98 results about "Thermal grease" patented technology

The invention discloses a preparation method of an ABM ceramic substrate with a metal through hole, and particularly relates to the technical field of ceramic substrates, a Si3N4 ceramic substrate is prepared through tape casting and hot pressed sintering, a conical stepped through hole is processed by using ultrafast femtosecond laser, the aperture of the through hole is 100-300 [mu] m, and the smoothness of the wall of the through hole is Rat; 1 [mu] m; performing oxygen plasma activation on the inner wall of the through hole to generate a Si-O active group; sputtering a nano titanium transition layer to enhance metal-ceramic interface bonding; the through holes are filled layer by layer through pulse electrochemical deposition, the current density is controlled, and a compact non-porous structure is achieved; in-Sn-Ag low-temperature active brazing filler metal is used, and a surface copper layer is bonded under the assistance of plasma; a fine circuit is formed through photoetching and micro-electroplating, the line width and the spacing of the circuit are the same, and the line width and the spacing of the circuit are both smaller than 20 microns; etching a micro-channel network on the back surface of the substrate by using ultraviolet laser, and filling heat-conducting silicone grease; and finally, carrying out vacuum annealing for 2 hours in an environment with the temperature of 250 DEG C.

The present disclosure describes thermal management devices. In one example, a thermal management device can include a processing unit, a thermal grease layer directly contacting the processing unit, and a heat pipe. The heat pipe can include a heat pipe interior volume having a working fluid disposed therein, a first exterior surface directly contacting the thermal grease layer, a second exterior surface opposite from the first exterior surface, and side exterior surfaces connecting the first exterior surface and the second exterior surface. The thermal management device can also include a device cover spaced from the second exterior surface of the heat pipe by a distance from greater than 1 mm to about 5 mm, and a bracket having a clamping portion that holds the heat pipe by the side exterior surfaces of the heat pipe. The clamping portion does not extend past the first exterior surface of the heat pipe.

The invention provides high-temperature-resistant heat-conducting silicone grease. The high-temperature-resistant heat-conducting silicone grease comprises the following components in parts by weight: 100 parts of methyl phenyl silicone oil, 300-1000 parts of modified heat-conducting powder and 0.5-3 parts of a heat-resistant additive, wherein the viscosity of the methyl phenyl silicone oil at 25 DEG C is 50-500 mPa.s, and the phenyl content of the methyl phenyl silicone oil is 25-50%. By adding the combination of the methyl phenyl silicone oil and the heat-resistant additive, molecular chain breakage of an organic silicon-based material in a high-temperature environment can be inhibited, so that the durability of the silicone grease is ensured, the service time in the high-temperature environment is longer, and the high-temperature resistance of conventional heat-conducting silicone grease is improved.

To provide a thermally conductive grease composition which has high thermal conductivity, has excellent coatability, and allows a temperature distribution to be visually recognized.SOLUTION: A thermally conductive grease composition containing a base oil, a thermally conductive filler, and a capsule pigment encapsulating a leuco dye, a developer, and a color change temperature regulator.SELECTED DRAWING: None

The embodiment of the utility model provides a multi-split power device automatic integrated assembly manufacturing device which comprises a feeding mechanism, a thermal grease coating mechanism, a corner forming mechanism, a tubing feeding mechanism, a carrying mechanism, a conveying mechanism, a screw driving mechanism, a cover plate dismounting mechanism and a discharging mechanism which are all arranged on a base. The conveying mechanism comprises a first conveying track and a second conveying track, and the conveying directions of the first conveying track and the second conveying track are opposite; the feeding mechanism, the thermal grease coating mechanism, the bent angle forming mechanism, the tubing feeding mechanism and the carrying mechanism are sequentially arranged in the conveying direction of the first conveying track. The screw driving mechanism, the cover plate disassembling and assembling mechanism and the discharging mechanism are sequentially arranged in the conveying direction of the second conveying track. According to the embodiment of the utility model, the processing precision and the assembly efficiency of the multi-split power device can be effectively improved.

