37 results about "Thermal grease" patented technology

This invention provides a liquid metal-based thermal grease, its preparation method, and its application. The liquid metal-based thermal grease comprises the following raw materials in parts by weight: 100 parts liquid metal, 2-5 parts silicone oil, 0.1-20 parts thermally conductive powder filler, and 0.1-3 parts other additives. The high-reliability liquid metal-based thermal grease provided by this invention possesses excellent high thermal conductivity, high processability, and high reliability. It can replace traditional thermal grease to solve the heat dissipation and cooling problem of high-power chips, thereby extending the lifespan of electronic products.

The utility model relates to a heat-conducting consumable, in particular to heat-conducting silicone grease which comprises a body, the body is provided with an upper high filler layer and a lower high filler layer, the upper high filler layer is in a square shape, the inner side of the upper high filler layer is filled with a low filler layer, a containing groove is formed in the bottom of the lower high filler layer, and the lower high filler layer is filled with a heat-conducting material. The containing groove is filled with a protective filler layer, a graphene sheet is arranged on the inner side of the protective filler layer, the graphene sheet is attached to the bottom of a low filler layer, and the low filler layer and the protective filler layer are the same in component. The heat-conducting silicone grease has the advantages of being reasonable in design and high in heat-conducting performance, heat in electronic components can be more efficiently conducted out through the graphene sheets inside the heat-conducting silicone grease, the temperature of the electronic components can be reduced, the heat-conducting silicone grease can be evenly spread on the surfaces of the electronic components, the probability that the heat-conducting silicone grease overflows unevenly is reduced, and the heat dissipation performance is guaranteed.

A heater optimized ball valve is provided that includes one or more heat flux components. A heater optimized ball valve may be a modular ball valve including a plurality of end caps secured to a valve body frame having a ball disposed within the frame between at least two of the end caps, where the modular ball valve includes a thermally conductive grease including a mixture of a vacuum grease and a metal alloy powder, the metal alloy powder being thermally conductive to the ball, and the vacuum grease being thermally conductive to the ball. And at least one seal disposed on the top outer diameter surface of the ball and on the inner proximal facing surface of the top end cap, at least partially filling a top gap separating the two surfaces, and disposed on the bottom outer diameter surface of the ball valve and on the distal facing surface of the bottom end cap, at least partially filling a gap separating the two surfaces.

A capacitor with a protective housing, comprising a capacitor body, characterized in that symmetrically arranged connecting pins are fixedly attached to the upper end of the capacitor body on the left and right, a fixed outer housing is movably attached to the outside of the lower end of the capacitor body, a graphitic thermal interface material is fixedly attached to the inside of the fixed outer housing, a limiting seat is fixedly attached to the upper end of the inner base of the graphitic thermal interface material, in which step recesses are formed, a damping pad is fixedly attached to the lower end of the fixed outer housing, thermal grease is firmly applied to both front and rear ends of the fixed outer housing, cooling fins are fixedly attached outside the thermal grease, and an insertion recess is formed at the upper end of the fixed outer housing.A height-adjustable inner housing is movably arranged in the insertion recess, and adjustment grooves and cooling grooves are formed successively from top to bottom at both left and right ends of the fixed outer housing.

This utility model discloses an intelligent human-computer interaction terminal, belonging to the field of intelligent terminals. A bottom frame is installed at the lower end of the blackboard, and a front baffle is provided at the front end of the bottom frame. A chalk compartment is formed between the bottom frame and the front baffle. The wall of the chalk compartment is equipped with a cable management conduit, which facilitates the wiring of the terminal. Multiple through slots are opened at the upper end of the bottom frame. The cable management conduit and metal spring clips form channels within the arc-shaped shell, providing an orderly and convenient arrangement and routing path for the wires, avoiding wire clutter and improving the safety and reliability of the layout. The sealed design of the cable management conduit also prevents dust and moisture intrusion, protecting the wires and internal components. The heat dissipation mechanism efficiently conducts heat through heat dissipation fins, heat-conducting blocks, heat-conducting strips, and thermal grease, rapidly dissipating heat from the terminal's heating components. This not only reduces the operating temperature and improves operational stability and service life, but the metal fasteners also ensure the stability and durability of the heat dissipation effect.

