided when the thermal grease is evenly smeared, it is ensured that an electronic device works within the safe temperature range, damage and faults caused by overheating are reduced, and the working efficiency is improved. Compared with a traditional device, the operation quality and the use efficiency are greatly improved.

The utility model provides a tensioning device and a coating device. The tensioning device comprises a frame assembly, the frame assembly comprises a fixed part and a movable part, the movable part is arranged on one side of the fixed part and is adjustably arranged relative to the fixed part, a tensioning area is formed between the movable part and the fixed part, and the size of the tensioning area can be adjusted by adjusting the movable part; the side, away from the movable part, of the fixed part is connected with one side of a to-be-installed piece, and the movable part is used for being connected with the other side of the to-be-installed piece. And the crimping parts are arranged in the circumferential direction of the frame assembly, and a space used for clamping a part to be installed is formed between the crimping parts and the frame assembly. The steel mesh tensioning device solves the problem that the tensioning degree of a steel mesh coated with thermal grease in the prior art cannot be freely adjusted when the steel mesh is used.

This invention provides a server chip fixing device and method, belonging to the field of server hardware installation technology. It includes a base and a heat sink disposed on top of the base. The chip is fixed between the base and the heat sink. The base includes a bottom frame, an upper frame, and at least two guide posts. The bottom frame and the upper frame have through holes for the guide posts, and the guide posts rotate on the bottom frame. The inner diameter of the upper frame is smaller than the inner diameter of the bottom frame. Based on the chip's external structure (the outer diameter of the bottom is larger than the inner diameter of the top protrusion), the chip's periphery is constrained by the wall structure formed by the bottom frame and the upper frame. This invention, through the threaded engagement of the upper sliding post of the guide post and the lower base post, can precisely adjust the distance between the heat sink and the chip, thereby adjusting the clamping force. This avoids excessive clamping force that could damage the chip, and also avoids insufficient clamping force that could lead to a loose fit. Simultaneously, it can adapt to the use of thermal greases of different thicknesses, ensuring effective heat dissipation.

This utility model discloses a high-current connector, which includes a socket and a plug. The plug is provided with conductive terminals, and the socket is provided with conductive posts that accommodate and abut against the conductive terminals. A heat-conducting plate is provided on the outer wall of the socket and plug. Several equally spaced heat dissipation fins are evenly distributed along the circumference of the outer wall of the heat-conducting plate, and several raised heat-conducting parts are provided on the inner wall of the heat-conducting plate. A terminal block is connected to the conductive posts and conductive terminals. The heat generated by the connection between the conductive terminals and conductive posts is efficiently conducted to the heat-conducting plate through thermal grease, and then exchanged with the outside cold air by the heat dissipation fins, effectively controlling the operating temperature. The design of the heat dissipation parts and the heat-conducting grooves increases the contact area of ​​the thermal grease, improving heat conduction efficiency. This structure ensures that the temperature rise is maintained within a safe threshold even in a sealed state, preventing high temperatures from affecting the stability and safety of the equipment.

The present invention relates to a composition comprising one or more filler particles and a first treating agent of Formula 1; and a second treating agent of Formula 2; where R, R1, R2, R3, Y, x, y, and z are defined herein. The composition of the present invention is useful as a non-curable thermal grease that can achieve high thermal conductivities at dispensable and processable viscosities.

The present invention provides a method for preparing a silicon carbide power device based on diamond heat dissipation, which is carried out according to the following steps: step 1, embedding a pin into the interior of a substrate; step 2, applying thermal grease to the interior of the substrate, and the top of the pin is also in contact with the diamond heat-conducting component through the grease; step 3, sequentially installing a bottom diamond heat sink, a middle diamond heat sink, and a top diamond heat sink; step 4, injecting an adhesive into the side of the top diamond heat sink. The preparation method adopts a three-layer diamond heat-conducting component, thereby further improving the efficiency of heat dissipation transferred from the power module to the diamond material. At the same time, it can also be connected to an external heat dissipation device in multiple ways, making the installation more flexible. By introducing the pin part upward and pressing it on the inner boss, the heat generated by each pin part can also be simultaneously discharged outward, thereby improving the heat dissipation effect of the pin part.