The invention discloses a heat conduction silicone grease oil separation rate determination device, which comprises a base, a ground glass sheet 1 and a ground glass sheet 2, the top of the base is provided with an inner groove, the ground glass sheet 1 is combined with the inner groove, the top of the base is fixedly provided with a top frame through a support frame, the top of the top frame is in screwed connection with a driving rod, and the driving rod is connected with the ground glass sheet 1. The bottom of the driving rod is connected with a pushing rod in a clamped mode, and a limiting assembly for limiting axial deviation of the pushing rod is arranged between the pushing rod and the top frame. In the application, the pressing block stably abuts against the top of the frosted glass sheet II under the action of the spring, the clamping assembly completes combined clamping of the frosted glass sheet I and the frosted glass sheet II at the moment, the positioning rod is rotated to be separated from the outer surface wall of the fixing frame at the moment, and the whole supporting frame and the suction cup are pushed to slide along the top of the frosted glass sheet II until complete separation; at the moment, the ground glass sheet I and the ground glass sheet II can be independently separated from the device, so that the ground glass sheet I and the ground glass sheet II can be manually and conveniently transferred.

The present invention discloses a display device, which includes a backlight module. The backlight module is composed of an optical layer, a double prism layer, a lamp board, and a backplane stacked in sequence from top to bottom. A horizontal heat conduction area is arranged on the back of the backplane. The horizontal heat conduction area includes a number of sunken heat conduction concave surfaces, and adjacent heat conduction concave surfaces are connected by sunken communication concave surfaces; heat conduction through holes are arranged at positions between adjacent horizontal heat conduction areas, and annular concave surfaces are coated on the outer peripheries of the heat conduction through holes; a metal composite material formed by compounding aluminum particles and resin is filled in the heat conduction concave surfaces, the communication concave surfaces, and the annular concave surfaces; the metal composite material filled in the heat conduction concave surfaces all protrudes from the back of the backplane. The present invention has the following advantages and effects: The present invention innovatively designs the heat dissipation module as a detachable structure, so that when maintaining, the user does not need to completely disassemble the backlight module, but only needs to easily disassemble the heat dissipation module to replace the thermal grease.

The present invention relates to an IGBT junction temperature estimation method, specifically a method for calculating the junction temperature of an IGBT module taking into account a heat sink. From an engineering application perspective, the present invention uses finite element simulation results to determine the coupling of the FWD / IGBT chip in the thermal grease layer under different operating conditions for high-power converter IGBT modules with significantly varying operating conditions, and then obtains its mathematical expression. By comprehensively considering the computational resource overhead and accuracy issues of junction temperature estimation, a thermal network mathematical model is proposed that accounts for the loss coupling of the IGBT chip and FWD chip under different operating conditions. This mathematical model has a simple structure and a small amount of computation, and can achieve more accurate real-time response to dynamic changes in IGBT junction temperature in engineering applications.

The present invention relates to a method for preparing a temperature-sensing probe of a microprobe and its use. The method uses a micro-thermistor as the core temperature-measuring component. By first injecting thermal grease at one end of the probe tube, then placing the micro-thermistor, and finally filling it with epoxy resin, a temperature-sensing probe of the microprobe is obtained. This method has a simple process. The obtained temperature-sensing probe of the microprobe has a small thermal time constant and good sealing performance when applied to deep-sea environmental temperature measurement. It has obvious negative temperature coefficient characteristics, good insulation characteristics, and fast response speed in the temperature range of -5°C to +35°C, and can withstand the extreme conditions of high pressure, high salt, and high humidity in the seawater environment, and is suitable for rapid temperature measurement in the deep-sea environment.

This invention provides a liquid metal-based thermal grease, its preparation method, and its application. The liquid metal-based thermal grease comprises the following raw materials in parts by weight: 100 parts liquid metal, 2-5 parts silicone oil, 0.1-20 parts thermally conductive powder filler, and 0.1-3 parts other additives. The high-reliability liquid metal-based thermal grease provided by this invention possesses excellent high thermal conductivity, high processability, and high reliability. It can replace traditional thermal grease to solve the heat dissipation and cooling problem of high-power chips, thereby extending the lifespan of electronic products.