This invention provides a server chip fixing device and method, belonging to the field of server hardware installation technology. It includes a base and a heat sink disposed on top of the base. The chip is fixed between the base and the heat sink. The base includes a bottom frame, an upper frame, and at least two guide posts. The bottom frame and the upper frame have through holes for the guide posts, and the guide posts rotate on the bottom frame. The inner diameter of the upper frame is smaller than the inner diameter of the bottom frame. Based on the chip's external structure (the outer diameter of the bottom is larger than the inner diameter of the top protrusion), the chip's periphery is constrained by the wall structure formed by the bottom frame and the upper frame. This invention, through the threaded engagement of the upper sliding post of the guide post and the lower base post, can precisely adjust the distance between the heat sink and the chip, thereby adjusting the clamping force. This avoids excessive clamping force that could damage the chip, and also avoids insufficient clamping force that could lead to a loose fit. Simultaneously, it can adapt to the use of thermal greases of different thicknesses, ensuring effective heat dissipation.

This utility model discloses a high-current connector, which includes a socket and a plug. The plug is provided with conductive terminals, and the socket is provided with conductive posts that accommodate and abut against the conductive terminals. A heat-conducting plate is provided on the outer wall of the socket and plug. Several equally spaced heat dissipation fins are evenly distributed along the circumference of the outer wall of the heat-conducting plate, and several raised heat-conducting parts are provided on the inner wall of the heat-conducting plate. A terminal block is connected to the conductive posts and conductive terminals. The heat generated by the connection between the conductive terminals and conductive posts is efficiently conducted to the heat-conducting plate through thermal grease, and then exchanged with the outside cold air by the heat dissipation fins, effectively controlling the operating temperature. The design of the heat dissipation parts and the heat-conducting grooves increases the contact area of ​​the thermal grease, improving heat conduction efficiency. This structure ensures that the temperature rise is maintained within a safe threshold even in a sealed state, preventing high temperatures from affecting the stability and safety of the equipment.

The present invention relates to a composition comprising one or more filler particles and a first treating agent of Formula 1; and a second treating agent of Formula 2; where R, R1, R2, R3, Y, x, y, and z are defined herein. The composition of the present invention is useful as a non-curable thermal grease that can achieve high thermal conductivities at dispensable and processable viscosities.

This invention provides a thermal grease application tool and an IGBT module installation method using the tool, relating to the field of semiconductor device technology. The thermal grease application tool includes a base, with at least one grease conduit on one side of the base for holding thermal grease. The end of the grease conduit away from the base is open, and the grease conduit corresponds to the location on the IGBT module where thermal grease needs to be applied. An IGBT module installation method using the aforementioned thermal grease application tool is also provided. Based on the technical solution of this invention, thermal grease is applied to the actual required location on the IGBT module, facilitating control of the amount of thermal grease used, maximizing the direct connection area between the IGBT module and the heatsink, effectively reducing thermal resistance, improving the heat dissipation effect of the heatsink on the IGBT module, and extending the service life of the IGBT module.

The present invention relates to a non-curing thermal grease comprising filler particles, boron nitride platelet particles, and trialkoxysilyl-terminated polydimethylsiloxane, which is useful as a thermal interface material in microelectronic devices for transporting heat generated by a heat source to a heat sink.

The utility model provides an anti-overflow cylindrical battery clamp, which belongs to the technical field of batteries and comprises a constraint frame and a clamp heat dissipation assembly arranged on the inner wall of the constraint frame, the clamp heat dissipation assembly comprises a side edge plate, a circulating pipe, a clamping plate, a constraint hole, a heat dissipation groove, a positioning column, a containing groove and a heat conduction block, the positioning column is fixedly arranged on the outer wall of the side edge plate, and the clamping plate is arranged on the side edge plate. The containing groove is formed in one side of the outer wall of the side plate, the heat conduction block is fixedly arranged on the inner wall of the containing groove, the heat dissipation groove is formed in one side of the outer wall of the side plate, and the clamping plates are slidably embedded in the two sides of the inner wall of the restraining frame. By means of the clamp heat dissipation assembly, the battery body can be stably restrained and limited, after heat conduction silicone grease is injected subsequently, it can be ensured that gaps are stably filled with the silicone grease, the problems that due to the gaps, the heat conduction efficiency of the battery is reduced, and heat accumulation is generated finally are solved, the silicone grease is introduced, use of a high-viscosity pouring sealant can be avoided, the pouring time is greatly shortened, and the production efficiency is improved. The production efficiency is improved.