This invention provides a thermal grease application tool and an IGBT module installation method using the tool, relating to the field of semiconductor device technology. The thermal grease application tool includes a base, with at least one grease conduit on one side of the base for holding thermal grease. The end of the grease conduit away from the base is open, and the grease conduit corresponds to the location on the IGBT module where thermal grease needs to be applied. An IGBT module installation method using the aforementioned thermal grease application tool is also provided. Based on the technical solution of this invention, thermal grease is applied to the actual required location on the IGBT module, facilitating control of the amount of thermal grease used, maximizing the direct connection area between the IGBT module and the heatsink, effectively reducing thermal resistance, improving the heat dissipation effect of the heatsink on the IGBT module, and extending the service life of the IGBT module.

The present invention relates to a non-curing thermal grease comprising filler particles, boron nitride platelet particles, and trialkoxysilyl-terminated polydimethylsiloxane, which is useful as a thermal interface material in microelectronic devices for transporting heat generated by a heat source to a heat sink.

1. Name of the product in this design: CPU water cooling heatsink assembly (S PRO series). 2. Purpose of this product design: The cold block is installed on the CPU, directly contacting the CPU surface, and effectively conducts the heat generated by the CPU to the inside of the cold block through thermal conductive materials (such as thermal grease). The water pump is integrated inside the cold block, which pumps coolant to circulate between the cold block and the radiator to remove heat. 3. The key design feature of this product is its shape. 4. The image or photograph that best illustrates the design's key points: a 3D model.

The present invention relates to a composition comprising one or more filler particles and a first treatment agent of Formula 1: and a second treatment agent of Formula 2: wherein R, R1, R2, Y, x and n are as defined herein. The composition disclosed by the invention can be used as heat-conducting grease, and can realize the combination of high heat conductivity and heat stability.

The invention provides a method and device for determining the service life of a radar assembly, electronic equipment and a medium, the heat conductivity coefficient of the radar assembly is obtained, the radar assembly comprises a heat dissipation structure, the heat dissipation structure comprises an assembly heat dissipation layer, a heat conduction silicone grease layer and a uniform temperature plate layer, and the heat conduction silicone grease layer comprises a normal area and a dry area. The normal area is an area in which interlayer silicone grease loss does not occur, and the dry area is an area in which interlayer silicone grease loss occurs; determining an interlayer silicone grease loss amount of the radar assembly, and determining a first area corresponding to the dry area according to the interlayer silicone grease loss amount; and obtaining the total area of the heat-conducting silicone grease layer, and determining the remaining use time of the radar assembly according to the first area, the total area and the heat conductivity coefficient. According to the invention, accurate prediction of the service life of the radar assembly is realized.

The utility model provides an anti-overflow cylindrical battery clamp, which belongs to the technical field of batteries and comprises a constraint frame and a clamp heat dissipation assembly arranged on the inner wall of the constraint frame, the clamp heat dissipation assembly comprises a side edge plate, a circulating pipe, a clamping plate, a constraint hole, a heat dissipation groove, a positioning column, a containing groove and a heat conduction block, the positioning column is fixedly arranged on the outer wall of the side edge plate, and the clamping plate is arranged on the side edge plate. The containing groove is formed in one side of the outer wall of the side plate, the heat conduction block is fixedly arranged on the inner wall of the containing groove, the heat dissipation groove is formed in one side of the outer wall of the side plate, and the clamping plates are slidably embedded in the two sides of the inner wall of the restraining frame. By means of the clamp heat dissipation assembly, the battery body can be stably restrained and limited, after heat conduction silicone grease is injected subsequently, it can be ensured that gaps are stably filled with the silicone grease, the problems that due to the gaps, the heat conduction efficiency of the battery is reduced, and heat accumulation is generated finally are solved, the silicone grease is introduced, use of a high-viscosity pouring sealant can be avoided, the pouring time is greatly shortened, and the production efficiency is improved. The production efficiency is improved.