The utility model relates to an SMD transformer framework structure, and belongs to the field of SMD transformers, the SMD transformer framework structure comprises a winding framework, a heat dissipation mechanism is arranged on the outer side of the winding framework, and fixing mechanisms are arranged on the inner walls of the left side and the right side of the heat dissipation mechanism. According to the SMD transformer framework structure, the transformer is effectively protected by the heat dissipation mechanism through the protective shell, meanwhile, heat generated in the operation process of the transformer winding is efficiently absorbed and dispersed, and the heat conduction performance of the transformer winding is improved due to the close attachment of the heat conduction diaphragm and the winding and the heat conduction characteristic of the heat conduction silicone grease. Heat can be rapidly transferred to the vapor chamber from the winding, the heat transfer path is further optimized through the uniform heat distribution function of the vapor chamber, and heat convection and radiation heat dissipation are effectively promoted through contact between the heat dissipation fins and ambient air through the increased surface area of the heat dissipation fins, so that the heat dissipation efficiency is improved. The risk of performance reduction or damage possibly caused by overheating of the transformer is reduced, the working efficiency of the transformer is improved, and the service life of the transformer is prolonged.

The utility model relates to a heat-conducting consumable, in particular to heat-conducting silicone grease which comprises a body, the body is provided with an upper high filler layer and a lower high filler layer, the upper high filler layer is in a square shape, the inner side of the upper high filler layer is filled with a low filler layer, a containing groove is formed in the bottom of the lower high filler layer, and the lower high filler layer is filled with a heat-conducting material. The containing groove is filled with a protective filler layer, a graphene sheet is arranged on the inner side of the protective filler layer, the graphene sheet is attached to the bottom of a low filler layer, and the low filler layer and the protective filler layer are the same in component. The heat-conducting silicone grease has the advantages of being reasonable in design and high in heat-conducting performance, heat in electronic components can be more efficiently conducted out through the graphene sheets inside the heat-conducting silicone grease, the temperature of the electronic components can be reduced, the heat-conducting silicone grease can be evenly spread on the surfaces of the electronic components, the probability that the heat-conducting silicone grease overflows unevenly is reduced, and the heat dissipation performance is guaranteed.

A heater optimized ball valve is provided that includes one or more heat flux components. A heater optimized ball valve may be a modular ball valve including a plurality of end caps secured to a valve body frame having a ball disposed within the frame between at least two of the end caps, where the modular ball valve includes a thermally conductive grease including a mixture of a vacuum grease and a metal alloy powder, the metal alloy powder being thermally conductive to the ball, and the vacuum grease being thermally conductive to the ball. And at least one seal disposed on the top outer diameter surface of the ball and on the inner proximal facing surface of the top end cap, at least partially filling a top gap separating the two surfaces, and disposed on the bottom outer diameter surface of the ball valve and on the distal facing surface of the bottom end cap, at least partially filling a gap separating the two surfaces.

A capacitor with a protective housing, comprising a capacitor body, characterized in that symmetrically arranged connecting pins are fixedly attached to the upper end of the capacitor body on the left and right, a fixed outer housing is movably attached to the outside of the lower end of the capacitor body, a graphitic thermal interface material is fixedly attached to the inside of the fixed outer housing, a limiting seat is fixedly attached to the upper end of the inner base of the graphitic thermal interface material, in which step recesses are formed, a damping pad is fixedly attached to the lower end of the fixed outer housing, thermal grease is firmly applied to both front and rear ends of the fixed outer housing, cooling fins are fixedly attached outside the thermal grease, and an insertion recess is formed at the upper end of the fixed outer housing.A height-adjustable inner housing is movably arranged in the insertion recess, and adjustment grooves and cooling grooves are formed successively from top to bottom at both left and right ends of the fixed outer housing.