The invention discloses a thermal grease smearing device, thermal grease smearing equipment and an equipment control method. The thermal grease smearing device comprises a thermal grease supplementing module, a workpiece machining area, a coating template mechanism, a blade coating mechanism and a residual grease recycling mechanism which are arranged on a machine table. Wherein the thermal grease supplementing module is used for supplying grease to the coating template mechanism, the coating template mechanism is used for pressing a workpiece to limit a coating area, the blade coating mechanism is used for blade-coating the grease to the surface of the workpiece, and the residual grease recycling mechanism is matched with the blade coating mechanism and is used for scraping residual thermal grease left on the blade coating mechanism after blade coating and recycling the residual thermal grease to the thermal grease supplementing module. And cyclic utilization is realized. According to the scheme, automatic coating and residual paste closed-loop recovery structures are integrated, so that the manual cleaning frequency is reduced, the coating continuity and the material utilization rate are improved, the production efficiency is effectively improved, and the waste of consumables is reduced.

The utility model discloses an integrated controller for rapid heat dissipation of a battery system, which comprises a shell, a plurality of baffles are arranged outside the shell, a plurality of handles are connected outside the baffles in a sliding manner, sliding rods are fixedly connected outside the handles, sleeves are connected outside the sliding rods in a sliding manner, and the sleeves are connected outside the baffles in a sliding manner. A first spring is slidably connected to the interior of the sleeve, and one end of the first spring is fixedly connected with a clamping block. According to the structure, the handle is pressed, so that the sliding rod in the handle moves in the sleeve and slightly moves downwards, the first spring in the sleeve is extruded, then the clamping block at one end of the first spring is separated from the interior of the baffle under the elastic effect of the first spring, and therefore the baffle is dismantled; in this way, an internal heat dissipation module can be directly contacted, accumulated dust can be conveniently and rapidly cleaned, an aged fan can be replaced or heat conduction silicone grease can be supplemented, internal elements can be directly observed, and fault points can be rapidly positioned in combination with tools such as a universal meter.

This invention provides a weather-resistant, high-pump-resistance, non-silicone phase change thermal grease, relating to the field of electronic thermal management materials technology. The non-silicone phase change thermal grease is composed of the following components by mass fraction: 12%-20% dynamic cross-linked matrix, 75%-85% core-shell thermally conductive filler, 3%-6% liquid crystal phase change synergist, and 1%-3% functional additives. This invention constructs a non-silicone thermal grease with intelligent heat flow guidance and high structural stability by deeply integrating a dynamic covalent cross-linked matrix, a three-level gradient core-shell thermally conductive filler, and a liquid crystal-induced two-stage phase change mechanism. It breaks through the limitations of traditional thermal greases in terms of pump-out resistance, weather resistance, and controllable flowability, achieving a comprehensive and synergistic leap in the macroscopic physical properties of the material. It not only improves and stabilizes the normal thermal conductivity at the target peak value, but also strictly controls the pump-out rate to the extreme range of ≤3% under severe thermal shock from -40℃ to 180℃. Simultaneously, the thermal conductivity decay rate is ≤5% after 1000 hours of UV aging. This provides key interface material support for reliable heat dissipation of high-power outdoor electronic devices.