The invention discloses a thermal grease smearing device, thermal grease smearing equipment and an equipment control method. The thermal grease smearing device comprises a thermal grease supplementing module, a workpiece machining area, a coating template mechanism, a blade coating mechanism and a residual grease recycling mechanism which are arranged on a machine table. Wherein the thermal grease supplementing module is used for supplying grease to the coating template mechanism, the coating template mechanism is used for pressing a workpiece to limit a coating area, the blade coating mechanism is used for blade-coating the grease to the surface of the workpiece, and the residual grease recycling mechanism is matched with the blade coating mechanism and is used for scraping residual thermal grease left on the blade coating mechanism after blade coating and recycling the residual thermal grease to the thermal grease supplementing module. And cyclic utilization is realized. According to the scheme, automatic coating and residual paste closed-loop recovery structures are integrated, so that the manual cleaning frequency is reduced, the coating continuity and the material utilization rate are improved, the production efficiency is effectively improved, and the waste of consumables is reduced.

The utility model discloses an integrated controller for rapid heat dissipation of a battery system, which comprises a shell, a plurality of baffles are arranged outside the shell, a plurality of handles are connected outside the baffles in a sliding manner, sliding rods are fixedly connected outside the handles, sleeves are connected outside the sliding rods in a sliding manner, and the sleeves are connected outside the baffles in a sliding manner. A first spring is slidably connected to the interior of the sleeve, and one end of the first spring is fixedly connected with a clamping block. According to the structure, the handle is pressed, so that the sliding rod in the handle moves in the sleeve and slightly moves downwards, the first spring in the sleeve is extruded, then the clamping block at one end of the first spring is separated from the interior of the baffle under the elastic effect of the first spring, and therefore the baffle is dismantled; in this way, an internal heat dissipation module can be directly contacted, accumulated dust can be conveniently and rapidly cleaned, an aged fan can be replaced or heat conduction silicone grease can be supplemented, internal elements can be directly observed, and fault points can be rapidly positioned in combination with tools such as a universal meter.

A heat dissipation module according to an embodiment of the present invention comprises: a heat sink that includes an upper surface having a plurality of heat sink fins, and a lower surface from which a portion corresponding to a heating component arranged on a substrate protrudes; a plate arranged to correspond to the protruding portion of the lower surface of the heat sink; a cover capable of insulating the heat sink and the heating component, which is arranged on the substrate; a coupling member for coupling the heat sink and the cover; and a fixing member for fixing the cover to the substrate, wherein thermal grease can be applied to the protruding portion of the lower surface of the heat sink.

This invention provides a weather-resistant, high-pump-resistance, non-silicone phase change thermal grease, relating to the field of electronic thermal management materials technology. The non-silicone phase change thermal grease is composed of the following components by mass fraction: 12%-20% dynamic cross-linked matrix, 75%-85% core-shell thermally conductive filler, 3%-6% liquid crystal phase change synergist, and 1%-3% functional additives. This invention constructs a non-silicone thermal grease with intelligent heat flow guidance and high structural stability by deeply integrating a dynamic covalent cross-linked matrix, a three-level gradient core-shell thermally conductive filler, and a liquid crystal-induced two-stage phase change mechanism. It breaks through the limitations of traditional thermal greases in terms of pump-out resistance, weather resistance, and controllable flowability, achieving a comprehensive and synergistic leap in the macroscopic physical properties of the material. It not only improves and stabilizes the normal thermal conductivity at the target peak value, but also strictly controls the pump-out rate to the extreme range of ≤3% under severe thermal shock from -40℃ to 180℃. Simultaneously, the thermal conductivity decay rate is ≤5% after 1000 hours of UV aging. This provides key interface material support for reliable heat dissipation of high-power outdoor electronic devices.