The invention discloses a structure for strengthening heat dissipation of a lithium battery, and belongs to the technical field of lithium battery heat dissipation, the structure comprises a lithium battery module, heat dissipation fins are arranged on the periphery of the lithium battery module, a plurality of temperature uniformizing plates are arranged in the lithium battery module at equal intervals, a liquid cooling system is arranged at the bottom of the heat dissipation fins, and the temperature uniformizing plates are located in the liquid cooling system. And the cooling fins are arranged on the four side surfaces of the lithium battery module, so that the heat dissipation of the lithium battery is further enhanced, and the heat dissipation efficiency of the whole thermal management system is improved. And heat generated by the battery is quickly absorbed by utilizing the efficient heat conduction characteristic of the uniform-temperature plate. In order to realize tight contact between the vapor chamber and the lithium battery, a contact interface is coated with heat-conducting silicone grease or a thermal interface material, so that the contact thermal resistance is reduced as far as possible, and the heat-conducting efficiency is improved.

An information handling system includes a processor package having a processor die and a first thermal interface material that is deposited on a surface of the processor die. A second thermal interface material is deposited on the surface of the processor die around a periphery of the first thermal interface material and encloses the first thermal interface material.

This utility model discloses an intelligent human-computer interaction terminal, belonging to the field of intelligent terminals. A bottom frame is installed at the lower end of the blackboard, and a front baffle is provided at the front end of the bottom frame. A chalk compartment is formed between the bottom frame and the front baffle. The wall of the chalk compartment is equipped with a cable management conduit, which facilitates the wiring of the terminal. Multiple through slots are opened at the upper end of the bottom frame. The cable management conduit and metal spring clips form channels within the arc-shaped shell, providing an orderly and convenient arrangement and routing path for the wires, avoiding wire clutter and improving the safety and reliability of the layout. The sealed design of the cable management conduit also prevents dust and moisture intrusion, protecting the wires and internal components. The heat dissipation mechanism efficiently conducts heat through heat dissipation fins, heat-conducting blocks, heat-conducting strips, and thermal grease, rapidly dissipating heat from the terminal's heating components. This not only reduces the operating temperature and improves operational stability and service life, but the metal fasteners also ensure the stability and durability of the heat dissipation effect.

The utility model relates to the technical field of thermal grease smearing, in particular to an automatic thermal grease smearing jig which comprises a bottom plate and a U-shaped plate, the U-shaped plate is arranged above the bottom plate, a threaded rod is rotatably connected to the interior of the U-shaped plate, a connecting block is connected to the exterior of the threaded rod in a threaded mode, a scraping plate is fixedly connected to one side of the connecting block, through holes are formed in the scraping plate at equal intervals, and the through holes are communicated with the bottom plate. A transmission groove is formed in one side of the interior of the U-shaped plate, one end of the threaded rod extends into the transmission groove and is fixedly connected with a first bevel gear, and the bottom of the U-shaped plate is fixedly connected with a first motor. The thermal grease smearing device has the advantages that rotation of the threaded rod is achieved through driving of the first motor, then the connecting block and the scraping plate are driven to move, it is ensured that thermal grease is evenly smeared, local overheating can be avoided when the thermal grease is evenly smeared, it is ensured that an electronic device works within the safe temperature range, damage and faults caused by overheating are reduced, and the working efficiency is improved. Compared with a traditional device, the operation quality and the use efficiency are greatly improved.

The utility model provides a tensioning device and a coating device. The tensioning device comprises a frame assembly, the frame assembly comprises a fixed part and a movable part, the movable part is arranged on one side of the fixed part and is adjustably arranged relative to the fixed part, a tensioning area is formed between the movable part and the fixed part, and the size of the tensioning area can be adjusted by adjusting the movable part; the side, away from the movable part, of the fixed part is connected with one side of a to-be-installed piece, and the movable part is used for being connected with the other side of the to-be-installed piece. And the crimping parts are arranged in the circumferential direction of the frame assembly, and a space used for clamping a part to be installed is formed between the crimping parts and the frame assembly. The steel mesh tensioning device solves the problem that the tensioning degree of a steel mesh coated with thermal grease in the prior art cannot be freely adjusted when the steel mesh is used.