The utility model relates to the technical field of ultra-thin track lamp bodies, and discloses an ultra-thin track lamp body which comprises a track lamp body, a plurality of lamp caps are installed on the surface of the track lamp body, a heat dissipation structure is arranged on the surface of the track lamp body, the heat dissipation structure comprises a plurality of supports, and the supports are arranged on the track lamp body. The ultra-thin track lamp body comprises a track lamp body and a plurality of supports, the supports are fixedly connected with the two ends of the track lamp body respectively, bolts are slidably inserted into the surfaces of the supports, limiting arms are inserted into the inner walls of the supports, two round holes are formed in the surfaces of the limiting arms, and grooves are formed in the two sides of the track lamp body. The heat conduction silicone grease can be conveniently smeared on the two sides of the LED chip, heat can be conducted to the baffle from the LED chip through the heat conduction silicone grease, heat generated by the LED chip is rapidly transferred to the baffle to be dissipated, the working temperature of the LED chip is effectively reduced, the influence of high temperature on the performance of the LED chip is reduced, and the service life of the lamp is prolonged.

Disclosed is a thermally conductive grease composition which contains a base oil (A) and thermally conductive particles (B), wherein: the content of the thermally conductive particles (B) is not less than 79% by mass but less than 92% by mass relative to the total amount of the thermally conductive grease composition; the thermally conductive particles (B) contain aluminum nitride (B1) that has an average particle diameter D50 of less than 30 µm and aluminum nitride (B2) that has an average particle diameter D50 of 30 µm or more; and the mass ratio ((B2) / (B1)) of the content of the aluminum nitride (B2) to the content of the aluminum nitride (B1) is 1-3.

This utility model relates to the field of water-cooled power supply technology, specifically disclosing a water-cooled high-frequency electroplating power supply device. It includes a power supply housing, a first connecting plate fixedly mounted on the outer top of the housing, and first threaded holes at each of the four corners of the top of the first connecting plate, the threaded holes penetrating the first connecting plate. Thermal grease is fixedly mounted on the top of the power supply housing, and a heat-conducting block is positioned above the housing. This utility model provides a water-cooled high-frequency electroplating power supply device with a compact structure and easy maintenance. The heat-conducting block is connected to the power supply housing by bolts, facilitating easy assembly and disassembly. The internal heat-conducting coil uses threaded connections at both ends for the inlet and outlet rotating covers, ensuring reliable sealing and easy replacement. The cooling system adopts a modular design; the first rotating cover is adjustable to adapt to different installation requirements. The inlet and outlet pipes are integrated within a tube bundle, resulting in a rational layout and reduced space occupation. The liquid pump is conveniently connected to the water tank, facilitating individual maintenance.

A thermally conductive grease composition containing a base oil (A), thermally conductive particles (B), and one or more compounds (C) selected from the group consisting of phosphite esters and phosphite ester salts.

A non-curable thermally conductive grease composition includes: A. 100 parts by mass of an ethylene-α-olefin copolymer with a kinematic viscosity of 10000 mm2 / s or less at 40° C.; and B. 115 to 580 parts by mass of thermally conductive particles with respect to 100 parts by mass of the component A. The thermally conductive particles contain the following: B1. 55 to 350 parts by mass of irregularly-shaped alumina with a median particle size of 0.1 to 1 μm, in which a part or all of the alumina is surface treated with a specific alkoxysilane compound or its partial hydrolysate; B2. 5 to 60 parts by mass of plate-shaped boron nitride with a median particle size of 0.1 to 10 μm; and B3. 55 to 170 parts by mass of aggregated boron nitride with a median particle size of 20 to 70 μm. The B3 / B2 mass ratio is 2 to 20. Thus, the thermally conductive grease composition is less likely to generate low molecular siloxane and has high drop resistance and a low specific gravity.

This utility model relates to the field of heat dissipation aluminum plate technology, and in particular to an embedded heat dissipation aluminum plate structure for electronic devices. It includes a main aluminum plate, inside which are fixed multiple heat dissipation fins arranged in a circular array. Heat conduction pipes are fixed inside the heat dissipation fins. The inner wall of the heat conduction pipes has guide grooves and linearly arranged filling grooves. Multiple linearly arranged conical teeth are fixed inside the guide grooves. An adjustment and distribution component is installed inside the heat conduction pipes. The adjustment and distribution component includes an adjustment plate, with a guide slider fixed to the outer wall of the adjustment plate. A one-way locking tooth is fixed to the front end of the guide slider. The lower surface of the adjustment plate has a grease injection channel and a main delivery channel. This utility model enables uniform distribution of thermal grease, multi-directional filling to avoid local accumulation and air gaps, and solves the problems of poor adhesion and uneven grease injection caused by differences in device thickness. It ensures full contact at the heat dissipation interface and effectively improves heat dissipation efficiency.