The utility model relates to the technical field of ultra-thin track lamp bodies, and discloses an ultra-thin track lamp body which comprises a track lamp body, a plurality of lamp caps are installed on the surface of the track lamp body, a heat dissipation structure is arranged on the surface of the track lamp body, the heat dissipation structure comprises a plurality of supports, and the supports are arranged on the track lamp body. The ultra-thin track lamp body comprises a track lamp body and a plurality of supports, the supports are fixedly connected with the two ends of the track lamp body respectively, bolts are slidably inserted into the surfaces of the supports, limiting arms are inserted into the inner walls of the supports, two round holes are formed in the surfaces of the limiting arms, and grooves are formed in the two sides of the track lamp body. The heat conduction silicone grease can be conveniently smeared on the two sides of the LED chip, heat can be conducted to the baffle from the LED chip through the heat conduction silicone grease, heat generated by the LED chip is rapidly transferred to the baffle to be dissipated, the working temperature of the LED chip is effectively reduced, the influence of high temperature on the performance of the LED chip is reduced, and the service life of the lamp is prolonged.

The invention belongs to the technical field related to circuit board manufacturing, and particularly relates to a circuit board copper block embedding method and a circuit board manufacturing system. A core plate provided with a first through groove is obtained, a copper block is arranged in the first through groove, and the first surface of the copper block and the first plate surface of the core plate are located on the same horizontal plane; carrying out browning treatment on the first board surface of the chip and the first surface of the copper block, and laminating the plurality of core boards to form a PCB multilayer board; carrying out hole making treatment on the PCB multilayer board, and carrying out first electroplating to form a first copper plating layer; manufacturing a second dry film on the PCB multilayer board, forming a second electroplating area on the first surface of the copper block, and performing secondary electroplating to form a second copper plating layer; the second copper plating layer is formed in the second electroplating area, namely the first surface of the copper block, and the original thermal grease is replaced by the second copper plating layer, so that the production procedures for manufacturing the thermal grease are reduced, and the steps of the technological process and the number of required equipment are reduced.

The utility model provides an automatic filling device for liquid metal composite heat-conducting silicone grease, and belongs to the technical field of high-viscosity and high-density substance filling. The outlet of the silicone grease container is provided with an outlet connecting piece; the split charging needle tube is detachably connected with the outlet of the silicone grease container through the outlet connecting piece; the position of the pressure sensor corresponds to the position of a push rod of the split charging needle tube; and the silicone grease pushing device is communicated with the silicone grease container. The high-precision pressure sensor is used for measuring the displacement of the push rod of the split charging needle tube, a valveless filling process is adopted, the PLC is used for controlling the pressure sensor to detect the pressure in the silicone grease container, the electromagnetic valve is used for controlling the pressure in the silicone grease container, and the stress of the liquid metal composite heat-conducting silicone grease is released in time; errors caused by overshoot or resorption of the silicone grease when filling is finished are eliminated, and the filling precision of equipment is guaranteed.

The utility model discloses a heat-conducting silicone grease coating clamp for an MOS (Metal Oxide Semiconductor) tube, which belongs to the technical field of electronic component processing devices and comprises a supporting rack, a vertical guide structure, a lifting driving mechanism, a holder structure, a rotary driving mechanism and a clamping action mechanism, the vertical guide structure is arranged on the upper portion of the side face of the supporting rack, and the lifting driving mechanism is connected with the vertical guide structure. The holder structure is movably arranged below the vertical guide structure on the side face of the supporting rack, and the lifting driving mechanism is in driving connection with the holder structure; the rotation driving mechanism is connected to the side face of the holder structure, and the rotation driving mechanism is in driving connection with the clamping action mechanism. According to the utility model, the technical problem of how to improve the clamping convenience when the MOS tube is coated is solved.

Disclosed is a thermally conductive grease composition which contains a base oil (A) and thermally conductive particles (B), wherein: the content of the thermally conductive particles (B) is not less than 79% by mass but less than 92% by mass relative to the total amount of the thermally conductive grease composition; the thermally conductive particles (B) contain aluminum nitride (B1) that has an average particle diameter D50 of less than 30 µm and aluminum nitride (B2) that has an average particle diameter D50 of 30 µm or more; and the mass ratio ((B2) / (B1)) of the content of the aluminum nitride (B2) to the content of the aluminum nitride (B1) is 1-3.