The present invention relates to the field of thermal interface materials and discloses a graphene thermal grease, a preparation method thereof, and an application thereof. The preparation method of the present invention comprises: (1) in the presence of a protective gas and microwaves, expanding and reducing graphene oxide to obtain microwave-reduced graphene oxide; and in the presence of a solvent, contacting and reacting a compounded spherical alumina with a silane coupling agent to obtain modified spherical alumina; and (2) mixing and reacting silicone oil with the microwave-reduced graphene oxide and the modified spherical alumina under stirring to obtain the graphene thermal grease. The graphene thermal grease prepared by the method provided by the present invention has a high thermal conductivity coefficient and good stability, and is suitable for preparing composite materials with relatively high thermal conductivity.

This invention provides a server chip fixing device and method, belonging to the field of server hardware installation technology. It includes a base and a heat sink disposed on top of the base. The chip is fixed between the base and the heat sink. The base includes a bottom frame, an upper frame, and at least two guide posts. The bottom frame and the upper frame have through holes for the guide posts, and the guide posts rotate on the bottom frame. The inner diameter of the upper frame is smaller than the inner diameter of the bottom frame. Based on the chip's external structure (the outer diameter of the bottom is larger than the inner diameter of the top protrusion), the chip's periphery is constrained by the wall structure formed by the bottom frame and the upper frame. This invention, through the threaded engagement of the upper sliding post of the guide post and the lower base post, can precisely adjust the distance between the heat sink and the chip, thereby adjusting the clamping force. This avoids excessive clamping force that could damage the chip, and also avoids insufficient clamping force that could lead to a loose fit. Simultaneously, it can adapt to the use of thermal greases of different thicknesses, ensuring effective heat dissipation.

This utility model discloses a high-current connector, which includes a socket and a plug. The plug is provided with conductive terminals, and the socket is provided with conductive posts that accommodate and abut against the conductive terminals. A heat-conducting plate is provided on the outer wall of the socket and plug. Several equally spaced heat dissipation fins are evenly distributed along the circumference of the outer wall of the heat-conducting plate, and several raised heat-conducting parts are provided on the inner wall of the heat-conducting plate. A terminal block is connected to the conductive posts and conductive terminals. The heat generated by the connection between the conductive terminals and conductive posts is efficiently conducted to the heat-conducting plate through thermal grease, and then exchanged with the outside cold air by the heat dissipation fins, effectively controlling the operating temperature. The design of the heat dissipation parts and the heat-conducting grooves increases the contact area of ​​the thermal grease, improving heat conduction efficiency. This structure ensures that the temperature rise is maintained within a safe threshold even in a sealed state, preventing high temperatures from affecting the stability and safety of the equipment.

The present invention relates to a composition comprising one or more filler particles and a first treating agent of Formula 1; and a second treating agent of Formula 2; where R, R1, R2, R3, Y, x, y, and z are defined herein. The composition of the present invention is useful as a non-curable thermal grease that can achieve high thermal conductivities at dispensable and processable viscosities.

The present invention provides a method for preparing a silicon carbide power device based on diamond heat dissipation, which is carried out according to the following steps: step 1, embedding a pin into the interior of a substrate; step 2, applying thermal grease to the interior of the substrate, and the top of the pin is also in contact with the diamond heat-conducting component through the grease; step 3, sequentially installing a bottom diamond heat sink, a middle diamond heat sink, and a top diamond heat sink; step 4, injecting an adhesive into the side of the top diamond heat sink. The preparation method adopts a three-layer diamond heat-conducting component, thereby further improving the efficiency of heat dissipation transferred from the power module to the diamond material. At the same time, it can also be connected to an external heat dissipation device in multiple ways, making the installation more flexible. By introducing the pin part upward and pressing it on the inner boss, the heat generated by each pin part can also be simultaneously discharged outward, thereby improving the heat dissipation effect of the pin part.