This utility model relates to the field of thermal grease technology, and discloses a corrosion-resistant and low-thermal-resistance thermal grease, including a thermally conductive component disposed inside a protective box; two ultra-thin high-thermal-conductivity silicone films are pressed together at their edges to form a closed structure, and a cavity is disposed between the middle of the two ultra-thin high-thermal-conductivity silicone films. Several micropores are evenly distributed in the middle of the ultra-thin high-thermal-conductivity silicone films, and the cavity is filled with thermal grease. The thermal grease of this utility model, with its corrosion resistance and low thermal resistance, precisely matches the amount of thermal grease filled to the area of ​​the ultra-thin high-thermal-conductivity silicone films beforehand. Combined with the micropore extrusion design, it avoids the problem of excessive thermal grease usage seen in traditional application methods, and also prevents the thermal grease from accidentally rubbing onto other areas that do not require heat dissipation, reducing cleaning and maintenance costs, improving accuracy and cleanliness, and allowing for easy installation by simply peeling off the protective film, thus significantly improving assembly efficiency.

This utility model relates to power module installation technology and discloses a power module press-fit sheet and a power module, including a press-fit sheet body (1), which includes a positioning part (2) and a fixing part (3); the positioning part (2) includes a positioning piece (21), and the fixing part (3) includes a first fixing piece (31) and a second fixing piece (32), wherein the first fixing piece (31), the positioning piece (21) and the second positioning piece (21) are integrally formed. The power module press-fit sheet designed in this utility model ensures sufficient installation pressure between the heat sink and the module, reduces the thickness of the thermal grease layer, and to a certain extent enables the metal surface between the power module and the heat sink to have hard contact conditions, thereby greatly improving the heat dissipation performance of the module, and is simple in design and easy to install.

The present invention relates to a composition comprising one or more filler particles and a first treating agent of Formula 1: and a second treating agent of Formula 2: where R, R1, R2, Y, x, and n are defined herein. The composition of the present invention is useful as a thermal grease that can achieve a combination of high thermal conductivities at thermal stability.

A thermally conductive grease composition comprising a base oil (A) and thermally conductive particles (B), wherein the thermally conductive particles (B) comprise aluminum nitride (B1) having an average particle diameter D50 of less than 70 μm and aluminum nitride (B2) having an average particle diameter D50 of 70 μm or more.

The invention belongs to the technical field of medical instruments, in particular to a heating and refrigerating module, and aims to solve the problems of limited cold compress effect and poor heat dissipation effect in the prior art. The module comprises a shell, a semiconductor chilling plate is clamped to an opening in the bottom of the shell, and a copper box is bonded to the top of the semiconductor chilling plate through heat-conducting silicone grease; when the semiconductor chilling plate needs to be refrigerated, the heat dissipation water pump pumps cooling liquid in the water tank into the fin radiator for heat dissipation, and the cooling liquid is guided into the copper box to absorb heat generated by the semiconductor chilling plate. The cooling liquid after heat absorption enters the water tank to realize circulation, so that heat generated by working of the semiconductor chilling plate can be continuously absorbed, bottom refrigeration is prevented from being influenced, the heat dissipation effect is good, the heat dissipation structure can take away low temperature at the top of the semiconductor chilling plate during hot compress, and the hot compress effect is ensured.

The utility model discloses a power turret with high machining precision, which belongs to the technical field of numerical control machine tools and comprises a turret box, radiating grooves are arranged on two sides outside a casing of the turret box, a heat conducting plate is fixedly inlaid on the inner wall of one side inside each radiating groove, and a plurality of contact columns are arranged on the surface of one side, extending into the casing of the turret box, of each heat conducting plate. A heat conduction plate is arranged in the heat dissipation groove, a refrigeration piece is arranged on the side, arranged in the heat dissipation groove, of the heat conduction plate, the heat release end of the refrigeration piece is fixedly connected with a heat dissipation fin through heat conduction silicone grease, and the space between the heat conduction plate and the heat dissipation fin is filled with a heat insulation layer. According to the tool turret box cooling device, the cooling fins are arranged to make direct contact with the interior of the tool turret box, the cooling fins and the cooling fins are matched, heat absorbed by the contact columns is sequentially transmitted into the cooling grooves, finally ventilation and heat dissipation are conducted through the cooling fans in the air inlet and the air outlet, and therefore the purpose of efficient heat dissipation of the interior of the tool turret box is achieved.