This invention provides a thermal grease application tool and an IGBT module installation method using the tool, relating to the field of semiconductor device technology. The thermal grease application tool includes a base, with at least one grease conduit on one side of the base for holding thermal grease. The end of the grease conduit away from the base is open, and the grease conduit corresponds to the location on the IGBT module where thermal grease needs to be applied. An IGBT module installation method using the aforementioned thermal grease application tool is also provided. Based on the technical solution of this invention, thermal grease is applied to the actual required location on the IGBT module, facilitating control of the amount of thermal grease used, maximizing the direct connection area between the IGBT module and the heatsink, effectively reducing thermal resistance, improving the heat dissipation effect of the heatsink on the IGBT module, and extending the service life of the IGBT module.

The present invention relates to a non-curing thermal grease comprising filler particles, boron nitride platelet particles, and trialkoxysilyl-terminated polydimethylsiloxane, which is useful as a thermal interface material in microelectronic devices for transporting heat generated by a heat source to a heat sink.

1. Name of the product in this design: CPU water cooling heatsink assembly (S PRO series). 2. Purpose of this product design: The cold block is installed on the CPU, directly contacting the CPU surface, and effectively conducts the heat generated by the CPU to the inside of the cold block through thermal conductive materials (such as thermal grease). The water pump is integrated inside the cold block, which pumps coolant to circulate between the cold block and the radiator to remove heat. 3. The key design feature of this product is its shape. 4. The image or photograph that best illustrates the design's key points: a 3D model.

The present invention relates to a composition comprising one or more filler particles and a first treatment agent of Formula 1: and a second treatment agent of Formula 2: wherein R, R1, R2, Y, x and n are as defined herein. The composition disclosed by the invention can be used as heat-conducting grease, and can realize the combination of high heat conductivity and heat stability.

The invention provides a method and device for determining the service life of a radar assembly, electronic equipment and a medium, the heat conductivity coefficient of the radar assembly is obtained, the radar assembly comprises a heat dissipation structure, the heat dissipation structure comprises an assembly heat dissipation layer, a heat conduction silicone grease layer and a uniform temperature plate layer, and the heat conduction silicone grease layer comprises a normal area and a dry area. The normal area is an area in which interlayer silicone grease loss does not occur, and the dry area is an area in which interlayer silicone grease loss occurs; determining an interlayer silicone grease loss amount of the radar assembly, and determining a first area corresponding to the dry area according to the interlayer silicone grease loss amount; and obtaining the total area of the heat-conducting silicone grease layer, and determining the remaining use time of the radar assembly according to the first area, the total area and the heat conductivity coefficient. According to the invention, accurate prediction of the service life of the radar assembly is realized.

The utility model provides an anti-overflow cylindrical battery clamp, which belongs to the technical field of batteries and comprises a constraint frame and a clamp heat dissipation assembly arranged on the inner wall of the constraint frame, the clamp heat dissipation assembly comprises a side edge plate, a circulating pipe, a clamping plate, a constraint hole, a heat dissipation groove, a positioning column, a containing groove and a heat conduction block, the positioning column is fixedly arranged on the outer wall of the side edge plate, and the clamping plate is arranged on the side edge plate. The containing groove is formed in one side of the outer wall of the side plate, the heat conduction block is fixedly arranged on the inner wall of the containing groove, the heat dissipation groove is formed in one side of the outer wall of the side plate, and the clamping plates are slidably embedded in the two sides of the inner wall of the restraining frame. By means of the clamp heat dissipation assembly, the battery body can be stably restrained and limited, after heat conduction silicone grease is injected subsequently, it can be ensured that gaps are stably filled with the silicone grease, the problems that due to the gaps, the heat conduction efficiency of the battery is reduced, and heat accumulation is generated finally are solved, the silicone grease is introduced, use of a high-viscosity pouring sealant can be avoided, the pouring time is greatly shortened, and the production efficiency is improved. The production efficiency is improved.