This application relates to the field of power metering technology, and in particular to a three-phase adaptive smart meter with an improved heat dissipation structure. The meter includes a meter body, a sealed top cover fixedly mounted on the top of the meter body, and a display screen on one side of the sealed top cover. This application utilizes components such as a heat dissipation shell, heat dissipation cover plate, heat dissipation fins, and thermal grease. Through the thermal grease applied to the overlapping area between the heat dissipation cover plate and the PCB board, and the heat dissipation fins fixedly mounted in the fin mounting grooves of the heat dissipation cover plate, with the heat dissipation grooves of the heat dissipation shell communicating with the bottom cavity of the heat dissipation cover plate, the heat generated by the PCB board during operation can be quickly conducted to the heat dissipation cover plate via the thermal grease. The heat is then transferred to the heat dissipation cover plate, the heat is further amplified by the heat dissipation fins, and the heat is further dissipated through the heat dissipation grooves with the outside air. This achieves the effect of rapidly dissipating the heat generated by the PCB board during operation through a highly efficient heat conduction and convection structure, thus improving the heat dissipation efficiency of the meter body.

This invention discloses a thermally conductive composition that can reduce interfacial thermal resistance, its preparation method, and its application, relating to the field of heat dissipation materials technology. The thermally conductive composition comprises, by weight, the following components: 100 parts ceramic oxide, 5-30 parts magnetic powder, 0.2-4 parts modifier, 0.5-6 parts binder, 0.04-0.3 parts adhesion promoter, 0.1-0.8 parts antistatic agent, 1-3 parts defoamer, and 0.6-2 parts diluent. The thermally conductive composition of this invention can effectively fill nanoscale voids at the interface, significantly reducing thermal resistance. Furthermore, its magnetic adsorption effect enhances its anti-aging properties and long-term stability. It is suitable for thermal interface materials such as thermal grease and thermal gel, meeting the heat dissipation requirements of high-power electronic devices.

This invention relates to the field of miniature thermal protector manufacturing technology, specifically disclosing an intelligent calibration device and method for a multi-channel miniature thermal protector. The device includes a calibration mechanism comprising a transfer component and a calibration component. An auxiliary component is provided on the side wall of the transfer component. The transfer component transfers the miniature thermal protector, conveyed by a vibrating conveyor plate, to the calibration component. The calibration component, in conjunction with the auxiliary component, calibrates the miniature thermal protector. This invention, by applying thermal grease at multiple points after the first contact plate is pressed against the miniature thermal protector, can effectively transfer the heat generated by the first electric heating coil to the miniature thermal protector, further reducing the probability of heat loss affecting the calibration accuracy of the miniature thermal protector. It also avoids the traditional method of first applying thermal grease and then pressing down on the miniature thermal protector, which causes excessive overflow of thermal grease outside the miniature thermal protector, thus facilitating actual calibration and use.

This invention relates to the field of power transmission technology and discloses a device for handling overheating faults in 10 kV distribution line clamps, including a clamp body and a clamp base. The invention embeds a first passive heat dissipation component and a second passive heat dissipation component into a receiving cavity using an embedding groove. The inner walls of the first and second heat dissipation bases are coated with thermal grease, which has excellent thermal conductivity. Due to the high thermal conductivity of the grease, the heat generated by the clamp body can be effectively conducted to the first and second heat dissipation fins. The first and second heat dissipation fins increase the heat dissipation area, allowing heat to dissipate into the surrounding air, effectively reducing the temperature of the clamp body and minimizing the risk of faults caused by overheating. The reduced temperature of the clamp body helps maintain its good electrical performance, reduces energy loss at the clamp location, improves power transmission efficiency, and lowers power transmission costs.